Abstract: A ganged shielding cage assembly include a plurality of passageways that allows modules to be inserted into the assembly. Walls between the passageways have a heat transfer passages that extends between the front and back ends and allows for coolant to flow through the assembly. Because of the dimensions, heat can be transferred from an inserted module to the walls and then to the coolant flowing through the heat transfer passages.

Abstract: The description relates to devices, such as computing devices. One example can include a shielded and cooled circuit board assembly including a biasing sub-assembly that can bias a heat generating component and a thermal module together. The biasing sub-assembly can also define a portion of a Faraday cage around the heat generating component.

Abstract: A display device according to one embodiment of the present invention includes a display module, and a heat dissipation unit which is coupled to a rear side of the display module. The heat dissipation unit includes a core part including a plurality of hollow polygonal columns extending in a front/back direction, a front sheet which is coupled to a front portion of the core part, and a rear sheet which is coupled to a rear portion of the core part. The core part has a thickness of about 40% to about 60% in the front/back direction with respect to a total thickness of the heat dissipation unit in the front/back direction.

Abstract: A water-cooling heat dissipating system includes a pump and a water-cooling head. The water-cooling head includes a base, a first chamber and a second chamber. The base is in contact with an electronic component. The first chamber and the second chamber are located over the base and separated from each other. The first chamber includes a first inlet and a first outlet. The first inlet is in fluid communication with the pump. The second chamber includes a second inlet and a second outlet. The second inlet is fluid communication with the first outlet. The liquid continuously flows through the first chamber and the second chamber. The heat from the electronic component is transferred to the liquid within the first chamber and the second chamber through the base, and released through the first outlet and the second outlet.

Abstract: A system including a chassis and a hardware module bay disposed in a front portion of the chassis. The hardware module bay is configured to accommodate one or more horizontally oriented hardware modules. The one or more horizontally oriented hardware module are slidably insertable into the hardware module bay. The system further includes a main printed circuit board (PCB) that includes a chipset for communication with a hardware module inserted into the hardware module bay and a midplane disposed between the main PCB and the hardware module bay. The midplane is configured to electrically interface the hardware module inserted into the hardware module bay with the main PCB, upon insertion of the at least one horizontally oriented hardware module.

Abstract: An electronic device, immersed in a coolant filled in a cooling apparatus, and directly cooled, is configured to be housed in housing parts of the cooling apparatus, and includes a metal board held with board retainers disposed in the housing part, and substrate groups attached to a first surface of the metal board and a second surface opposite the first surface. The substrate group includes first circuit boards, each including sockets for mounting processors and main memories on one surface of a substrate, and a component for interconnecting the processors, a second circuit board including a mother board component which includes a chipset for controlling the main memory, and a flow channel formed in a gap between a surface opposite the one surface of the first circuit boards, and one surface of the second circuit board, which faces the surface opposite the one surface of the first circuit boards.

Abstract: A data center system includes an infrastructure unit including a public area and a bridge area and at least one computer room. The computer room is disposed along an extending direction of the bridge area, and a length of the bridge area is matched with a length of computer rooms arranged along the bridge area, so that a number of computer rooms may be increased according to the needs. The computer room includes a plurality of layers of data centers stacked on each other. Cold passage areas and hot passage areas of two neighboring layers of data centers form a cold air passage and a hot air passage so that cold air produced by a cooling module may be directed to each data center, and hot air in each data center may be directed to the cooling module to enable devices in each data center to operate under appropriate temperature.

Abstract: The present invention provides a liquid cooling heat sink device for cooling a heat source. The liquid cooling heat sink device includes a heat conduction module, a liquid supply module, and a liquid guiding module. The heat conduction module includes a vapor chamber and at least one heat conducting column. The vapor chamber has at least one space and one side of the vapor chamber contacts the heat source. The heat conducting column is mounted on one side of the vapor chamber, and the side of the vapor chamber is distal from the heat source. The liquid supply module is mounted on one side of the vapor chamber and has a casing and a pump. The casing has a liquid entrance terminal and a liquid exit terminal out of the casing. The liquid guiding module is mounted on one side of the vapor chamber and a receiving space is formed between the vapor chamber and the liquid guiding module.

Abstract: A semiconductor package includes a processor die (e.g., an SoC) and one or more memory die (e.g., DRAM) coupled to a ball grid array (BGA) substrate. The processor die and the memory die are coupled to opposite sides of the BGA substrate using terminals (e.g., solder balls). The package may be coupled to a printed circuit board (PCB) using one or more terminals positioned around the perimeter of the processor die. The PCB may include a recess with at least part of the processor die being positioned in the recess. Positioning at least part of the processor die in the recess reduces the overall height of the semiconductor package assembly. A voltage regulator may also be coupled to the BGA substrate on the same side as the processor die with at least part of the voltage regulator being positioned in the recess a few millimeters from the processor die.

Abstract: Devices and systems for dissipating heat generated from heat generating components in a load center are provided herein. The disclosed concept provides a heat dissipating component that assists in heat dissipation of a heat generating component in a load center by transferring heat from the heat generating component to a non-heat generating component.

Abstract: A submodule and an assembly include a switching device having a substrate, and printed conductors arranged thereupon. The submodule incorporates a first and a second DC voltage printed conductor, to which a first and a second DC voltage terminal element are connected in an electrically conductive manner, and an AC voltage printed conductor, to which an AC voltage terminal element is connected in an electrically conductive manner. The submodule further comprises an insulating moulding, which encloses the switching device in a frame-type arrangement. The first DC voltage terminal element, by means of a first contact section, engages with a first supporting body of the insulating moulding, and the AC voltage terminal element, by means of a second contact section, engages with a second supporting body of the insulating moulding.

Abstract: A cooling element comprising a cooling body, the cooling body comprising a first surface and a second surface, the first surface and the second surface being on the opposing sides of the body and the distance between the first and second surfaces defining the height of the cooling body, multiple of channels for cooling liquid arranged inside the cooling body, the channels extending in a longitudinal direction of the cooling body, wherein the channels are arranged in two layers in the direction of the height of the cooling body inside the cooling body and the cooling element is adapted to hold electronic components on the first surface and on the second surface for cooling electronic components on both surfaces.

Abstract: In some examples, an apparatus includes a housing comprising an inner surface provided with thermal members, and a thermal attachment to transfer heat generated by a heat producing component to the housing. The thermal attachment is thermally contacted with the inner surface of the housing, and the thermal members are arranged to steer heat from the heat producing component and transferred to the housing by the thermal attachment at a greater heat flow rate through the housing to a first region of the housing and at a lesser heat flow rate through the housing to a second region of the housing.

Abstract: In some embodiments, a rack system is configured to comprise a removable fan system. The fan system enables thermal management of the rack system. The removable fan system includes a replaceable fan tray that can be assembled in the rack system by engaging a connecting mechanism and connecting a connecting cable. The fan tray is engaged with the connecting mechanism to be securely attached to the rack system. The fan tray is connected to a bus bar to receive power or necessary data to be operated. The fan tray can be disassembled from the rack system while the bus remains active, and enables access to the server or the rack system. The replaceable fan tray enables easy replacement of the fan system and access to the rear side of the rack system.

Abstract: The present invention relates to a circuit board assembly, comprising a circuit board which has a first and a second solder region, which is galvanically separated from the first, and which furthermore has a separator arranged between the solder regions and rising out from the solder regions, having a power semiconductor component which has a housing having an output connection side, from which at least one control connection and a plurality of output connections protrude, which are arranged substantially adjacent to each other on the output connection side, wherein the control connection is electrically and mechanically connected to the first solder region and the output connections are electrically and mechanically connected to the second solder region and the control connection is separated from the output connections via the raised separator.

Abstract: An electrical distribution apparatus includes a power connector for coupling to a cable. The power connector includes a first end and a second end each defining an opening arranged to receive the cable. A barrier is removably coupled to a portion of the electrical distribution apparatus and selectively adjustable between a first position and a second position, the barrier arranged to prevent insertion of the cable into the first end opening and to permit insertion of the cable into the second end opening when the barrier is in the first position, the barrier arranged to prevent insertion of the cable into the second end opening and to permit insertion of the cable into the first end opening when the barrier is in the second position.

Abstract: The present invention relates to a display device and a backlight assembly thereof. The backlight assembly according to an aspect of the present invention includes: a circuit board on which a circuitry member for controlling the display device is mounted; a cover bottom which covers the rear surface of the display device, in which an insertion hole corresponding to the circuit board is punched on the bottom thereof, and in which the circuit board is installed to be accommodated in the interior of the insertion hole; a first coupling part coupled to the circuit board; and a second coupling part coupled to the cover bottom. The backlight assembly comprises a bracket that fixes the circuit board to the cover bottom.

Abstract: A cooling apparatus has: an opening formed in a cooling plate for cooling an electronic component; and an electronic component accommodating section formed in the opening. A cooling pipeline is disposed in a manner to surround an outer side surface section of the electronic component accommodating section, whereby the electronic component and the cooling pipeline are arranged at substantially the same height as a top of the cooling plate to realize a low profile. In addition, the electronic component accommodating section, which is joined to the cooling plate, is configured that a side surface section thereof is in contact with a side surface section of the electronic component via a potting material. In this way, an area that contributes to heat radiation is increased.

Abstract: A cooling panel and an electronic component package including the same. The cooling panel includes first and second surfaces configured to face each other, and a cooling channel which is disposed on the second surface and in which cooling water is circulated, where the cooling channel includes a first channel region, into which cooling water is introduced, and a second channel region, through which the cooling water is discharged, and each of the first and second channel regions includes a plurality of guides, and density of the guides disposed at the first channel region is higher than density of the guides disposed at the second channel region.

Abstract: The electrical device includes a coupling member, a supporting member, a rotation section, a moving member, and a biasing member. The coupling member is provided at a first casing, and is formed with the rotation shaft. The supporting member is provided at a second casing, and is formed with a shaft hole into which the rotation shaft is inserted. The rotation section is provided at the rotation shaft, and is formed with a recessed portion open toward the outside in the radial direction of the rotation shaft. The moving member includes a protruding portion to engage with the recessed portion, and moves in the radial direction at the outside of the shaft hole. The biasing member biases the moving member toward the rotation center of the rotation shaft.