Patents Examined by William Leader
  • Patent number: 8404096
    Abstract: The invention relates to methods of preparation of highly sensitive potentiometric sensors with an electroconductive polymer film as a sensing element.
    Type: Grant
    Filed: August 23, 2002
    Date of Patent: March 26, 2013
    Assignee: Sensortec Limited
    Inventors: Duncan Ross Purvis, Olga Leonardova, Dmitri Alexandrovich Farmakovski, Vladimir Rurikovich Tcherkassov
  • Patent number: 8372258
    Abstract: The working electrode in the flow channel of a flow-through electrolytic detection cell is preconditioned by flowing a preconditioning electroplating solution with preconditioner species through the flow channel while applying a negative potential. Flow of liquid through the flow channel is rapidly switched from preconditioning solution to a target solution containing an organic target solute to be measured. The transient response of the system resulting from exposure of the working electrode to organic target solute is detected by measuring current density during an initial transient time period. An unknown concentration of target solute is determined by comparing the transient response with one or more transient responses characteristic of known concentrations. A preferred measuring system is operable to switch flow from preconditioning solution to target solution in about 200 milliseconds or less.
    Type: Grant
    Filed: August 3, 2009
    Date of Patent: February 12, 2013
    Assignee: Novellus Systems, Inc.
    Inventors: Mark J. Willey, Lian Guo, Steven T. Mayer
  • Patent number: 8357283
    Abstract: An electric separating apparatus has a separating tank and an electrical control. The separating tank has at least one first electrode panel, a second electrode panel, an upper separating region and a lower separating region. The electrode panels are vertically mounted in the separating tank to form the separating regions. The electrical control is electrically connected to the separating tank and has a transformer, a high-power resistor, a first A/C transformer, a second A/C transformer and a control unit. The transformer is electrically connected to an A/C source and the electrode panels. The high-power resistor is electrically connected to the transformer and the at least one first electrode panel in series. The A/C transformers are respectively connected to the high-power resistor and the electrode panels. The control unit is electrically connected to the A/C transformers to determine an electrical impedance of a liquid mixture in the tank.
    Type: Grant
    Filed: September 8, 2009
    Date of Patent: January 22, 2013
    Inventor: Tze-Ming Kao
  • Patent number: 8337689
    Abstract: Disclosed herein is a composition for plasma electrolytic oxidation (PEO) treatment of magnesium alloy products, which contains a sodium hydroxide (NaOH) solution as a main component, the composition comprising, based on the weight of sodium hydroxide contained in the sodium hydroxide solution: 1-20 wt % of sodium fluoride (NaF); 1-15 wt % of trisodium phosphate (Na3PO4); 1-10 wt % of sodium pyrophosphate (Na4P2O7); 1-20 wt % of aluminum hydroxide (Al(OH)3); 1-20 wt % of sodium fluorosilicate (Na2SiF6); 1-10 wt % of potassium hydroxide (KOH); 1-15 wt % of potassium acetate (C2H3O2K); and 1-10 wt % of rare earth metal powder. The disclosed composition can form a firm, dense and uniform oxide film on the surface of a magnesium alloy product.
    Type: Grant
    Filed: August 13, 2010
    Date of Patent: December 25, 2012
    Assignee: Wiscohitec Co., Ltd.
    Inventors: Gi Yeol Yun, Jae In You, Jae Yong You, Jae Gon Yun, Jin Hie Kim, Chang Hun Park, Duck Hee Kim, Mi Kyeong Lee
  • Patent number: 8329006
    Abstract: An apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow dampener member and other measures to provide a more uniform current distribution and a more uniform metal deposit distribution as reflected in a coefficient of variability that is lower than conventional processes.
    Type: Grant
    Filed: April 28, 2009
    Date of Patent: December 11, 2012
    Assignee: Faraday Technology, Inc.
    Inventors: Lawrence E. Gebhart, Jenny J. Sun, Phillip O. Miller, E. Jennings Taylor
  • Patent number: 8298384
    Abstract: A method and apparatus for plating parts like lug nuts or other metal parts that have both an easily plated outside surface as well as a recessed cavity. The invention works in combination with a standard multi-station plating process. Also, a method and apparatus for preventing areas of electrode contact on a part from being non-plated. The present invention drains and plates a part containing a cavity by moving the part from a position where the cavity is facing around 45 degrees down to a position where the cavity is facing around 45 degrees up and then back down at various times during the process. The moving is generally initiated when the rack moving along a track above the fluid tanks encounters a roller. The roller causes a depression bar to activate a mechanical mechanism that shifts the position of the part. Other embodiments of the present invention can also rotate the part on an electrode finger as a roller on the track is encountered by the rack to avoid non-plated regions on the part.
    Type: Grant
    Filed: January 29, 2009
    Date of Patent: October 30, 2012
    Assignee: Century Plating Co.
    Inventors: George Koltse, Victor LaPorta
  • Patent number: 8282807
    Abstract: In a method of manufacturing a metal member, a metal material containing aluminum as a main component is anodized in an anodization solution having a pH of 4 to 10 and containing a nonaqueous solvent having a dielectric constant smaller than that of water and capable of dissolving water, thereby forming a nonporous amorphous aluminum oxide passivation film on a surface of the metal member. The method includes a step of controlling the viscosity of the anodization solution. In the step of controlling the viscosity, the viscosity of the anodization solution is lowered by elevating the temperature of the anodization solution above the room temperature or by adding to the anodization solution a substance having a dielectric constant smaller than that of water and a viscosity lower than that of the nonaqueous solvent.
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: October 9, 2012
    Assignees: National University Corporation Tohoku University, Mitsubishi Chemical Corporation
    Inventors: Tadahiro Ohmi, Minoru Tahara, Yasuhiro Kawase
  • Patent number: 8268135
    Abstract: An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a polishing pad and a platen. The platen is formed of conductive material, is disposed proximate to the polishing pad and is configured to have a negative charge during at least a portion of a planarization process. At least one electrical conductor is positioned within the platen. The electrical conductor has a first end connected to a power source. A workpiece carrier is configured to carry a workpiece and press the workpiece against the polishing pad. The power source applies a positive charge to the workpiece via the electrical conductor so that an electric potential difference between the metallized surface of the workpiece and the platen is created to remove at least a portion of the metallized surface from the workpiece.
    Type: Grant
    Filed: November 16, 2005
    Date of Patent: September 18, 2012
    Assignee: Novellus Systems, Inc.
    Inventors: Ismail Emesh, Saket Chadda, Nikolay N Korovin, Brian L Mueller
  • Patent number: 8252165
    Abstract: This invention relates to the electrochemical deposition of carbon nanotubes (“CNTs”) on a substrate using an electrochemical cell. A dispersion of a complex of CNTs and an anionic polymer is neutralized and thereby caused to deposit on the anode plate of the cell.
    Type: Grant
    Filed: August 22, 2008
    Date of Patent: August 28, 2012
    Assignee: E I du Pont de Nemours and Company
    Inventors: Ming Zheng, Lap-Tak Andrew Cheng
  • Patent number: 8226804
    Abstract: A method and apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow dampener member and other measures to provide a more uniform current distribution and a more uniform metal deposit distribution as reflected in a coefficient of variability that is lower than conventional processes.
    Type: Grant
    Filed: April 14, 2011
    Date of Patent: July 24, 2012
    Assignees: The United States of America as represented by the Secretary of the Air Force, Faraday Technology, Inc.
    Inventors: Lawrence E. Gebhart, E. Jennings Taylor
  • Patent number: 8187447
    Abstract: Electrochemical methods for manufacturing a zinc ferrite (ZnFe2O4) thin film include preparing an electrodeposition solution and forming the zinc ferrite thin film on a conductive substrate under suitable conditions. The electrodeposition solution includes about 10?2 M to about 10?1 M zinc nitrate aqueous solution and about 10?3 M to about 10?2 M ferric nitrate aqueous solution.
    Type: Grant
    Filed: May 29, 2009
    Date of Patent: May 29, 2012
    Assignee: Taiwan Textile Research Institute
    Inventor: Wen-Hsien Ho
  • Patent number: 8168058
    Abstract: An electrochemical method for manufacturing a lithium phosphate (Li3PO4) thin film includes preparing an electroplating solution and forming the lithium phosphate thin film on a conductive substrate under suitable conditions. The electroplating bath includes about 10?2 M to about 10?1 M lithium ion and about 10?2 M to about 1 M monohydrogen phosphate ion (HPO42?) or dihydrogen phosphate ion (H2PO4?).
    Type: Grant
    Filed: December 30, 2008
    Date of Patent: May 1, 2012
    Assignee: Taiwan Textile Research Institute
    Inventors: Wen-Hsien Ho, Shiow-Kang Yen, Han-Chang Liu, Ching Fei Li
  • Patent number: 8168045
    Abstract: An apparatus for plating a magnetic film on a substrate includes: a track including a plurality of stopping points along the track; a permanent magnet placed on the track such that the permanent magnet can be moved along the track towards and away from the stopping points; at least one plating tank positioned on the stopping point; and a removable high permeability iron flux concentrator inserted into gaps between the substrate and inside walls of the plating tank, substantially surrounding the substrate and extending around and under the substrate.
    Type: Grant
    Filed: May 20, 2011
    Date of Patent: May 1, 2012
    Assignee: International Business Corporation
    Inventors: Matteo Flotta, Lubomyr T. Romanikiw, Xiaoyan Shao, Steven Erik Steen, Bucknell Chapman Webb
  • Patent number: 8163157
    Abstract: In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer of a fuel cell so as to be capable of stably producing high purity hydrogen gas.
    Type: Grant
    Filed: July 7, 2010
    Date of Patent: April 24, 2012
    Assignee: Dai Nippon Insatsu Kabushiki Kaisha
    Inventors: Hiroshi Yagi, Takanori Maeda, Yoshinori Oota, Yasuhiro Uchida
  • Patent number: 8163156
    Abstract: The inventive method and device for vacuum-compression micro plasma oxidation relate to electrochemical processing of metal, in particular to micro plasma treatment in electrolyte solutions. The aim of said invention is to develop a method for obtaining qualitatively homogeneous coatings by micro-plasma oxidation on large-sized parts, including irregular shaped parts, or simultaneously on a great number of small parts. The second aim of the invention is to design a device for processing parts, having an extended surface area, by using low-power supplies. The inventive method for vacuum-compression micro-plasma oxidation of parts consists in dipping a processable part into an electrolyte solution pre-filled in a sealed container, in generating micro-plasma discharges on the surface of said part and, subsequently, in forming a coating, wherein the micro-plasma discharges are formed in low-pressure conditions above the electrolyte solution.
    Type: Grant
    Filed: December 5, 2008
    Date of Patent: April 24, 2012
    Assignees: Tomsk State University (TSU), Sibspark, Limited Liability Company
    Inventors: Anatoli Ivanovich Mamaev, Vera Aleksandrovna Mamaeva, Pavel Igorevich Butyagin
  • Patent number: 8118988
    Abstract: A simple titration method involving a single copper ion titrant detected by a copper ion specific electrode provides the concentrations of both copper ions and bath complexing agent (ethylene diamine, for example) in alkaline copper electroplating baths of the type used to deposit or thicken copper seed layers on silicon wafers. Standard addition of an excess of a strong complexing agent (EDTA, for example) and back-titration with the copper ion titrant yields the bath copper ion concentration, and continued titration to a second endpoint, preferably after addition of hydroxide to adjust the pH of the analysis solution, yields the total concentration of bath complexing agent. Based on these analyzes, the concentration of free bath complexing agent may be calculated. The method also provides direct determination of the free bath complexing agent concentration via standard addition of excess bath complexing agent to a sample of the plating bath and titration with the copper ion titrant.
    Type: Grant
    Filed: January 31, 2008
    Date of Patent: February 21, 2012
    Assignee: ECI Technology, Inc.
    Inventors: Eugene Shalyt, Victor Ososkov, Michael Pavlov, Peter Bratin
  • Patent number: 8114262
    Abstract: The invention is directed to an assembly for electroplating comprising an electroplating bath and non-conductive plates. The invention is also directed to an assembly for electroplating comprising an electroplating bath, elements with electrically adjustable resistance, and ampere-hour meters. The invention is further directed to methods for monitoring, controlling and adjusting the thickness distribution of an electroplated material on an object. The object can be of any shape as long as it can electrically charged.
    Type: Grant
    Filed: January 10, 2007
    Date of Patent: February 14, 2012
    Assignee: SiPix Imaging, Inc.
    Inventors: Gary Yih-Ming Kang, Yi-Shung Chaug
  • Patent number: 8110086
    Abstract: A method of manufacturing a substrate processing chamber component comprises forming a chamber component comprising a metal alloy comprising yttrium and aluminum, and anodizing an exposed surface of the metal alloy.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: February 7, 2012
    Assignee: Applied Materials, Inc.
    Inventors: Nianci Han, Li Xu, Hong Shih
  • Patent number: 8097142
    Abstract: The present invention provides a method of simultaneously removing uranium and transuranics from metallic nuclear fuel in an electrorefiner. In the method, a potential difference is established between an anode basket containing the fuel and a solid cathode of the electrorefiner, thereby creating a diffusion layer of uranium and transuranic ions at the solid cathode, a first current density at the anode basket, and a second current density at the solid cathode. The ratio of anode basket area to solid cathode area is selected based on the total concentration of uranium and transuranic metals in a molten halide electrolyte in the electrorefiner and the effective thickness of the diffusion layer at the solid cathode, such that the established first and second current densities result in both codeposition of uranium and transuranic metals on the solid cathode and oxidation of the metallic nuclear fuel in the anode basket.
    Type: Grant
    Filed: March 2, 2009
    Date of Patent: January 17, 2012
    Assignee: Uchicago Argonne, LLC.
    Inventors: James L. Willit, Mark A. Williamson
  • Patent number: 8057657
    Abstract: A method for the biomimetic treatment of an osteointegrative interface on a substrate of biocompatible metal of titanium, tantalum, or their alloys, includes performing a first anodic spark deposition (ASD) treatment of the osteointegrative interface in a calcium glycerophosphate solution, performing a second ASD anodic deposition treatment of the osteointegrative interface in a calcium hydroxide solution and performing an immersion of the osteointegrative interface in a potassium or sodium hydroxide solution.
    Type: Grant
    Filed: May 6, 2010
    Date of Patent: November 15, 2011
    Assignee: Politecnico di Milano
    Inventors: Alberto Cigada, Roberto Chiesa, Enrico Sandrini, Gianni Rondelli, Matteo Santin