Abstract: A wearable electronic device including a molded body part made of a moldable ceramic material, having an inner surface, an outer surface, and at least one cavity having a depth arranged on the inner surface of the body part, an electronic part arranged in the cavity, which electronic part has a thickness that is less than the depth of the cavity, and a coating made of an epoxy material on the inner surface of the body part, covering the electronic part and the cavity.

Abstract: An electrical load center for residential and commercial buildings includes an enclosure, a cover assembly, and a panelboard. The panelboard includes an insulated base, first and second bus bars, each of the first and second bus bars having an elongated main member, a plurality of connecting members, each of which is integrally formed from an edge of the main member, and a plurality of conducting members integrally formed from each of the connecting members. The panelboard further includes at least one neutral bar. The neutral bar is preferably I-shaped and includes a generally vertical main body, and transverse upper and lower members. The transverse upper member is preferably thicker than the transverse lower member and includes an outward taper from a top surface to a bottom of the transverse upper member to provide a greater contact surface area.

Abstract: A connector includes a main housing element for holding smart connector circuitry. A threaded nub extends from the main housing element and is sized to be received within a knock-out of a junction box. The threaded nub has a first opening and a second opening separated by a barrier for allowing respective ones of power wires and dimming wires, which are coupled to the smart connector circuitry, to be passed from the main housing element to the junction box.

Abstract: According to an exemplary aspect an electronic module is provided, wherein the electronic module comprises an electronic chip comprising at least one electronic component, a spacing element comprising a main surface arranged on the electronic chip and being in thermally conductive connection with the at least one electronic component, and a mold compound at least partially enclosing the electronic chip and the spacing element, wherein the spacing element comprises a lateral surface which is in contact to the mould compound and comprises surface structures.

Abstract: A troubleshooting compartment for a motor control center unit, provides electrical access to test control points inside the motor control center unit, without exposing the operator to electrical hazards from the main line-voltage components inside the motor control center unit. The troubleshooting compartment comprises an accessible compartment contained within a motor control center unit, which is separate from a main line-voltage compartment of the motor control center unit, the accessible compartment having an access side to enable operator access to the accessible compartment without need to open the main line-voltage compartment; an accessible compartment door covering the access side of the accessible compartment from a front side of the motor control center unit; and feed-through terminals mounted within the accessible compartment, for test points and pilot devices operating at low, control voltages.

Abstract: A microelectronic package of the present description may comprises a first microelectronic device having at least one row of connection structures electrically connected thereto and a second microelectronic device having at least one row of connection structures electrically connected thereto, wherein the connection structures within the at least one first microelectronic device row are aligned with corresponding connection structures within the at least one second microelectronic device row in an x-direction.

Abstract: An electrical distribution apparatus includes a power connector for coupling to a cable. The power connector includes a first end and a second end each defining an opening arranged to receive the cable. A barrier is removably coupled to a portion of the electrical distribution apparatus and selectively adjustable between a first position and a second position, the barrier arranged to prevent insertion of the cable into the first end opening and to permit insertion of the cable into the second end opening when the barrier is in the first position, the barrier arranged to prevent insertion of the cable into the second end opening and to permit insertion of the cable into the first end opening when the barrier is in the second position.

Abstract: A power converter for a power system includes an input ceramic layer, an output ceramic layer, an input stage coupled to the input ceramic layer, an output stage coupled to the output ceramic layer, and a planar transformer coupled between said input stage and said output stage. The input receives a power input and the output stage generates a power output at least partially as a function of the power input. The planar transformer includes an input winding coupled to the input stage and an output winding coupled to the output stage. The input winding has a plurality of input turns and the output winding has a plurality of output turns. The input turns interleave the output turns.

Abstract: A direct-interface liquid-cooled (DL) Rack Information Handling System (RIHS) includes liquid cooled (LC) nodes each comprising a chassis received in a respective chassis-receiving bay of a rack and containing heat-generating functional components. Each LC node is configured with a system of conduits to receive direct injection of cooling liquid to regulate the ambient temperature of the node and provide cooling to the functional components inside the node by removing heat generated by the heat-generating functional components. A cooling subsystem has a liquid rail formed by more than one node-to-node, Modular Liquid Distribution (MLD) conduits, each including first and second terminal connections attached on opposite ends of a central conduit that can be rack-unit dimensioned. The MLD conduits seal to and enable fluid transfer between a port of a selected LC node and a port of an adjacent LC node.

Abstract: Configurable central processing unit (CPU) package substrates are disclosed. A package substrate is described that includes a processing device interface. The package substrate also includes a memory device electrical interface disposed on the package substrate. The package substrate also includes a removable memory mechanical interface disposed proximately to the memory device electrical interface. The removable memory mechanical interface is to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate.

Abstract: Disclosed is system, method, and rack stand portion for the advantageous cooling of computer equipment 305. The rack stand 200 includes a hollow body 210, 212 that may be formed of cartridges 2416. Gas from an airflow source 5204 is guided into the rack stand body and then into a sealed case of the computer equipment. Air flow is then guided out of the computer equipment for recirculation, exhaust, or other purpose.

Abstract: Example embodiments of the present invention provide a method of manufacture and an apparatus for optimized server design using dense DIMM spacing, wide heatsink, improved routing channels, and improved air delivery to rear devices. The method of manufacture comprise providing a plurality of compliant pin memory sockets on a first side of a circuit board at a pitch less than that specified in a reference layout requiring solder tail memory sockets and providing a plurality of surface mount capacitors on the second side of the circuit board enabling at least one pair of the plurality of compliant pin memory sockets to be provided at the pitch less than that specified in the reference layout.

Abstract: A high-density storage assembly having a casing, an engaging mechanism, and a recording medium machine; the casing has a receiving space, with a plurality of fixing portions disposed on a substrate at a bottom of the casing, the engaging mechanism has at least two supporting portions arranged in a side by side in a transverse width direction, each having a coupling portion and a supporting plate, with the coupling portions connected to the fixing portions of the substrate of the casing, respectively, and extended upward and obliquely to form the supporting plates. A containing space for movably placing and positioning the recording medium machine is formed between an abutting leaf spring and a limit plate which are disposed on a lower surface of the supporting plate of one of two adjacent said supporting portions and an upper surface of the supporting plate of another said supporting portion, respectively.

Abstract: A connect/disconnect mechanism for an MCC unit, prevents a circuit breaker from being turned on while the unit is being inserted into an MCC section, until stabs of the unit have been connected to a power bus. A cam is rotatably mounted on a pivoted platform in the MCC unit, an actuating arm is coupled between a unit on/off handle of the MCC unit and the cam, and a bail is pivotally mounted on the pivoting platform and connected to a switch handle of the breaker. A cam surface in a slot of the cam is configured to engage a pin projecting from the bail, when the pivoted platform is forced in a backward direction to connect the stabs to the bus, thereby operatively connecting the unit on/off handle to the switch handle of the breaker.

Abstract: An inverter drive assembly includes a first bus bar having a plurality of bushings, including at least a first bushing and a second bushing, the first bus bar being configured to receive at least one DC link capacitor of the inverter drive assembly via the second bushing, a second bus bar electrically connected to the first bus bar at the first bushing, and an inverter electrically connected to the second bus bar, the inverter being configured to receive electrical current through the second bus bar, wherein a height of the first bushing defines an air gap of approximately 5 millimeters between the first bus bar and the second bus bar.

Abstract: This power supply controller for an electrical energy distribution network comprises an electronic power card on which power modules are fitted and on which a set of at least one control module is fitted to control the power modules. The electronic card comprises control buses positioned between the control modules and power module fitting locations on which power modules are fitted according to the use of the controller, to form an electronic power card specific to a use of the power supply controller.

Abstract: Disclosed is system, method, and rack stand portion for the advantageous cooling of computer equipment 305. The rack stand 200 includes a hollow body 210, 212 that may be formed of cartridges 2416. Gas from an airflow source 5204 is guided into the rack stand body and then into a sealed case of the computer equipment. Air flow is then guided out of the computer equipment for recirculation, exhaust, or other purpose.

Abstract: A heat exchanger includes: a plurality of first heat radiation members, each of the plurality of first heat radiation members including a first refrigerant flow path through which a refrigerant flows; a plurality of second heat radiation members, each of the plurality of second heat radiation members including a second refrigerant flow path through which the refrigerant flows; and a fin attached between the plurality of second heat radiation members, wherein an interval between the plurality of first heat radiation members is smaller than an interval between the plurality of second heat radiation members.

Abstract: A power module assembly includes opposing end caps collectively having coolant ports and a row of cards that each have a major side defining a projection extending across the card. A side panel extends between the end caps such that the panel and row define a channel in fluid communication with the ports and configured to convey coolant directly across the cards. The side panel defines a groove that receives the projections.

Abstract: This disclosure describes an electronics device that effectively removes heat from the SoC, which increases its efficiency and extends its useful life by spreading heat in the thermally conductive plate before transferring it across the interface. Surface area is a significant factor in TIM thermal performance, so this increases the performance substantially when using the same type of TIM pad. This device allows the use of lower performance TIM pads that resolve the issues of high die pressure and non-resilient behavior of high thermal conductivity TIMs. Additionally, the device mechanically isolates the SoC from the heatsink, which reduces stress and provides improved thermal performance.