Abstract: A vehicle is configured to assist parking at a predetermined position by generating a path to the predetermined position and changing, based on the path, at least a vehicle wheel angle of a steered wheel. The vehicle includes: at least one steered wheel; at least one driven wheel; a power unit configured to provide a driving force to the driven wheel; and an operation device configured to receive at least an operation of changing power of the power unit. Before the predetermined position on the path, the vehicle wheel angle of the steered wheel is changed based on the path. If the vehicle travels beyond the predetermined position of the path, the vehicle wheel angle of the steered wheel is changed to allow the vehicle to advance in a tangential direction of the predetermined position of the path.

Abstract: When a gearshift of a vehicle is in drive, a video image of a movement state of the vehicle moving forward depending on the rotation of the wheels detected by a wheel rotation sensor is displayed on a monitor. Thereafter, when the gearshift is in neutral, a video image of a movement state of the vehicle moving forward depending on the rotation of the wheels is displayed on the monitor. When the gearshift is in rear where the vehicle moves in a second direction opposite to a first direction, a video image of a movement state of the vehicle moving in the second direction depending on the rotation of the wheels is displayed on the monitor. Thereafter, when the gearshift is in neutral, a video image of a movement state of the vehicle moving in the second direction depending on the rotation of the wheels is displayed on the monitor.

Abstract: A vehicle is configured to assist parking at a predetermined position by generating a path to the predetermined position and changing, based on the path, at least a vehicle wheel angle of a steered wheel. The vehicle includes: at least one steered wheel; at least one driven wheel; a power unit configured to provide a driving force to the driven wheel; and an operation device configured to receive at least an operation of changing power of the power unit. Before the predetermined position on the path, the vehicle wheel angle of the steered wheel is changed based on the path. If the vehicle travels beyond the predetermined position of the path, the vehicle wheel angle of the steered wheel is changed to allow the vehicle to advance in a tangential direction of the predetermined position of the path.

Abstract: When a gearshift of a vehicle is in drive, a video image of a movement state of the vehicle moving forward depending on the rotation of the wheels detected by a wheel rotation sensor is displayed on a monitor. Thereafter, when the gearshift is in neutral, a video image of a movement state of the vehicle moving forward depending on the rotation of the wheels is displayed on the monitor. When the gearshift is in rear where the vehicle moves in a second direction opposite to a first direction, a video image of a movement state of the vehicle moving in the second direction depending on the rotation of the wheels is displayed on the monitor. Thereafter, when the gearshift is in neutral, a video image of a movement state of the vehicle moving in the second direction depending on the rotation of the wheels is displayed on the monitor.

Abstract: The present invention is an in-vehicle charger for detecting ground faults originating in sections in which alternating current is flowing. This device is an in-vehicle charger (100) for charging a vehicle-mounted battery, wherein the device is provided with: a bridge rectifier (14) for converting alternating current supplied from a power source to direct current; a ground fault detecting circuit (21) for outputting a test voltage when a test current flows in a circuit in the in-vehicle charger (100) and, based on changes in the test current in response to the presence or absence of a ground fault resistor, for detecting a ground fault in the circuit of the in-vehicle charger (100); and a controller (23) for controlling the ground fault sensing circuit (21) so as to output a test voltage exceeding the forward voltage of a diode provided by the bridge rectifier (14).

Abstract: A thermoelectric module includes an insulating substrate, plural electrodes formed on a component side of the insulating substrate, plural peltier elements each mounted on and electrically connected to the electrodes, and a mark for image recognition formed at least one of the electrodes, the mark for image recognition having lightness and/or saturation which is different from lightness and/or saturation of the electrode on an image. An entire of the electrode is usable as an electrical conduction path.

Abstract: A flex-rigid printed wiring board is provided which can retain flexibility of a flexible portion while increasing durability of the flexible portion against folding, and can ensure conduction in a rigid portion, and a method of manufacturing the printed wiring board. The flex-rigid printed wiring board includes a conductor layer provided on at least one face of a base film, one region of the wiring board containing the base film being a rigid region, an another region containing the base film being a flexible region. The average thickness “tf” of the conductor layer on the base film formed in the flexible region and the average thickness “tR” of the conductor layer on the base film formed in the rigid region satisfy the relationship of tf<tR.

Abstract: The present invention is an in-vehicle charger for detecting ground faults originating in sections in which alternating current is flowing. This device is an in-vehicle charger (100) for charging a vehicle-mounted battery, wherein the device is provided with: a bridge rectifier (14) for converting alternating current supplied from a power source to direct current; a ground fault detecting circuit (21) for outputting a test voltage when a test current flows in a circuit in the in-vehicle charger (100) and, based on changes in the test current in response to the presence or absence of a ground fault resistor, for detecting a ground fault in the circuit of the in-vehicle charger (100); and a controller (23) for controlling the ground fault sensing circuit (21) so as to output a test voltage exceeding the forward voltage of a diode provided by the bridge rectifier (14).

Abstract: A thermoelectric module includes a first insulated substrate having a first opposing surface, a second insulated substrate having a second opposing surface, the second opposing surface faces the first opposing surface, a plurality of electrodes formed on the first and second opposing surfaces, a plurality of thermoelectric transducers provided between the first insulated substrate and the second insulated substrate, the plurality of thermoelectric transducers electrically connected with one another in series and/or in parallel via each electrode, and a conducting circuit electrically connecting the plurality of electrodes with an external power source, wherein the first insulated substrate includes a substrate body having the first opposing surface and a projecting portion being formed continuously from the substrate body and extending in a direction that intersects the substrate body, and the projecting portion includes a fixing surface extending in the direction that intersects the substrate body.

Abstract: A thermoelectric module includes an insulating substrate, plural electrodes formed on a component side of the insulating substrate, plural pettier elements each mounted on and electrically connected to the electrodes, and a mark for image recognition formed at least one of the electrodes, the mark for image recognition having lightness and/or saturation which is different from lightness and/or saturation of the electrode on an image. An entire of the electrode is usable as an electrical conduction path.

Abstract: With respect to a vacuum tube having a reduced pressure vessel containing an electric discharge gas sealed therein, problems such as the lowering of discharge efficiency owing to an organic material, moisture or oxygen remaining in the reduced pressure vessel have taken place conventionally. It has been now found that the selection of the number of water molecules, the number of molecules of an organic gas and the number of oxygen molecules remaining in the reduced pressure vessel, in a relation with the number of molecules of a gas contributing the electric discharge allows the reduction of the adverse effect by the above-mentioned remaining gas. Specifically, the selection of the number of molecules of the above electric discharge gas being about ten times that of the above-mentioned remaining gas or more can reduce the adverse effect by the above-mentioned remaining gas.

Abstract: With respect to a vacuum tube having a reduced pressure vessel containing an electric discharge gas sealed therein, problems such as the lowering of discharge efficiency owing to an organic material, moisture or oxygen remaining in the reduced pressure vessel have taken place conventionally. It has been now found that the selection of the number of water molecules, the number of molecules of an organic gas and the number of oxygen molecules remaining in the reduced pressure vessel, in a relation with the number of molecules of a gas contributing the electric discharge allows the reduction of the adverse effect by the above-mentioned remaining gas. Specifically, the selection of the number of molecules of the above electric discharge gas being about ten times that of the above-mentioned remaining gas or more can reduce the adverse effect by the above-mentioned remaining gas.

Abstract: The method for parallel operation of moisture generating reactors according to the present invention operates so that an orifice, provided with an orifice hole having a predetermined opening diameter, is disposed on a mixed-gas inlet side of each of a plurality of moisture generating reactors connected in parallel with each other, and mixed gas G consisting of hydrogen and oxygen is supplied from a mixer to each of the moisture generating reactors through each orifice, and the flows of moisture generated by the moisture generating reactors are combined, and the resulting combined moisture is supplied to an apparatus that uses high-purity water. Thus, a need to increase the amount of high-purity water supply is met by allowing a plurality of moisture generating reactors to perform a parallel water generating operation by branching off a mixed gas consisting of H2 and O2 by using a simple orifice construction.

Abstract: A semiconductor device includes a semiconductor substrate having a first electronic circuit and a second electronic circuit formed on an active surface, a pad electrode formed on the active surface by being connected to the first electronic circuit and/or the second electronic circuit, a first opening formed to some point along a depth of the semiconductor substrate toward the pad electrode from a surface opposite to the active surface of the semiconductor substrate, a second opening formed so as to reach the pad electrode from a bottom surface of the first opening, an insulating layer formed by covering sidewall surfaces of the first opening and the second opening, a conductive layer formed by covering at least an inner wall surface of the insulating layer and a bottom surface of the second opening, a third opening formed to some point along the depth of the semiconductor substrate from the surface opposite to the active surface of the semiconductor substrate, and a heat insulator imbedded in the third openi

Abstract: For the purpose of providing a semiconductor element built-in type multilayered circuit board in which a semiconductor element is closely joined to a recess of an insulating substrate to effectively disperse heat generated from the semiconductor element through the insulating substrate at a working temperature region of the semiconductor element circuit board, to surely conduct an electrical connection of an electronic part such as semiconductor element or the like in a short wiring and to enable the high density mounting of semiconductor elements, miniaturization and increase of working speed, there is proposed a semiconductor element built-in type multilayered circuit board formed by laminating a plurality of semiconductor element built-in type boards each comprising an insulating substrate and a semiconductor element accommodated in a recess formed therein, characterized in that a difference between a linear expansion coefficient of the insulating substrate and a linear expansion coefficient of the semicon

Abstract: As a substrate for a semiconductor device, a metal substrate is used, and the metal substrate is composed of a metal base body made of a first metal and a connecting metal layer made of a second metal for covering the metal base body. The substrate has a structure wherein a diffusion preventing layer for preventing diffusion of the first metal is provided on the connecting metal layer.

Abstract: A flex-rigid printed wiring board is provided which can retain flexibility of a flexible portion while increasing durability of the flexible portion against folding, and can ensure conduction in a rigid portion, and a method of manufacturing the printed wiring board. The flex-rigid printed wiring board includes a conductor layer provided on at least one face of a base film, one region of the wiring board containing the base film being a rigid region, an another region containing the base film being a flexible region. The average thickness “tf” of the conductor layer on the base film formed in the flexible region and the average thickness “tR” of the conductor layer on the base film formed in the rigid region satisfy the relationship of tf<tR.

Abstract: A semiconductor device including a component substrate of a semiconductor device; electrode pads provided on one surface of the component substrate; a support plate material reinforcing the component substrate; via holes made in the support plate material; a conducting material filled in the via holes; and a joining member interposed between the electrode pads and the conducting material and joining the component substrate and the support plate material.

Abstract: As a substrate for a semiconductor device, a metal substrate is used, and the metal substrate is composed of a metal base body made of a first metal and a connecting metal layer made of a second metal for covering the metal base body. The substrate has a structure wherein a diffusion preventing layer for preventing diffusion of the first metal is provided on the connecting metal layer.

Abstract: A multilayered circuit board which is provided with a low-permittivity interlayer insulating film, and which can significantly improve the performance such as signal transmission characteristics of the multilayered circuit board such as a package and a printed board, because the surface in contact with the interlayer insulating film of the circuit board has no unevenness to eliminate the lowering of production yield and the deterioration of high-frequency signal transmission characteristics; and electronic equipment using the circuit board.