Abstract: A robotic device has a base and at least one finger having at least two links that are connected in series on rotary joints with at least two degrees of freedom. A brushless motor and an associated controller are located at each joint to produce a rotational movement of a link. Wires for electrical power and communication serially connect the controllers in a distributed control network. A network operating controller coordinates the operation of the network, including power distribution. At least one, but more typically two to five, wires interconnect all the controllers through one or more joints. Motor sensors and external world sensors monitor operating parameters of the robotic hand. The electrical signal output of the sensors can be input anywhere on the distributed control network. V-grooves on the robotic hand locate objects precisely and assist in gripping. The hand is sealed, immersible and has electrical connections through the rotary joints for anodizing in a single dunk without masking.

Abstract: Several techniques are described for reducing or mitigating the formation of seams and/or voids in electroplating the interior regions of microscopic recessed features. Cathodic polarization is used to mitigate the deleterious effects of introducing a substrate plated with a seed layer into an electroplating solution. Also described are diffusion-controlled electroplating techniques to provide for bottom-up filling of trenches and vias, avoiding thereby sidewalls growing together to create seams/voids. A preliminary plating step is also described that plates a thin film of conductor on the interior surfaces of features leading to adequate electrical conductivity to the feature bottom, facilitating bottom-up filling.

Abstract: The present invention provides a method of manufacturing a magnetic recording medium having high recording density. The magnetic recording medium manufacturing method of the present invention is directed to a manufacturing method including: disposing at least a silicon layer on a substrate; disposing an uneven structure including regularly arranged projections on the silicon layer; disposing magnetic material on the upper surfaces of the projections and within recessed parts of the uneven structure; and allowing the magnetic material disposed within each recessed part to be changed into silicon compound by heat treatment.

Abstract: Electrochemical cells including a casing or cup for direct electrical contact with a negative electrode or counter electrode and serving as the current collector for the electrode. The casing includes a substrate having a plated coating of an alloy including copper, tin and zinc, the coating having a composition gradient between the substrate and the external surface of the coating wherein the copper content is greater adjacent the substrate than at the external surface of the coating and the tin content is greater at the external surface of the coating than adjacent the substrate. Methods for forming a coated casing and an electrochemical cell including a coated casing are disclosed, preferably including providing an electrode casing with a coating utilizing variable current density plating that reduces discoloration of a surface exposed to the ambient atmosphere.

Abstract: A semiconductor workpiece holder used in electroplating systems for plating metal layers onto a semiconductor workpieces, and is of particular advantage in connection with plating copper onto semiconductor materials. The workpiece holder includes electrode assemblies which have a contact part which connects to a distal end of an electrode shaft and bears against the workpiece and conducts current therebetween. The contact part is preferably made from a corrosion resistant material, such as platinum. The electrode assembly also preferably includes a dielectric layer which covers the distal end of the electrode shaft and seals against the contact part to prevent plating liquid from corroding the joint between these parts.

Abstract: A method for producing electro- or electroless-deposited-film, in which the crystal orientation of the film is controlled to provide improved product properties. A paramagnetic material or diamagnetic material in its electrolytic-state is deposited on a substrate by an electro- or electroless-deposition process. A magnetic field having an intensity at least on the order of 7 T is applied in a predetermined direction, so as to perform the deposition in environment added with the magnetic field. A porous plate is preferably arranged adjacent to the substrate, for suppressing flow of an electrolytic liquid that may occur during the application of the magnetic field.

Abstract: An apparatus for cleaning a gas sensor and a method therefor are disclosed. A high voltage is supplied to a heat generating body of the gas sensor for a certain period of time to generate a large amount of heat within a short period of time so as to remove the moisture or miscellaneous gases absorbed into on the surface of the gas sensor, thereby stabilizing the characteristics of the gas sensor. The apparatus includes: a power supply section for receiving an ac voltage from a commercial ac power source to convert it into a rated voltage and an excessive voltage exceeding the rated voltage; and a switching section for supplying the rated voltage to the gas sensor after supplying the excessive voltage of the power supply section to a heat generating body of a gas sensor for a certain period of time.

Abstract: The process of electroless plating of polymers containing units derived from at least one member of the group consisting of acrylonitrile, butadiene and styrene, is carried out in an environment free of chromium ions, by the sequential steps of roughening and activating the surface of the polymer by contacting the same with an aqueous solution of a concentrated sulfur acid, of concentrated nitric acid or of concentrated phosphoric acid, in the presence of noble metal ion and an oxidant selected from the group consisting of nitric acid, hydrogen peroxide and persulfates. This is followed by an aqueous suspension of Pd.sup.0 and then by the conventional chemical metallization.

Abstract: A process for the passivation of the surface of certain semiconductor materials whereby there is formed a surface film. A mercury-cadmium-telluride (HgCdTe) semiconductor may be subjected to surface anodization in a bath comprising a fluoride resulting in a fluorine-containing surface film. The composition of the protective film can be varied according to the bath used in the electrochemical process for the production of the surface layer.The invention further relates to semiconductors of the mercury cadmium telluride type passivated by the application of such surface films.

Abstract: Disclosed is a process for the corrosion protection of a neodymium-iron-boron group sintered magnet, which comprises the steps of: immersing the neodymium-iron-boron group sintered magnet in oxidizing acid to activate the surface thereof; plating the magnet with nickel having internal stress of not more than 1000 kgf/cm.sup.2 ; and applying cationic electrodeposition coating thereto.

Abstract: An anodizing bath for aluminum alloys is disclosed; the aqueous bath solution contains sulfuric acid, citric acid, urea, and ammoniated colloidal silica; the latter three components being a complexing agent, a leveling agent and a stabilizing agent, respectively, so as to result in an oxide layer having and amorphous structure which eliminates the necessity of sealing thick anodic coating.

Abstract: Both surfaces of a uniformly and completely textured polyimide sheet are coated with a layer of electroless nickel or cobalt and a subsequent layer of electrolytically applied copper yielding an adhesiveless laminate useful in the production of electronic circuitry. The copper and nickel or cobalt layers are strongly bonded to the textured polyimide sheet to the extent that the laminate exceeds bond strength requirements as measured by current standard peel strength tests of the Institute for Interconnecting and Packaging Electronic Circuits (IPC) for both initial and post solder float adhesion, as well as a modification of IPC test 2.4.9 method E for resistance to thermal cycling.

Abstract: A process for filling cavities in a flat surface on a substrate by metal deposition which includes depositing a film of metal onto the flat surface and cavities in a substantially perpendicular direction to the surface, and simultaneously re-sputtering and deposited film on the flat surface by ion beam milling at an angle to the surface of the substrate for achieving the deposition of metal into the cavities and filling the cavities without leaving any film on the flat surface.

Abstract: An electrolytic cell of a liquid disinfection device has a housing with an inlet and outlet, and electrodes arranged in transverse planes and surrounding a central supporting element through which electrical leads can be provided. The electrodes can be concentric annular electrodes supported on radial supports, or can be unitary, being punched from sheets with gaps and webs between them.

Abstract: A method for electrolytic coloring of anodized aluminum or aluminum alloys in an electrolyte containing metal salts is disclosed, in which the aluminum or aluminum alloy is preliminarily treated in an electrolyte by applying a voltage of substantially positive voltage wave form and, thereafter, the electrolytic coloring is carried out in the same electrolyte by applying an asymmetrical alternating current voltage that the positive voltage is smaller than the negative voltage.

Abstract: A method for producing quasi-crystalline films by direct vapor deposition through sputtering is provided. The method is applicable to all alloys which can be converted to quasi-crystalline structure by melt spinning.

Abstract: An oxidized film is formed on the surface of Mg or an Mg alloy, and a thermosetting resin film is formed on the oxidized film. A conductive film is further formed on the thermosetting film. The surface film of the Mg or Mg alloy thus surface-treated has a strong adhesion to the Mg or Mg alloy. The surface-treated Mg or Mg alloy has an excellent corrosion resistance, an excellent heat shock resistance, and a high surface conductivity.

Abstract: Separation of dispersed liquid contaminant, for example removal of water droplets from oil, is achieved by introducing free charge into the mixture by means of charge injector (1) and discharging the charged mixture through a gas or vapor gap into a separation vessel (2) where the charged mixture comes into contact with a bed of beads (6) (FIG. 1) or other collector surfaces. The introduced charge causes both an electric field to be induced in the separation vessel (2) and the dispersed contaminant to acquire charge, and this results in migration of the charged contaminant. The beads are porous so that they soak up contaminant which can then encourage growth of islands of contaminant on the surface of the beads to a sufficient size that they can be removed from the mixture by gravity separation or other separation techniques. In another embodiment, (FIG.

Abstract: Separation of dispersed phase (e.g., solid, gel, liquid or gas contiminant) from a continuous fluid background phase (liquid or gas) is achieved by injecting free charge into the phase mixture, which both induces an electric field within the mixture and effects charging of the dispersed phase. The interaction between the induced electric field and the charged contaminants causes migration of the contaminant and collection on preferably densely packed collector surfaces within the phase mixture. The dense packing reduces the migration path length and therefore increases the contaminant separation effectiveness. The collector surfaces can be provided by a bed of beads.

Abstract: A system for in situ plasma etch removal of deposition products that accumulate during device processing. An r.f. electrode is configured to removably fit coaxially within the chamber, a quartz tube. A chamber heater shield functions also as an r.f. return. Cleaning gas is introduced into the chamber and r.f. power supplied to the electrodes to initiate an r.f. plasma which etch cleans formations on the quartz tube walls. The deposition equipment is cleaned without the need for disassembly.