Abstract: An improved method and apparatus for imaging and milling a substrate using a FIB system. Preferred embodiments of the present invention use a mixture of light and heavy ions, focused to the same focal point by the same beam optics, to simultaneously mill the sample surface (primarily with the heavy ions) while the light ions penetrate deeper into the sample to allow the generation of images of subsurface features. Among other uses, preferred embodiments of the present invention provide improved methods of navigation and sample processing that can be used for various circuit edit applications, such as backside circuit edit.

Abstract: An improved method of high accuracy beam placement for local area navigation in the field of semiconductor chip manufacturing. This invention demonstrates a method where high accuracy navigation to the site of interest within a relatively large local area (e.g. an area 200 ?m×200 ?m) is possible even where the stage/navigation system is not normally capable of such high accuracy navigation. The combination of large area, high-resolution scanning, digital zoom and registration of the image to an idealized coordinate system enables navigation around a local area without relying on stage movements. Once the image is acquired any sample or beam drift will not affect the alignment. Preferred embodiments thus allow accurate navigation to a site on a sample with sub-100 nm accuracy, even without a high-accuracy stage/navigation system.

Abstract: A charged particle beam system for processing substrates is disclosed, comprising a charged particle column, combination infrared radiation and visible light illumination and imaging subsystems, in-vacuum optics, and a precision stage for supporting and positioning the substrate alternately under the charged particle column and the imaging system. The axes of the charged particle column and imaging system are offset to enable much closer working distances for both imaging and beam processing than would be possible in a single integrated assembly. A method for extremely accurately calibrating the offset between the column and imaging system is disclosed, enabling beam processing at precisely-determined locations on the substrate. The imaging system is capable of locating sub-surface features on the substrate which cannot be seen using the charged particle beam. Two illumination modes are disclosed, enabling both bright-field and dark-field imaging in infrared radiation and visible light.

Abstract: An improved method of high accuracy beam placement for local area navigation in the field of semiconductor chip manufacturing. This invention demonstrates a method where high accuracy navigation to the site of interest within a relatively large local area (e.g. an area 200 ?m×200 ?m) is possible even where the stage/navigation system is not normally capable of such high accuracy navigation. The combination of large area, high-resolution scanning, digital zoom and registration of the image to an idealized coordinate system enables navigation around a local area without relying on stage movements. Once the image is acquired any sample or beam drift will not affect the alignment. Preferred embodiments thus allow accurate navigation to a site on a sample with sub-100 nm accuracy, even without a high-accuracy stage/navigation system.

Abstract: An apparatus for simultaneous parallel processing of a sample using light energy for optical viewing or surface processing in parallel with a charged particle beam. A charged particle beam transmits a focused ion beam or an electron beam along a path to a sample. An optical microscope transmits light along a first path to the sample, and a prism aligned along the first light path reflects light into a second light path toward the sample. A portion of the prism and reflective surface is removed for passage of the charged particle beam. A lens is aligned along the second light path and has a portion removed for passage of the charged particle beam. The removed portions of the prism and lens are aligned along the charged particle beam path to permit parallel delivery of the charged particle beam and the light to substantially the same portion of the sample.

Abstract: An improved method of high accuracy beam placement for local area navigation in the field of semiconductor chip manufacturing. This invention demonstrates a method where high accuracy navigation to the site of interest within a relatively large local area (e.g. an area 200 ?m×200 ?m) is possible even where the stage/navigation system is not normally capable of such high accuracy navigation. The combination of large area, high-resolution scanning, digital zoom and registration of the image to an idealized coordinate system enables navigation around a local area without relying on stage movements. Once the image is acquired any sample or beam drift will not affect the alignment. Preferred embodiments thus allow accurate navigation to a site on a sample with sub-100 nm accuracy, even without a high-accuracy stage/navigation system.

Abstract: An apparatus for simultaneous parallel processing of a sample using light energy for optical viewing or surface processing in parallel with a charged particle beam. A charged particle beam transmits a focused ion beam or an electron beam along a path to a sample. An optical microscope transmits light along a first path to the sample, and a prism aligned along the first light path reflects light into a second light path toward the sample. A portion of the prism and reflective surface is removed for passage of the charged particle beam. A lens is aligned along the second light path and has a portion removed for passage of the charged particle beam. The removed portions of the prism and lens are aligned along the charged particle beam path to permit parallel delivery of the charged particle beam and the light to substantially the same portion of the sample.

Abstract: An optical-fiber based light channel system is included in an ion/electron beam tool for imaging and/or processing integrated circuits. The optical channel system includes an image collection portion, an optical fiber image transmission portion and a detector portion. The image collection portion includes micro-optical components and has submillimeter dimensions, so that it is easily accommodated within the working distance of the ion/electron beam tool. The entire system is sufficiently compact and lightweight so that it may easily be mounted on a translation stage inside the sample chamber, which permits the optical channel to be mechanically extended and retracted to avoid blocking the primary ion or electron beam. The system may be mounted to a translation stage or to a gas injector assembly, which may itself be mounted to a flange plate on the chamber wall with feed-through ports for electrical and optical signals.

Abstract: An optical-fiber based light channel system is included in an ion/electron beam tool for imaging and/or processing integrated circuits. The optical channel system includes an image collection portion, an optical fiber image transmission portion and a detector portion. The image collection portion includes micro-optical components and has submillimeter dimensions, so that it is easily accommodated within the working distance of the ion/electron beam tool. The entire system is sufficiently compact and lightweight so that it may easily be mounted on a translation stage inside the sample chamber, which permits the optical channel to be mechanically extended and retracted to avoid blocking the primary ion or electron beam. The system may be mounted to a translation stage or to a gas injector assembly, which may itself be mounted to a flange plate on the chamber wall with feed-through ports for electrical and optical signals.

Abstract: Detection of weak ion currents scattered from a sample by an ion beam is improved by the use of a multiplier system in which a conversion electrode converts incident ions to a number of secondary electrons multiplied by a multiplication factor, the secondary electrons being attracted to an electron detector by an appropriate bias. In one version, the detector is a two stage system, in which the secondary electrons strike a scintillator that emits photons that are detected in a photon detector such as a photomultiplier or a CCD.

Abstract: Detection of weak ion currents scattered from a sample by an ion beam is improved by the use of a multiplier system in which a conversion electrode converts incident ions to a number of secondary electrons multiplied by a multiplication factor, the secondary electrons being attracted to an electron detector by an appropriate bias. In one version, the detector is a two stage system, in which the secondary electrons strike a scintillator that emits photons that are detected in a photon detector such as a photomultiplier or a CCD.

Abstract: An apparatus for manipulating the temperature of a sample used in focused ion beam FIB processing includes a base member, a thermoelectric module disposed over the base member, and a sample mounted on a mounting surface of the thermoelectric module. The thermoelectric module is configured so as to reduce the temperature of the sample with respect to an ambient FIB tool temperature.

Abstract: A method and structure for a sample processing apparatus that uses a vacuum enclosure is disclosed. A focused ion beam tool, sputter target, movable stage, and hinged mount are all included within the vacuum enclosure. The hinged mount includes a sample mounting portion, for holding a sample being processed in the vacuum enclosure, and a counterweight portion. The counterweight portion is connected to the sample mounting portion at an approximate right angle to the sample mounting portion. More specifically, one end of the sample mounting portion is connected to one end of the counterweight portion, such that the sample mounting portion and the counterweight portion form an approximate right angle. There is also an axis around which the mount rotates. The axis passes through the sample mounting portion and the counterweight portion at a location where the sample mounting portion and the counterweight portion connect to one another.

Abstract: The present invention is directed to methods for editing copper features embedded within an organic body by exposing at least a portion of a top surface of the copper feature, forming a mill box there-over and then simultaneously milling both the copper feature and any organic material exposed through the mill box in a single step using an ion beam in combination with a XeF2 gas for a dwell time of at least 10 milliseconds. The invention dramatically increases the efficiency of Focused Ion Beam milling of copper features embedded in organic layers by milling these features in a gas-depleted environment at significantly increased dwell time while avoiding the problems of graphitization, destruction of the organic layer and metal redeposition.

Abstract: Very small scale altering of features of an existing pattern, such as of an IC or photomask can be edited wherein a chemical reactant and/or activating energy is localized to the site of the target feature. In this manner, the alteration can be contained in a highly localized area such that other portions of the pattern remain substantially unaffected. The activating energy may be delivered by far-field and/or near field techniques. In one embodiment, the energy is converted into thermal energy at the site by interaction with the apex of a probe where the apex is proximate to the site. In another embodiment, the energy is converted to a plasma by spaced electrodes at the apex of the probe in combination with activating energy of at least two specifically selected wavelengths. The method can be applied to the repair and/or metrology of very small features of densely patterned substrates, e.g., an integrated circuit, package, photomask, etc.

Abstract: A system and method are provided for altering a very small surface area of a feature of a substrate. The disclosed system includes a localized chemical delivery probe (LCDP) having a plurality of channels, in which each channel is adapted to carry a material through the probe to exit at an apex of the probe. The system further includes a way to maneuver the apex of the probe to a site proximate to the target feature on the surface. A first channel of the probe is preferably coupled to a source of chemical to assist in a reaction, and a second channel of the probe is preferably coupled to a second chemical, a diluting fluid, an expulsion gas, and/or suction to provide the same through the probe apex. In a preferred embodiment, a first chemical is delivered by a first channel of the probe to assist in an exothermic reaction to etch a low-K organic dielectric, and a diluting fluid or suction is provided by a second channel to confine the effect of the reaction.

Abstract: A method and structure for an apparatus for removing metal from an integrated circuit structure is disclosed. A container holds an integrated circuit structure that has a metal portion. An electronic device connected to the container produces an electronic field proximate to a limited region of the metal portion. A first supply connected to the container supplies an oxidizing agent within the container. A solvent supply connected to the container supplies solvent to the limited region of the metal portion.

Abstract: A method and structure for a sample processing apparatus that uses a vacuum enclosure is disclosed. A focused ion beam tool, sputter target, movable stage, and hinged mount are all included within the vacuum enclosure. The hinged mount includes a sample mounting portion, for holding a sample being processed in the vacuum enclosure, and a counterweight portion. The counterweight portion is connected to the sample mounting portion at an approximate right angle to the sample mounting portion. More specifically, one end of the sample mounting portion is connected to one end of the counterweight portion, such that the sample mounting portion and the counterweight portion form an approximate right angle. There is also an axis around which the mount rotates. The axis passes through the sample mounting portion and the counterweight portion at a location where the sample mounting portion and the counterweight portion connect to one another.

Abstract: The present invention is directed to methods for editing copper features embedded within an organic body by exposing at least a portion of a top surface of the copper feature, forming a mill box there-over and then simultaneously milling both the copper feature and any organic material exposed through the mill box in a single step using an ion beam in combination with a XeF2 gas for a dwell time of at least 10 milliseconds. The invention dramatically increases the efficiency of Focused Ion Beam milling of copper features embedded in organic layers by milling these features in a gas-depleted environment at significantly increased dwell time while avoiding the problems of graphitization, destruction of the organic layer and metal redeposition.

Abstract: A method of focused ion beam milling of a copper on a sample, and a focused ion beam apparatus. The method comprises the steps of exposing an area of copper on the sample; and forming a given feature in the copper area by using the focused ion beam to draw a mill box in the copper area, scanning the focused ion beam across the mill box for an extended period of time to remove a portion of the copper in the copper area and thereby to form the given feature, and introducing tetramethylcyclotetrasiloxane (TMCTS) in said area during the scanning step. After the copper feature is formed, a very light dose of XeF2 may be introduced to clean up any residue that may have formed.