Abstract: A nonflammable resin composition comprises (A) at least an epoxy resin with biphenyl unit or naphthyl unit; (B) at least a phenolic resin used as a hardener, wherein the phenolic resin has a skeleton formed by phenyl rings bonding directly each other without interruption, and is in an amount of 30 to 100% by weight based on total hardeners; and (C) a curing catalyst. The said nonflammable resin has an excellent flame retardancy, a good heat resistance, and an improved moldability and reliability.

Abstract: The present invention relates to a polyimide composite flexible board and a process for preparing the same. The process comprises sequentially applying polyamic acids each having a glass transition temperature of from 280 to 300° C., from 300 to 350° C., and from 190 to 280° C. after imidization on a metal foil, subsequently subjecting the polyamic acids to imidization into polyimide by heating, and then pressing the polyimide-containing metal foil with a metal foil under high temperature to produce a two-metal-side printed circuit flexible board. According to the present invention, it can obtain a polyimide composite flexible board having an excellent mechanical property, high heat resistance, and excellent dimension stability without using an adhering agent.

Abstract: The present invention relates to a novel phenolic resin, which is characterized that the content of free bisphenol contained therein is not more than 5 wt %, and it has a narrow molecular weight distribution represented by Mw/Mn that is not more than 2.0. The present invention also relates to a method for preparing the novel phenolic resin described above and an epoxy resin composition in which the phenolic resin is used as a curing agent.

Abstract: A multi metal base hardfacing alloy is provided. The atom percent of each element in the alloy is smaller than 35%. When the alloy is used as a welding material, it has advantages such as low operating temperature, better physical strength hardiness, acid resistance, basic resistance, anti-oxidation, and interface obturation.

Abstract: The present invention relates to a flame-retarding epoxy resin composition containing no halogen, which comprises an epoxy resin containing no halogen, a toughening agent, and a flame retarding agent. The present flame-retarding epoxy resin composition exhibits a high heat-resistance and excellent adhesion and is useful as adhesive agent in flexible printed circuit board.

Abstract: Disclosed is an azaoxa heterocyclic compound represented by the following formula (I): (wherein, each symbol is defined the same as in the specification) and a method for preparing the same. This compound of the present invention is prepared by the reaction of a phenolic compound, an aromatic diamine compound and an aldehyde compound. The azaoxa heterocyclic compound of the present invention can be used as a hardening resin or a hardener for an epoxy resin, polyether and a resin containing active hydrogen atoms, wherein the composition formed by the azaoxa heterocyclic compound and the epoxy resin is useful in the application of laminates, adhesive, semiconductor packaging materials and phenolic resin forming materials.

Abstract: The present invention relates to a polyamic acid resin composition, which is characterized by containing nanolayer silica sheet and/or nanometer silica powder. The present invention also relates to a polyimide film prepared from the composition, the resultant film exhibits improved dimension stability, low water-absorbability, high transparency, and low Coefficient of Thermal Expansion (CTE) value and is suitable used in flexible print wiring board and wiring board for liquid crystal display (LCD).

Abstract: The present invention provides a polyimide resin formed by polycondensating a dianhydride monomer including at least a dianhydride monomer represented by formula (I) and a diamine monomer to form a polyamic acid resin, and then cyclodehydrating the polyamic acid. Through using the dianhydride monomer of formula (I) as the polymerizing unit, a biphenyl moiety is introduced into the main chain of polyimide resin, such that the resulting polyimide resin has lower moisture absorption and smaller thermal expansion coefficient, as well as satisfactory heat resistance and dimensional stability.

Abstract: The present invention provides a polyimide resin, which is prepared by epolycondensing a dianhydride monomer including at least a dianhydride represented by formula (I) wherein R is O or O(CH2)nO, n is an integer of 1 to 2 and a diamine monomer represented by formula (II) H2N—Ar—NH2 ??(II) wherein Ar is defined as in the text then imidizing the resulting polyamic acid resin to form a polyimide resin. Through using the dianhydride represented by formula (I) as the polymerizing unit, a biphenyl moiety and an ester moiety are introduced into the main chain of the polyimide resin, such that the resulting polyimide resin has lower moisture absorption and smaller linear thermal expansion coefficient and therefore have satisfactory heat resistance and dimensional stability, in addition, become more soluble in organic solvents.

Abstract: The present invention provides a polyoxyalkylene amine-modified polyamideimide resin and a polyamideimide resin composition includes said polyoxyalkylene amine-modified polyamideimide resin, a thermosetting resin and a rubber elastomer, and may further include an inorganic filler. The polyamideimide resin composition of the present invention has high heat resistance and high bond strength and can achieve sufficient adhesion at lower temperature, for example, 160 to 180° C. Thus, the resin composition of the present invention is suitable for use in bonding circuit boards and IC members.

Abstract: A halogen-free resin composition is provided, comprising: (A) one or more phosphorous-containing epoxy resins; (B) a hardener; and (C) a hardening accelerator, wherein the hardener of component (B) has the structure represented by the following formula (I): wherein, each symbol is defined as in the specification. The halogen-free resin composition of the present invention has excellent thermal resistance and flame retardant property, and is thereby suitably useful in the application of adhesives, composite materials, laminated plates, printed circuit boards, copper foil adhesives, inks used for build-up process, semiconductor packaging materials, and the like.

Abstract: The present invention relates to a phosphorus-containing epoxy resin, which is an epoxy resin modified with a side chain having a reactive phosphorus-containing compound. Also, the present invention relates to a flame-retardant resin composition, which comprises: (1) the phosphorus-containing epoxy resin, (2) a halogen-free hardener having a reactive hydrogen capable of reacting with the epoxy group in epoxy resin, and (3) a hardener promoter. The flame-retardant resin composition described above has improved excellent heat resistance and flame retardant property, and is especially suitable for adhesive laminates, composite materials, printed circuit boards, adhesive material for copper foils, and is suitable for IC packaging materials.

Abstract: A positive photoresist with uniform reactivity for use in a thick film lithography process, includes thermal curing during soft-baking and photo dissociation through UV exposure. The positive photoresist comprises a phenolic resin, a resin with acid labile groups, a photoacid generator (PAG), and a reactive monomer with vinyl ether or epoxy group. First, the resins react with the reactive monomer to perform a thermal curing step by soft-baking to form network polymers. In the UV lithography process, the exposed network polymers perform both deprotection and depolymerization simultaneously and are rendered alkali-soluble. The resulting photoresist patterns have a high aspect ratio and resolution profile, due to the good alkali dissolution contrast and uniform reactivity.

Abstract: A phosphorus-containing compound represented by formula (I) and a preparation method thereof are provided. An addition reaction is performed for an organic cyclic phosphorus compound with an aryl aldehyde compound, and then a condensation reaction is performed with an aryl compound having active hydrogen in the use of an organic acid as a catalyst to obtain the proposed phosphorus-containing compound. This phosphorus-containing compound can be used as a hardener for resin, and improves flame retardant properties and thermal resistance for a flame retardant epoxy resin composition, thereby suitably applied to resin compositions used for manufacturing printed circuit boards and laminated circuit boards in electronic or electric products.

Abstract: Disclosed is a halogen-free resin composition comprising: (A) one or more phosphorus-containing epoxy resins; (B) a hardener; (C) a hardening accelerator; (D) a polyphenylene oxide resin; and (E) a filling material, wherein the hardener of component B has the structure represented by the following formula (I): wherein each symbol is as defined above. The halogen-free resin composition of the present invention without adding halogen has excellent heat resistance and flame retardant property, and excellent dielectric property. The halogen-free resin composition of the present invention is particularly useful in the application of bonding sheets, composite materials, laminated plates, printed circuit boards, copper foil adhesives, inks used for build-up process, semiconductor packaging materials and the like.

Abstract: Disclosed is an azaoxa heterocyclic compound represented by the following formula (I): (wherein, each symbol is defined the same as in the specification) and a method for preparing the same. This compound of the present invention is prepared by the reaction of a phenolic compound, an aromatic diamine compound and an aldehyde compound. The azaoxa heterocyclic compound of the present invention can be used as a hardening resin or a hardener for an epoxy resin, polyether and a resin containing active hydrogen atoms, wherein the composition formed by the azaoxa heterocyclic compound and the epoxy resin is useful in the application of laminates, adhesive, semiconductor packaging materials and phenolic resin forming materials.

Abstract: A positive photoresist WITHuniform reactivity for use in a thick film lithography process, includes thermal curing during soft-baking and photo dissociation through UV exposure. The positive photoresist comprises a phenolic resin, a resin with acid labile groups, a photoacid generator (PAG), and a reactive monomer with vinyl ether or epoxy group. First, the resins react with the reactive monomer to perform a thermal curing step by soft-baking to form network polymers. In the UV lithography process, the exposed network polymers perform both deprotection and depolymerization simultaneously and are rendered alkali-soluble. The resulting photoresist patterns have a high aspect ratio and resolution profile, due to the good alkali dissolution contrast and uniform reactivity.

Abstract: An epoxy resin composition containing (A) at least two kinds of epoxy resins, wherein the epoxy resin represented by Formula (I) is in an amount of 10 to 90% by weight based on the total amount of the epoxy resins, (B) a hardener and (C) a hardening accelerator is proposed: 1

Abstract: A halogen-free resin composition is provided, comprising: (A) one or more phosphorous-containing epoxy resins; (B) a hardener; and (C) a hardening accelerator, wherein the hardener of component (B) has the structure represented by the following formula (I): 1

Abstract: Disclosed is a halogen-free resin composition comprising: (A) one or more phosphorus-containing epoxy resins; (B) a hardener; (C) a hardening accelerator; (D) a polyphenylene oxide resin; and (E) a filling material, wherein the hardener of component B has the structure represented by the following formula (I): 1