Abstract: Provided are a liquid crystal polymer (LCP) film and a laminate comprising the same. The LCP film has a first surface and a second surface opposite each other, and a ratio of a ten-point mean roughness relative to a maximum height (Rz/Ry) of the first surface is from 0.30 to 0.62. By controlling Rz/Ry of at least one surface of the LCP film, the peel strength of the LCP film stacked to a metal foil can be increased, and the laminate comprising the same can still maintain the merit of low insertion loss.

Abstract: Provided are a laminate, a circuit board, and a liquid crystal polymer (LCP) film comprised therein. The laminate comprises a metal foil and an LCP film. The LCP film in the laminate has a dissipation factor before water absorption (Df?0), a dissipation factor after water absorption (Df?1), and a relative percentage difference between dissipation factors (?Df?), which is calculated by the following equation: ? ? D ? f ? ? ? ( % ) = ? Df 1 ? - D ? f 0 ? ? D ? f 0 ? × 1 ? 00 ? % ; wherein ?Df? may be less than or equal to 16%. By controlling ?Df? of the LCP film in the laminate, the insertion loss of a circuit board comprising a laminate during signal transmission in low-, medium-, and/or high-frequency bands is decreased and/or inhibited. In addition, the difference between the insertion losses of signal transmission before and after water absorption is decreased, so the laminate is suitable for high-end or outdoor high-frequency electronic products.

Abstract: Products of glycidyl ether of a mono or polyhydric phenol as well as methods to manufacture the same. In some instances, the product of glycidyl ether of a mono or polyhydric phenol has an epoxy equivalent weight (“EEW”) and a hydroxyl value (“HV”), wherein the epoxy equivalent weight multiplied by the hydroxyl value (EEWxHV) is a value from 1 to 10. A process for producing the product of glycidyl ether of a mono or polyhydric phenol typically includes reacting an epihalohydrin with a mono or polyhydric phenol in the presence of a catalyst to produce a halohydrin ether; and dehalogenating the halohydrin ether to form the product of glycidyl ether of a mono or polyhydric phenol.

Abstract: The present invention provides epoxy resin compounds comprising a high phosphorus and oxazolidone content, methods to prepare these epoxy resin compounds, curable compositions comprising these epoxy resins, and cured epoxy resin compounds by curing the curable epoxy resin compounds comprising a high phosphorus and oxazolidone content.

Abstract: The present invention provides epoxy resin compounds comprising a high phosphorus and oxazolidone content, methods to prepare these epoxy resin compounds, curable compositions comprising these epoxy resins, and cured epoxy resin compounds by curing the curable epoxy resin compounds comprising a high phosphorus and oxazolidone content.

Abstract: A preparation method of a polyurethane resin including the following steps is provided. A liquid polyamine compound is placed in a continuous reaction system, and the liquid polyamine compound is circulated in the continuous reaction system. A solid bis(cyclic carbonate) and a solid catalyst are placed in the continuous reaction system to mix the solid bis(cyclic carbonate), solid catalyst, and liquid polyamine compound to form a heterogeneous mixture. The heterogeneous mixture is heated in the continuous reaction system in a microwave manner, such that the heterogeneous mixture reacts to form a polyurethane resin.

Abstract: The present invention relates to a phosphinated poly(2,6-dimethy phenylene oxide)oligomer, specifically an unsaturated group-containing phosphinated poly(2,6-dimethy phenylene oxide)oligomer, and processes for producing the same. A thermoset produced from the unsaturated group-containing phosphinated poly(2,6-dimethy phenylene oxide)oligomers according to the present invention exhibits flame retardancy and has a low dielectric constant and dissipation factor and a high glass transition temperature.

Abstract: The present invention provides a photosensitive resin composition, comprising: (a) photo-polymerizable unsaturated compound, (b) hydroxyurethane compound, and (c) photoinitiator. The photosensitive resin composition can be used as photoresist coating for dry film photoresist to manufacture the electronic components, such as print circuit board and so on. Further, the (b) hydroxyurethane compound having [CC]/[NH2] between 0.5 and 0.9, which increases the resolution, adhesion, and stripping ability of photosensitive resin composition for dry film photoresist, and improves the effectiveness and the quality of dry film photoresist for manufacturing printed circuit board and other electric component.

Abstract: The present invention is to provide polyether compounds having epoxy hydroxyl urethane group, as the following formula (I), (II) or (III) shows: and waterborne epoxy resin composition. Using the hydroxyl urethane as emulsifier, the obtained waterborne epoxy resin composition of the present invention has better stability and freeze-thaw resistance.

Abstract: A preparation method of a polyurethane resin including the following steps is provided. A liquid polyamine compound is placed in a continuous reaction system, and the liquid polyamine compound is circulated in the continuous reaction system. A solid bis(cyclic carbonate) and a solid catalyst are placed in the continuous reaction system to mix the solid bis(cyclic carbonate), solid catalyst, and liquid polyamine compound to form a heterogeneous mixture. The heterogeneous mixture is heated in the continuous reaction system in a microwave manner, such that the heterogeneous mixture reacts to form a polyurethane resin.

Abstract: Polyphenolic condensates and epoxidized products prepared from said condensates are prepared by a reaction utilizing multi catalysts to control the weight average molecular weight (Mw) and the number average molecular weight (Mn). Improved color and ultraviolet absorbance are possessed by the condensates described herein.

Abstract: The present invention provides a photosensitive resin composition, comprising: (a) photo-polymerizable unsaturated compound, (b) hydroxyurethane compound, and (c) photoinitiator. The photosensitive resin composition can be used as photoresist coating for dry film photoresist to manufacture the electronic components, such as print circuit board and so on. Further, the (b) hydroxyurethane compound having [CC]/[NH2] between 0.5 and 0.9, which increases the resolution, adhesion, and stripping ability of photosensitive resin composition for dry film photoresist, and improves the effectiveness and the quality of dry film photoresist for manufacturing printed circuit board and other electric component.

Abstract: Polyphenolic condensates and epoxidized products prepared from said condensates are prepared by a reaction utilizing multi catalysts to control the weight average molecular weight (Mw) and the number average molecular weight (Mn). Improved color and ultraviolet absorbance are possessed by the condensates described herein.

Abstract: The present invention is to provide polyether compounds having epoxy hydroxyl urethane group, as the following formula (I), (II) or (III) shows: and waterborne epoxy resin composition. Using the hydroxyl urethane as emulsifier, the obtained waterborne epoxy resin composition of the present invention has better stability and freeze-thaw resistance.

Abstract: The present invention relates to a phosphinated poly(2,6-dimethy phenylene oxide)oligomer, specifically an unsaturated group-containing phosphinated poly(2,6-dimethy phenylene oxide)oligomer, and processes for producing the same. A thermoset produced from the unsaturated group-containing phosphinated poly(2,6-dimethy phenylene oxide)oligomers according to the present invention exhibits flame retardancy and has a low dielectric constant and dissipation factor and a high glass transition temperature.

Abstract: The instant disclosure relates to phosphorus-containing compounds that can be used to form flame retardant phosphorus-containing resins, and also can serve as a hardener for a flame retardant epoxy resin compositions. In particular, the phosphorus-containing compounds are modified with acyloxy groups (—O—(C?O)—R), as shown below. Incorporation of the acyloxy groups results in resins that are water resistant and exhibit improved dielectric properties.

Abstract: The instant disclosure relates to phosphorus-containing compounds that can be used to form flame retardant phosphorus-containing resins, and also can serve as a hardener for a flame retardant epoxy resin compositions. In particular, the phosphorus-containing compounds are modified with acyloxy groups (—O—(C?O)—R), as shown below. Incorporation of the acyloxy groups results in resins that are water resistant and exhibit improved dielectric properties.

Abstract: A series of novel phosphorus-containing compounds having the following formula is provided: in which: R1-R4, A, Q and m are as defined in the specification. A process for the preparation of the compound of formula (I) is also provided. A polymer of formula (PA), and preparation process and use thereof are further provided. A polymer of formula (PI), and preparation process and use thereof are also provided.

Abstract: The subject invention is related to a process for the epoxidation of olefin with peroxide, comprising reacting peroxide with olefin in the presence a solvent, wherein the solvent has Hansen Solubility Parameters (HSPs) of ?T,solvent and ?H,solvent and the epoxide product has Hansen Solubility Parameters (HSPs) of ?T,product and ?H,product, and wherein: ?T,product?6??T,solvent??T,product+6, and ?H,product?6??H,solvent.

Abstract: The subject invention is related to a continuous process of epoxidation of an olefin with supported heteropoly acid catalyst, which does not involve the use of an additive(s). The subject invention separates the products and oxides through a continuous process to reduce backmixing, thereby achieving an efficacy equal to that of a process involving the use of an additive. By excluding additives from the process, the subject invention has a lower cost, and avoids the need for additional wastewater treatment since no alkali metal or alkali earth metal compound is formed during the reaction. Moreover, the continuous process of the invention is also beneficial in industrial manufacturing.