Abstract: An embodiment of the present invention discloses a heat dissipation structure and an electronic device including the heat dissipation structure, the heat dissipation structure comprising: at least one heat dissipation plate; at least one rigid plate which forms an opening in one area and is coupled to the upper portion of the at least one heat dissipation plate to support durability of the at least one heat dissipation plate; at least one heat pipe of which at least a portion is accommodated in the opening formed by the at least one rigid plate and is coupled to an area of the at least one heat dissipation plate that faces the at least one heat pipe; and at least one fixing tool which supports the fixing between the at least one heat dissipation plate and the at least one rigid plate. In addition, various embodiments identified through the specification are possible.

Abstract: Electronic equipment (10) has multiple cooling fans (15) for sending air to a heat sink (30). The multiple cooling fans (15) generate airflow (Fh) passing through the heat sink (30) from a first side (H1) to a second side (H2) thereof. The heat sink (30) is arranged obliquely to a crosswise direction and a longitudinal direction of the electronic equipment (10). A sheathing member (40) has an air inlet opening (41i) formed obliquely to the crosswise and longitudinal directions along the first side (H1) of the heat sink (30).

Abstract: A modular computing system for a data center includes one or more data center modules including rack computer systems. An electrical module is coupled to the data center modules and provides electrical power to computer systems in the data center modules. The data center modules do not include any internal active cooling systems and cannot be coupled with any external active cooling systems. A data center module directs ambient air to flow into intake air plenums extending along intake sides of the rows of racks, through the rows of racks into exhaust plenums extending along exhaust sides of the rows of racks, and out into the ambient environment to cool computer systems in the racks. Directed airflow can be lateral, vertical, at least partially driven by air buoyancy gradients, at least partially induced by air moving devices internal to computer systems in the rows of racks, thereof, etc.

Abstract: The present invention is a modular, energy efficient structure for housing racks of computers specifically designed for mining Bitcoin assets. The fundamental principal towards an optimized mining facility design is to decrease electricity consumption as well as effective construction budget management, ensuring only appropriate business expenditures. The side benefits including improved stability of the facility computer network and electricity supply. The design concept is carried out through a cool/hot air segregation process, which results in controllable internal facilities temperatures, dust filtration and energy savings.

Abstract: Disclosed is a power conversion device comprising: a case; a switching unit comprising a plurality of switches which are disposed on one side of the case; a transformer disposed on one side of the case; and a clip for fixing the plurality of switches. The clip comprises: a body part which is fixed to the case; and elastic parts which extend from the body part and are for pressing the plurality of switches to the case. The body part comprises a plurality of first through holes into which screws are coupled. And the first through holes are disposed between two adjacent elastic parts.

Abstract: A power conversion device that supplies power to a load using a module incorporating a semiconductor element is such that a sealing wall that holds a sealing resin is provided on a metal case that cools the module, a feedback current channel, which is one wiring member forming a current channel that passes into and out of the semiconductor element, is the metal case, and another wiring member is disposed in proximity to and parallel with the sealing wall of the metal case.

Abstract: A circuit assembly includes a circuit board on which a coil is mounted, a heat sink, and a heat spreading plate that is separate from this heat sink. A first insulating adhesive layer is interposed between the circuit board and the heat spreading plate, and the heat spreading plate and the heat sink are fixed by a first fixing hole for a heat sink and a bolt. Accordingly, warping of the circuit board is suppressed.

Abstract: A water cooling module includes a flow-guiding main body and a pump set. The flow-guiding main body includes a first inlet, a first outlet and a flow-guiding passage set. The flow-guiding passage set includes a plurality of flow-guiding passages, and the first inlet and the first outlet are respectively communicable with one of the flow-guiding passages. The pump set includes a first pump having a first water inlet and a first water outlet, and a second pump having a second water inlet and a second water outlet. The first water inlet and the first water outlet are respectively communicable with one of the flow-guiding passages; the second water inlet and the second water outlet are also respectively communicable with one of the flow-guiding passages. The flow-guiding main body replaces rubber pipes to guide working fluid without the problem of oxidized and leaked pipes while providing prolonged service life.

Abstract: Vapor chamber and impeller apparatus and systems for cooling information handling systems and which may be implemented to enable increase in system level airflow and to achieve increased cooling surface for cooling heat generating or heat source components of such systems. In one example, an integrated rotating radial impeller may be mounted to and supported by the vapor chamber, and the vapor chamber apparatus may be coupled to one or more heat pipe extensions and corresponding fin stacks.

Abstract: The present invention includes a lateral support member for a server computer constructed to permit controlled airflow. The lateral support member permits a new rack stand, facility, and complex of computer/member. Obstructers control airflow manually or automatically.

Abstract: A three-dimensional integrated circuit cooling system is provided for removing heat from a three-dimensional integrated circuit. Plural fluid microchannels are formed among plural middle chip layers and a main chip layer of the three-dimensional integrated circuit. The three-dimensional integrated circuit cooling system comprises a base and a fluid pump. The base has an introduction opening, a discharge opening and a fluid passage. The fluid pump is fixed on the base and seals the edge of the introduction opening. When the fluid pump is enabled, an ambient fluid is driven by the fluid pump, introduced into the fluid passage through the introduction opening, and discharged through the discharge opening. The discharged fluid passes along every fluid microchannel of the three-dimensional integrated circuit as flowing through the plural middle chip layers and the main chip layer so as to perform heat exchange therewith.

Abstract: An electrical load center for residential and commercial buildings includes an enclosure, a cover assembly, and a panelboard. The panelboard includes an insulated base, first and second bus bars, each of the first and second bus bars having an elongated main member, a plurality of connecting members, each of which is integrally formed from an edge of the main member, and a plurality of conducting members integrally formed from each of the connecting members. The panelboard further includes at least one neutral bar. The neutral bar is preferably I-shaped and includes a generally vertical main body, and transverse upper and lower members. The transverse upper member is preferably thicker than the transverse lower member and includes an outward taper from a top surface to a bottom of the transverse upper member to provide a greater contact surface area.

Abstract: A heat dissipation system includes a motherboard, at least two chips, at least two heat sinks and at least two air guide covers. Every two chips of the at least two chips constitute a chipset, the chips in each chipset are installed on the motherboard in sequence along an airflow direction, each of the at least heat sinks is installed on a surface of the chip corresponding to the heat sink, and every two air guide covers of the at least two air guide covers constitute an air guide group. In the air guide group, a first air guide cover is arranged on a first side of a first chip, and a second air guide cover is arranged on a second side of a second chip. A heat dissipation method based on the system is also provided. The solution ensures a relatively uniform heat dissipation between the chips.

Abstract: Provided is an electronic apparatus that makes it possible to improve a heat transfer property from a heat generating element to a heat storage material. The electronic apparatus is provided with a heat generating element and a heat storage device for storing heat generated by the heat generating element. The heat storage device includes a reaction chamber containing a heat storage material for absorbing the heat generated by the heat generating element. The reaction chamber is defined by a first surface, a second surface opposed to the first surface, and a plurality of side surfaces connecting the first surface with the second surface. In the reaction chamber, a thermal conductivity of a peripheral part is smaller than a thermal conductivity of a central part of the reaction chamber.

Abstract: A power supply device 1 includes a main circuit board 20, a power component 22 connected to the main circuit board 20, a filter component 24 connected to the main circuit board 20, and a casing 10 which houses the main circuit board 20, the power component 22, and the filter component 24. The casing 10 includes a base plate 11 which includes a flat surface 11a in which a fin 14 for heat dissipation is provided on a bottom-surface side, and a protruding part 15 which protrudes from the flat surface toward the fin. The power component 22 and the main circuit board 20 are placed on the flat surface, and the filter component 24 is housed in the protruding part 15.

Abstract: A circuit breaker arrangement includes a housing, a contact seated in the housing, and a lead in electrical communication with the at least one contact and disposed outside the housing. The circuit breaker arrangement includes a heat sink in thermal communication with the lead to transfer heat between the contact and the lead.

Abstract: An immersion cooled electronics arrangement includes a housing containing a coolant, an electronic device submerged within the housing and in thermal communication with the coolant, and a variable volume body. The variable volume body is disposed within the housing. An actuator is operatively connected to the variable volume body and is arranged to displace coolant within the housing.

Abstract: A switch includes a switch chassis that houses a heat producing component. A plurality of side walls are located on the switch chassis and define a chassis perimeter. A top wall extends between the plurality of side walls and defines a top wall perimeter vent adjacent the chassis perimeter. A bottom wall extends between the plurality of side walls, is located opposite the switch chassis from the top wall, and defines a bottom wall perimeter vent adjacent the chassis perimeter. A plurality of feet are located on the bottom wall and provide an air gap between the switch chassis and a support surface when the plurality of feet engage the support surface. In response to the heat producing component generating heat, fresh air is drawn in through the air gap and the bottom wall perimeter vent, and heated air flows through the top wall perimeter vent.

Abstract: Liquid submersion cooling systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool an array of electronic devices. In some embodiments described herein, rather than using pump pressure to return the cooling liquid back to a cooling liquid reservoir, gravity can be used to return the cooling liquid to a reservoir via a cooling liquid gravity return manifold, and a pump can only be used on the liquid supply side to deliver the cooling liquid to each electronic device.

Abstract: A display apparatus is provided. The display apparatus includes a display which is curved such that opposite lateral ends thereof protrude forward relative to a central portion thereof. A support frame having a lower end supported on a horizontal surface and allowing the display to be disposed inside thereof is provided; wherein the support frame is curved such that opposite lateral ends thereof protrude forward relative to the central portion thereof.