Abstract: A display device including: a display panel; a bottom cover configured to accommodate the display panel; and a composite sheet disposed between the display panel and the bottom cover. The composite sheet includes a buffer sheet having at least one through hole and at least one heat-dissipating sheet accommodated in the through hole.

Abstract: A method for designing and assembling a modular IT rack includes a manufacturer designing and constructing lightweight, modular corrugated cardboard modules/segments and corresponding banding and corner components that can be used to assemble the modular IT rack. A user/assembler of the modular IT rack assembles modular tray grouping and enclosure (MTGE) casing units using a first set of cardboard modules. The user constructs trays using a second set of cardboard modules. The user affixes cable support components to the sides of sub-groups of the constructed trays. The user encloses sub-groups of trays having the affixed cable support components within the assembled MTGE casing units to create MTGE blocks. The user vertically stacks the MTGE blocks having the tray sub-groups and the affixed cable support components enclosed within. The user aligns and secures the vertically stacked MTGE blocks in a fixed position using banding and corner components.

Abstract: In one embodiment, an apparatus includes: an antenna mount provided for an antenna; a first portion of an electrically conductive heat coupler provided for the antenna mount, wherein the first portion of the electrically conductive heat coupler reflects electromagnetic radiation associated with the antenna; and a second portion of the electrically conductive heat coupler electrically coupled to the first portion, where the second portion is shaped for arrangement in association with the placement of one or more electrical components on a substrate in order to draw heat away from at least one of the one or more electrical components and dissipate the heat over a combined surface area of the first and second portions of the electrically conductive heat coupler.

Abstract: An improved electrical system may be provided by electrically isolating exposed live fasteners and bus clamps in power distribution systems by attaching electrically insulating snap-based cover assemblies to the live fasteners and bus clamps. A cover assembly may include a plate element and an electrically insulating cap element. The plate element may have a plate opening and a beveled edge, and the electrically insulating cap element may have a cap edge followed by an interior recess. The cap element and the plate element may be held together by snapping the cap element over the plate element such that the beveled edge fits into the interior recess and the cap edge fits below the beveled edge. The cover assembly may be attached to a fastener or bus clamp via the plate opening.

Abstract: Inductance is reduced while high insulation reliability between positive and negative electrodes of a DC bus bar is ensured. The DC bus bar 801a (801b) is held; the bus bar 801a (801b) is fixed by an insulating member 802a (802b) having an insulating property, with one surface 14 (15) of the bus bar 801a (801b) exposed; the bus bar 801a is arranged such that the surface 14 of the bus bar 801a faces the surface 15 of the second bus bar 801b; an insulating sheet 803 is held between the bus bar 801a and the bus bar 801b; the first insulating member 802a has a projecting part 804a projecting toward the second insulating member 802b; and the projecting part 804a has, at an end part thereof, an abutting surface 13 in contact with the second insulating member 802b.

Abstract: A system includes a chassis, a plurality of nodes, a coolant distribution unit (CDU), and one or more air movers. The chassis includes multiple node bays, a CDU bay, a coolant supply manifold with an inlet in the CDU bay and an outlet in each node bay, and a coolant return manifold an inlet in each node bay and an outlet in the CDU bay. Each node is received into a node bay with an internal heat exchanger connected between a coolant supply and return manifolds. The CDU is received in the CDU bay and includes an air-to-coolant heat exchanger in fluid communication between the supply and return manifolds, and a pump for circulating a coolant through a coolant loop. The one or more air movers force air across the air-to-coolant heat exchanger of the CDU.

Abstract: A display device according to one embodiment of the present invention includes a display module, and a heat dissipation unit which is coupled to a rear side of the display module. The heat dissipation unit includes a core part including a plurality of hollow polygonal columns extending in a front/back direction, a front sheet which is coupled to a front portion of the core part, and a rear sheet which is coupled to a rear portion of the core part. The core part has a thickness of about 40% to about 60% in the front/back direction with respect to a total thickness of the heat dissipation unit in the front/back direction.

Abstract: A heat exchanger includes a flat metal tube that has flat top and bottom surfaces and an inner passage. The surfaces remove heat from a liquid passing through the passage from an inlet and toward an outlet of the heat exchanger. A first plurality of solid metal posts are mounted perpendicularly upon the top surface. Each fin of a first plurality of fins has holes fitted about the first plurality of posts such that the fins are mounted on the posts in vertically-spaced, parallel alignment relative to each other and the top surface. A second plurality of solid metal posts are mounted perpendicularly upon the bottom surface. Each fin of a second plurality of fins has holes fitted about the second plurality of posts such that the fins are mounted on the posts in vertically-spaced, parallel alignment relative to each other and the bottom surface.

Abstract: A heat sink of a metallic shielding structure is provided in this disclosure, which includes a heating module and a cooling module. The heating module includes a heat generating component, a substrate, and a shield housing. The heat generating component is electrically connected to one side surface of the substrate and forms an opening corresponding the substrate. The cooling module includes a body and a working fluid is disposed in the body.

Abstract: A bus assembly is for a load center. The load center includes a cover apparatus and an electrical switching apparatus. The cover apparatus has a number of cover segments. The bus assembly comprises a bus stab structured to be coupled to the number of cover segments and the electrical switching apparatus; a bus bar structured to be coupled to the number of cover segments; and a connection device comprising an element extending from a corresponding one of the bus stab and the bus bar. The connection device is structured to move between a FIRST position corresponding to the element being electrically disconnected from the other of the corresponding one of the bus stab and the bus bar, and a SECOND position corresponding to the element being electrically connected to the other of the corresponding one of the bus stab and the bus bar.

Abstract: An electrical connection box includes a terminal supporting wall that has a rescue terminal portion of a bus bar arranged on the front surface and is provided as a single piece with a block main body, and a cover member that exposes and covers the terminal supporting wall and the rescue terminal portion. Bearing holes are provided in the terminal supporting wall on one end side in the left-right direction, rotation support shaft portions that are rotatably fitted into the bearing holes are provided as protrusions on the cover member, the rescue terminal portion is exposed by rotating the cover member from an opening/closing end on the other end side in the left-right direction with the rotation support shaft portions serving as fulcrums, and ribs for holding the cover member in an isolating state are provided as protrusions on the opening/closing end side of the cover member and are semi-locked into latching depressions provided on the terminal supporting wall.

Abstract: A channel distribution type cooling plate where a space between a first coolant storage part for inflow of coolant and a second cooling storage part for outflow of coolant formed at the two ends of an upper space of a main body provided with a lower space for removing heat of a heat generating member is partitioned by a meandering type partition wall to form coolant distribution paths connected to the first coolant storage part and coolant collection paths connected to the second coolant storage part, the bottom of the coolant distribution paths and the coolant collection paths are communicated by a plurality of through holes with the lower space, and side surfaces of the partition wall at the coolant distribution path sides are formed with subchannels for running coolant from the first coolant storage part, in order to improve the cooling efficiency at the coolant outlet side.

Abstract: A cooling controller of a cooling canister is configured to coordinate control of a set of fans coupled with the cooling canister with another set of fans coupled with an adjacent cooling canister. The cooling canister and the adjacent cooling canister include openings that are coupled together that permit air to flow between the cooling canister and the adjacent cooling canister. In some embodiments, the cooling control also coordinates control of a damper in at least one of the coupled openings of the coupled cooling canister and adjacent cooling canister.

Abstract: An electrical enclosure is for an electrical apparatus. The electrical apparatus includes a number of electrical components. The electrical enclosure comprises: a frame assembly comprising a frame member having an elongated hinge side portion; a door having an elongated hinge side portion disposed parallel to and proximate the hinge side portion of the frame member, the door and the frame assembly being structured to enclose the number of electrical components; and a containment apparatus comprising a flexible barrier member coupled to the hinge side portion of the frame member and the hinge side portion of the door in order to provide a seal therebetween.

Abstract: A pump assembly with an electric drive motor and with an electronics housing (10). The electronics housing in which at least one first electrical circuit board (14) is arranged. On the circuit board electrical contacts (18) are formed. Via the electrical contacts, at least one electronic component (16), in the inside of the electronics housing (10) may be programmed. At least one opening (22), through which the electrical contacts (18) on the circuit board (14) are contactable from the outside, is formed on a wall (20) of the electronics housing (10).

Abstract: In-row cooling units are configured to be installed in a row configured to receive server racks in a datacenter. The cooling units include chilling coils configured to cool air passing across the chilling coil. The cooling units when installed supply cooled air through a floor of the datacenter, such as after receiving and cooling air from or through a ceiling plenum.

Abstract: An electrical enclosure apparatus includes a protective apparatus that permits forced-air cooling of the interior of the enclosure while resisting structures that are within in the interior from being blown out of the electrical enclosure as a result of an arc event or other event. The protective apparatus includes a flow apparatus formed from one or more blocks of ceramic material having formed therein a plurality of elongated flow channels. The flow apparatus is supported inside a duct with the use of a support apparatus. The ceramic material from which the flow apparatus is formed is configured to withstand the heat that may be experienced in an arc event and is additionally configured to be sufficiently rigid and tough to retain within the duct any structures within the enclosure from being blown out of the protective apparatus, thereby protecting personnel who may be in the area.

Abstract: An evaporator includes a housing in which an evaporator chamber configured to evaporate a refrigerant is formed; a heat transfer surface provided on an inner wall of the housing and having a hot area which is a part that becomes hot due to heat transferred from a heating element to the housing; and a supply port formed in the housing, opposed to the hot area and configured to eject the refrigerant supplied from a supply pipe to the hot area, wherein a narrow groove is formed in the heat transfer surface.

Abstract: Several embodiments include a server rack that accesses high voltage direct current (HVDC) power from a power source external to the server rack. The server rack can provide the HVDC power to two or more shelves in the server rack via at least a HVDC power rail pair. One or more DC-DC converters in a shelf of server rack can convert the HVDC power to a lower DC voltage usable by information technology (IT) load in the shelf. A power distribution board (e.g., in the shelf or in the server rack) can then provide the lower DC voltage to the IT load. The DC-DC converters can be blindly mated with the power distribution board and can be hot swappable from the power distribution board.

Abstract: The disclosed technology provides systems and methods for an enclosure system with optimized internal dynamically controllable airflow distribution. The systems include a computing system enclosure, and an electroactive film adhered to a surface of the computing system enclosure and configured to redirect airflow distribution in the computing system enclosure. In another implementation, a method monitoring airflow distribution within a computing system enclosure with a plurality of sensors, and controlling an orientation of a programmable microstructure in an electroactive film adhered to a surface of the computing system enclosure based on results of the monitoring operation. In yet another implementation, the disclosed technology includes bimetallic baffles configured for utilization in a computing system enclosure to redirect airflow distribution within the computing system enclosure.