Abstract: A method and structure for an apparatus for removing metal from an integrated circuit structure is disclosed. A container holds an integrated circuit structure that has a metal portion. An electronic device connected to the container produces an electronic field proximate to a limited region of the metal portion. A first supply connected to the container supplies an oxidizing agent within the container. A solvent supply connected to the container supplies solvent to the limited region of the metal portion.

Abstract: A micro-tool and corresponding method are disclosed herein for working a very small surface of a substrate. The micro-tool has a tip of diameter on the order of 1 mm or less for placement in close proximity to a location on a substrate to be worked, and at least two open electrodes located near an end of the tip, such that the gap between the open electrodes is on the order of a few microns or less. The micro-tool further includes a housing which holds the tip and wiring extending from the open electrodes to permit connection to a voltage source. When the electrodes of the micro-tool are connected by such wiring to a voltage, an electric field and electron emission arises between the open electrodes such that electron emission currents are established. In the corresponding method, a localized electric field is generated in close proximity to a substrate using a tool having at least two open electrodes with a gap between them on the order of a few microns or less, by applying a voltage to the open electrodes.