Abstract: In a bonding apparatus for bonding under pressure a pressure-bonding portion, the concentration of water in a pressure-bonding portion atmosphere inside the apparatus is set smaller than that in an atmosphere outside the apparatus, thereby enabling pressure bonding under low-temperature and low-pressure conditions. In this case, the amount of adsorbed water on each surface of a bonding metal terminal and a to-be-bonded metal terminal forming the pressure-bonding portion is set to 1×1016 molecules/cm2 or less.

Abstract: A barrier film which has uniform thickness and excellent adhesiveness to the base material and superbly functions to protect a platinum film can be formed on the inner wall surface of a moisture-generating reactor at ease and at a low cost. The moisture-generating reactor in which hydrogen and oxygen are reacted to generate moisture without high temperature combustion is made of an alloy containing aluminum. A principally aluminum oxide (Al2O3)-composed barrier film is formed by applying an aluminum selective oxidation treatment on the inner wall surface of the moisture-generating reactor, and thereafter a platinum film is stacked on and stuck to the barrier film so that a platinum coating catalyst layer is formed.

Abstract: A semiconductor device which includes a semiconductor chip formed with a light-reception area, a spacer, and a transparent substrate. The spacer is bonded to the semiconductor chip via a first adhesive and surrounding the light-reception area. The transparent substrate is bonded to the spacer via a second adhesive and disposed above the light-reception area. A first projection having a predetermined height is formed on a surface of the spacer which is on a side of the semiconductor chip, and the first projection abuts on the semiconductor chip.

Abstract: Provided are a heating method making it possible that when a gas inside the body of a piping member, such as a pipe, is heated, the heating efficiency is improved; and a gas-heating piping member making it possible to perform such a heating method easily. A heat keeping member 4 which can transmit a gas to be heated is inserted to the inside of a piping member body 1 into which the gas can be passed in a state that the heat keeping member is brought into close contact with the inside, and further the piping member body 1 is heated from the outside thereof by means of a heating means 2.

Abstract: A method for testing leakage of a pipe passage employs a flow rate of gas used in testing supplied to the inside of a pipe passage undergoing testing hermetically sealed on one side while detecting flow rate with a flow measuring device and pressure with a pressure detector, and detecting temperature of the gas used, and inputting the detected values of pressure, flow rate and temperature into a computation treatment apparatus, and internal capacity VL of the pipe passage is computed as VL=(supplied flow rate Q×pressure applied time ?t)/(pressure rise value ?P2), and next, the volume QL leaked from the pipe passage is computed as QL=(pressure drop value ?P2?×internal capacity VL)/(pressure drop time ?t?).

Abstract: A safe, reduced pressure apparatus for generating water vapor from hydrogen and oxygen and feeding high purity moisture to processes such as semiconductor production. The apparatus eliminates the possibility of the gas igniting by maintaining the internal pressure of the catalytic reactor for generating moisture at a high level while supplying moisture gas from the reactor under reduced pressure. A heat dissipation reactor improvement substantially increases moisture generation without being an enlargement in size by efficient cooling of the reactor alumite-treated fins.

Abstract: A multilayered circuit board which is provided with a low-permittivity interlayer insulating film, and which can significantly improve the performance such as signal transmission characteristics of the multilayered circuit board such as a package and a printed board, because the surface in contact with the interlayer insulating film of the circuit board has no unevenness to eliminate the lowering of production yield and the deterioration of high-frequency signal transmission characteristics; and electronic equipment using the circuit board.

Abstract: A thermoelectric conversion module includes a first insulated substrate formed in a plate shape, a second insulated substrate formed in a plate shape, the first insulated substrate and the second insulated substrate are provided so as to be paired, plural thermoelectric elements provided between the insulated substrates so as to be joined thereto, a first object joined to the first insulated substrate in a manner where the first object is cooled and a second object joined to the second insulated substrate in a manner where the second object is heated, wherein a thickness of the first insulated substrate is set on the basis of a linear expansion of the first object, and a thickness of the second insulated substrates is set on the basis of a linear expansion of the second object.

Abstract: A cold cathode fluorescent tube where an electron emitting electrode is sealed in shows much deterioration in the luminance with time, thereby being not adequate for a long time use. The electrode emitting electrode is formed in such a shape that an electric field is not locally concentrated. By mixing a material of high heat conductivity, such as tungsten, as the material for the electron emitting electrode or using helium of high heat conductivity as the sealing gas, a long life of the cold cathode fluorescent tube is achieved.

Abstract: The present invention provides a vacuum thermal insulating valve that may be used at high temperature in gas supply systems or gas exhaust systems, and also may be made substantially small and compact in size owing to its excellent thermal insulating performance. With a vacuum thermal insulating valve comprising a valve equipped with a valve body and an actuator, and a vacuum thermal insulating box that houses the valve, the afore-mentioned vacuum thermal insulating box S is formed by a square-shaped lower vacuum jacket S5 having a cylinder-shaped vacuum thermal insulating pipe receiving part J on a side and with its upper face made open, and the square-shaped upper vacuum jackets S4, which is hermetically fitted to the lower vacuum jacket S5 and with its lower face made open.

Abstract: The invention provides a valve and a method of operating the valve that makes it possible to reduce the diameter of the vacuum exhaustion pipings to make the facility for the vacuum exhaustion system small, which results in lower costs and shortens vacuum exhaustion time, and also which can prevent corrosion, cloggings, and seal leakages inside the piping system caused by the accumulation of substances produced by the decomposition of gas flowing through the pipings. In particular, in accordance with the present invention, an aluminum passivation is applied on the piping parts, i.e. the valve and others, that are used in the vacuum exhaustion system so as to inhibit gas decomposition caused by temperature rise at the time of baking so that components for reduction in the diameter size in the vacuum exhaustion system are provided. Thus, corrosion, cloggings and seat leakages caused by gas decomposition are prevented.

Abstract: The present invention provides a valve which makes it possible to reduce the diameter of the vacuum exhaustion pipings for making the facility for the vacuum exhaustion system small, as a result lowering the costs, and making the vacuum exhaustion time short, and also which can prevent the corrosions, cloggings, and seal leakages inside the piping system caused by the accumulation of substances produced by the decomposition of the gas. Specifically, the aluminum passivation is applied on the piping parts, i.e. the valve and others, used in the vacuum exhaustion system to inhibit the gas decomposition caused by the temperature rise at the time of the baking so that components for the reduction in the diameter size in the vacuum exhaustion system are provided. The corrosions, cloggings and seat leakages caused by the gas decomposition are prevented.

Abstract: An image display device capable of reducing the burden on a passenger and reducing the occurrence of motion sickness, by giving the passenger, through a visual sense, perception (visually induced self-motion perception) of his/her own body moving while viewing an image of a TV and the like in a vehicle, and thus by matching visual information to vestibular information obtained from the motion of the vehicle, particularly to a sense of rotation and somatosensory information which are detected by his/her semicircular canals, is provided.

Abstract: An object of the present invention is to reduce an adverse effect of an atmosphere in a heat treatment device used in production of an electronic device, imparted on characteristics of the produced electronic device. To attain the object, an inner surface of the heat treatment device is covered with an oxide passive-state film and bringing the surface roughness of the inner surface to 1 ?m or less in terms of a central mean roughness Ra. According to this type of heat treatment device, in curing a heat curable resin, deterioration in the heat curable resin caused by decomposition or dissociation of the heat curable resin, can be reduced.

Abstract: Generally, solar cell panels are black, being inferior in design. An object of the invention is to provide a transparent plate which develops color without lowering power generation efficiency; and a solar cell panel which uses such transparent plate. A solar cell panel according to the invention has a construction such that the solar cell is covered by a transparent plate which is characterized by absorbing infrared light and emitting visible light. Since the transparent plate develops color by using infrared light which does not contribute to power generation, there is obtained a solar cell panel which is superior in the viewpoint of decoration without lowering the power generation efficiency of solar cells.

Abstract: A semiconductor device includes a semiconductor substrate having a first electronic circuit and a second electronic circuit formed on an active surface, a pad electrode formed on the active surface by being connected to the first electronic circuit and/or the second electronic circuit, a first opening formed to some point along a depth of the semiconductor substrate toward the pad electrode from a surface opposite to the active surface of the semiconductor substrate, a second opening formed so as to reach the pad electrode from a bottom surface of the first opening, an insulating layer formed by covering sidewall surfaces of the first opening and the second opening, a conductive layer formed by covering at least an inner wall surface of the insulating layer and a bottom surface of the second opening, a third opening formed to some point along the depth of the semiconductor substrate from the surface opposite to the active surface of the semiconductor substrate, and a heat insulator imbedded in the third openi

Abstract: A thermoelectric module includes a first insulated substrate having a first opposing surface, a second insulated substrate having a second opposing surface, the second opposing surface faces the first opposing surface, a plurality of electrodes formed on the first and second opposing surfaces, a plurality of thermoelectric transducers provided between the first insulated substrate and the second insulated substrate, the plurality of thermoelectric transducers electrically connected with one another in series and/or in parallel via each electrode, and a conducting circuit electrically connecting the plurality of electrodes with an external power source, wherein the first insulated substrate includes a substrate body having the first opposing surface and a projecting portion being formed continuously from the substrate body and extending in a direction that intersects the substrate body, and the projecting portion includes a fixing surface extending in the direction that intersects the substrate body.

Abstract: A reactor for generating moisture, with which hydrogen and oxygen fed into the reactor contact with a platinum coating catalyst layer to activate reactivity so that hydrogen and oxygen react under conditions of non-combustion, wherein the reactor includes a cooler comprising a heat dissipation body substrate in which a heater insertion hole is made in the center to fix to the outer surface of the reactor structural component on the outlet side and a cooler on the outlet side made up of a plural number of heat dissipation bodies installed vertically in parallel on the part excluding the area where the afore-mentioned heater insertion hole of the heat dissipation body substrate exists, and a part of the heater to heat the reactor is inserted in the heater insertion hole so as to fix to the outer surface of the reactor structural component on the outlet side.

Abstract: A gate electrode or a gate wiring of a thin-film transistor has a four-layer structure including an adhesive base layer, a catalyst layer, a wiring metal layer, and a wiring metal anti-diffusion layer which are laminated in this order. With this structure, adhesion and flatness are improved. In this case, the adhesive base layer is formed by a resin having a structure capable of coordinating to a metal. Hence, adhesion with an insulating substrate can be improved. Further, the wiring metal anti-diffusion layer is formed on the wiring metal layer, so that diffusion of a wiring metal can be inhibited. Thus, characteristics of the thin-film transistor can be improved.

Abstract: A diaphragm valve 1 is provided with a body 2 having a flow-in passage 6, a flow-out passage 7, and a valve seat 8 formed between the passages; a diaphragm 3 installed in the body 2 and permitted to rest on and move away from the valve seat 8; and a driving means 4 installed on the body 2 to allow the diaphragm 3 to rest on and move away from the valve seat 8, wherein synthetic resin films 5 of predetermined thickness are coated on fluid-contacting parts 25 of the afore-mentioned body 2 and diaphragm 3. A diaphragm valve in accordance with the present invention prevents corrosion of the valve members caused by accumulation and adherence of substances produced by thermal decomposition, and prevents clogging caused by substances produced, and prevents seat leakage when applied in the vacuum exhaust system of a semiconductor manufacturing facility.