Abstract: A polyimide resin composition modified with bismaleimide and cyanate, which comprises (a) polyimide resin, (b) cyanate, (c) bismalemide, and (d) nanometer filler. By using the present polyimide resin composition modified with bismalemide and cyanate, heat expansion coefficient of polyimide can be reduced. Also, heat resistance and dimension stability of the polyimide resin can be improved, and thus it is suitable for cladding with copper foil to produce printed circuit board.

Abstract: The present invention relates to a water soluble photosensitive polyimide polymer, preparation thereof and a photoresist composition containing the same. The water soluble photosensitive polyimide polymer is characterized by having repeat units represented by the following formula (I): the other symbols are defined in the specification].

Abstract: The present invention provides a phosphorus compound of formula (I). The phosphorus compound is prepared by reacting a compound of formula (II) with alkylene carbonate. As compared with the conventional phosphorus compounds as flame-resistant additives, the phosphorus compound of the present invention has not only a high pyrolysis temperature but also excellent solubility in most of the organic solvents with high or low polarity, and is therefore a suitable flame-resistant additive for use in thermosetting or thermoplastic resins.

Abstract: The present invention provides a phosphorus-containing compound of formula (I): wherein R1, R2, R3 and R4 are the same or different; and R1, R2, R3 and R4 are independently selected from the group consisting of hydrogen, halogen, C1-8 alkyl, haloalkyl, and alkoxy. The phosphorus-containing compound is prepared by bonding a bisphenol group to a phosphorus atom to prevent the phosphorus-containing heterocyclic molecule from exhibiting steric hindrance on hydroxyl functional groups, thereby increasing reactivity in the subsequent reactions.

Abstract: The present invention relates to all-aromatic polyesters, a method for preparing the same, and a polyester composition containing the same. The present method is carried out in two stages of first carrying out a prepolymerization to obtain a prepolymer having a specific particle size distribution, then carrying out a solid polymerization. The present method can control the quality of polyester effectively and produce all-aromatic polyester exhibiting excellent flowability, high heat resistance, and high solder heat resistance.

Abstract: A phenolic resin having not more than 5 wt% of free bisphenol and a molecular weight distribution Mw/Mn of not more than 2.0 is prepared by reacting a bisphenol and aldehyde in the presence of an alkaline catalyst at a temperature of from 0° C. to 100° C., neutralizing with an acid, adding an acid to adjust the pH to from 0 to 6, heating to a temperature of from 50° C. to 200° C, and vacuuming to recover the phenolic resin.

Abstract: The Phosphorus-containing bisphenols and preparing method thereof are disclosed. A method for producing the phosphorus-containing bisphenol of the general formula (1) includes reacting compounds respectively defined by a general formula (a), (b), (c) and an acid catalyst to yield compounds of phosphorus-containing bisphenol.

Abstract: A series of novel phosphorus-containing compounds having the following formula is provided: in which: R1-R4, A, Q and m are as defined in the specification. A process for the preparation of the compound of formula (I) is also provided. A polymer of formula (PA), and preparation process and use thereof are further provided. A polymer of formula (PI), and preparation process and use thereof are also provided.

Abstract: A series of novel phosphorus-containing compounds having the following formula are disclosed: wherein R1-R12, A, B, D, X, and Y are as defined in the specification. A process for the preparation of the compound of formula (1), a curing agent, and a flame resistant epoxy resin and a preparation process thereof are also provided.

Abstract: The present invention relates to a flame-retarding epoxy resin composition containing no halogen, which comprises an epoxy resin containing no halogen, a toughening agent, and a flame retarding agent. The present flame-retarding epoxy resin composition exhibits a high heat-resistance and excellent adhesion and is useful as adhesive agent in flexible printed circuit board.

Abstract: The present invention provides phosphorus-based oxazine compounds and the preparation method thereof. The phosphorus-based oxazine compounds of the present invention can provide better fire-resistant characteristics, while the preparation method for the phosphorus-based oxazine compound of the present invention can offer high yields and/or high purity phosphorus-based oxazine compounds.

Abstract: The present invention provides phosphorus-based oxazine compounds and the preparation method thereof. The phosphorus-based oxazine compounds of the present invention can provide better fire-resistant characteristics, while the preparation method for the phosphorus-based oxazine compound of the present invention can offer high yields and/or high purity phosphorus-based oxazine compounds.

Abstract: The present invention relates to an ultraviolet curable resin of the present invention which is prepared from alkyl(meth)acrylates, glycidyl(meth)acrylate, and substituted or unsubstituted acrylic acid, wherein the resin contains terminal vinyl group in amount of at least 50 wt % based on the resin and its glass transition temperature (Tg) is in a range of from 40˜100° C. The present invention also relates to a resin composition containing the ultraviolet curable resin.

Abstract: A flame resistant resin composition is provided, which includes: (A) at least an epoxy resin having a biphenylic unit or a naphthalenic unit; (B) phenolic resins used as a curing agent, the phenolic resins include at least a phenolic resin having a biphenylic moiety and a polyphenolic moiety, wherein the the at least a phenolic resin having a biphenylic moiety and a polyphenolic moiety is in an amount of 30 to 100 wt % of the total weight of the curing agents; (C) a curing-promoting agent; and (D) an inorganic filler material. The resin composition includes an epoxy resin having a biphenylic unit or a naphthalenic unit and the phenolic resin having a biphenylic moiety and a polyphenolic moiety as a curing agent, such that excellent flame resistance can be achieved without adding flame resistant agents. The resin composition also has a higher glass transition temperature to improve the water absorption issue after curing, and increases heat stability.

Abstract: A method for producing a melamine salt of bis(pentaerythritol phosphate) phosphoric acid is proposed. The method includes the steps of reacting and mixing pentaerythritol and diphosphorous pentaoxide in an extruder to carry out esterification to produce bis(pentaerythritol phosphate) phosphoric acid; and mixing bis(pentaerythritol phosphate) phosphoric acid with melamine or a derivative thereof to carry out quaternization in the presence of a solvent, followed by removing water to obtain a melamine salt of bis(pentaerythritol phosphate) phosphoric acid. Diphosphorous pentaoxide is used in the method as a reactant, so that no hydrogen chloride is produced and it is not necessary to recollect trichlorophosphoric acid. Moreover, in the method of the present invention, such that esterification time can be shortened and a high pressure in a closed reaction system that causes explosion can be avoided.

Abstract: The present invention relates to a thermoset resin modified polyimide resin composition, which comprises (a) polyimide resin, (b) cyanate, (c)bismaleimide, and (d) nanometer filler. By using the present thermoset resin modified polyimide resin composition, heat expansion coefficient of polyimide can be reduced. Also, heat resistance and dimension stability of the polyimide resin can be improved and thus it is suitable for cladding with copper foil to produce printed circuit board.

Abstract: The present invention relates to all-aromatic polyesters, a method for preparing the same, and a polyester composition containing the same. The present method is carried out in two stages of first carrying out a prepolymerization to obtain a prepolymer having a specific particle size distribution, then carrying out a solid polymerization. The present method can control the quality of polyester effectively and produce all-aromatic polyester exhibiting excellent flowability, high heat resistance, and high solder heat resistance.

Abstract: The present invention relates to a polyimide composite flexible board and a process for preparing the same. The process comprises sequentially applying polyamic acids individually having a coefficient of thermal expansion (CTE) after imidization of more than 20 ppm and less than 20 ppm on a metal foil, subsequently subjecting the polyamic acids to imidization into polyimide by heating, to produce a polyimide composite flexible board, which is used as a printed circuit flexible board. According to the present invention, it can obtain a polyimide composite flexible board having an excellent mechanical property, high heat resistance, and excellent dimension stability, and no warp without using an adhering agent.

Abstract: The present invention relates to a polyimide composite flexible board and a process for preparing the same. The process comprises mixing a polyamic acid resin having a CTE value after imidization of more than 20 ppm and a polyamic acid resin having a CTE value after imidization of less than 20 ppm in a certain ratio, and coating the mixture on a metal foil, then subjecting the polyamic acids to imidization, to obtain the polyimide composite flexible board. According to the present invention, it can obtain a polyimide composite flexible board having an excellent mechanical property, high heat resistance, and excellent dimension stability, and no warp without using an adhering agent.

Abstract: The present invention relates to a polyimide composite flexible board and a process for preparing the same. The process comprises sequentially applying polyamic acids individually having a glass transition temperature of from 280 to 330° C. and from 190 to 280° C. after imidization on a metal foil, subsequently subjecting the polyamic acids to imidization into polyimide by heating, and then pressing the polyimide-containing metal foil with each other or with another metal foil under high temperature to produce a two-metal-side printed circuit flexible board. According to the present invention, it can obtain a polyimide composite flexible board having an excellent mechanical property, high heat resistance, and excellent dimension stability without using an adhering agent.