Patents by Inventor Chan Lim

Chan Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11713274
    Abstract: A mixed silver powder and a conductive paste comprising the powder are disclosed. The mixed silver powder is obtained by mixing two or more spherical silver powders having different properties from each other. The mixed powder may minimize the disadvantages of the respective types of the two or more powders and maximize the advantages thereof, thereby improving the characteristics of products. In addition, by comprehensively controlling the particle size distribution of surface-treated mixed silver powder and the particle diameter and specific gravity of primary particles, a high-density conductor pattern, a precise line pattern, and the suppression of aggregation over time can be simultaneously achieved.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: August 1, 2023
    Assignee: DAEJOO ELECTRONIC MATERIALS CO., LTD.
    Inventors: Chi Ho Yoon, Jin Ho Kwak, Won Jun Jo, Young Ho Lee, Jong Chan Lim, Moo Hyun Lim
  • Publication number: 20230238514
    Abstract: An embodiment of the present invention relates to a silicon-based carbon composite, a preparation method therefor, and an anode active material for a lithium secondary battery, comprising same, and, more specifically, the silicon-based carbon composite of the present invention is a silicon-based carbon composite having a core-shell structure, wherein the core comprises silicon, silicon oxide compound and magnesium silicate, the shell comprises at least two carbon layers comprising a first carbon layer and a second carbon layer, and the second carbon layer is reduced graphene oxide, and thus, during application of the silicon-based carbon composite to an anode active material for a secondary battery, the charge/discharge capacity, initial charge/discharge efficiency and capacity retention of the secondary battery can be improved.
    Type: Application
    Filed: June 2, 2020
    Publication date: July 27, 2023
    Applicant: DAEJOO ELECTRONIC MATERIALS CO., LTD.
    Inventors: Junghyun LEE, Heonsoo PARK, Seul Gi LEE, Hyun Hee LIM, Jong Chan LIM
  • Patent number: 11705386
    Abstract: A semiconductor device includes a substrate, an interlayer insulating layer on the substrate, a first etch stop layer on the substrate, a first through-silicon-via (TSV) configured to pass vertically through the substrate and the interlayer insulating layer, and a second TSV configured to pass vertically through the substrate, the interlayer insulating layer, and the first etch stop layer, wherein the second TSV has a width greater than that of the first TSV.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: July 18, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kwang Wuk Park, Sung Dong Cho, Eun Ji Kim, Hak Seung Lee, Dae Suk Lee, Dong Chan Lim, Sang Jun Park
  • Publication number: 20230187393
    Abstract: Disclosed is a semiconductor device including a conductive pattern on a substrate, a passivation layer on the substrate and including an opening that partially exposes the conductive pattern, and a pad structure in the opening of the passivation layer and connected to the conductive pattern. The pad structure includes a first metal layer that fills the opening of the passivation layer and has a width greater than that of the opening, and a second metal layer on the first metal layer. The first metal layer has a first thickness at an outer wall of the first metal layer, a second thickness on a top surface of the passivation layer, and a third thickness on a top surface of the conductive pattern. The second thickness is greater than the first thickness, and the third thickness is greater than the second thickness.
    Type: Application
    Filed: February 13, 2023
    Publication date: June 15, 2023
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Ju-il CHOI, Kwangjin Moon, Sujeong Park, JuBin Seo, Jin Ho An, Dong-chan Lim, Atsushi Fujisaki
  • Patent number: 11636959
    Abstract: A cable is provided having at least one elongated conductor surrounded by at least one cross-linked layer, said layer being obtained from a polymer composition comprising a polymer, a crosslinking agent, and an amine as co-crosslinking agent, wherein said amine has a nucleophilic value (N) of 14 or more.
    Type: Grant
    Filed: May 10, 2019
    Date of Patent: April 25, 2023
    Assignee: NEXANS
    Inventors: Dae-Up Ahn, Jun-Huei Bae, Jong-Chan Lim
  • Patent number: 11600552
    Abstract: A semiconductor device is provided. The semiconductor device includes a first insulating interlayer disposed on a first surface of a substrate; a pad pattern disposed on a lower surface of the first insulating interlayer, the pad pattern including a first copper pattern; and a through silicon via passing through the substrate and the first insulating interlayer, and contacting the first copper pattern of the pad pattern. The through silicon via includes a first portion passing through the substrate and the first insulating interlayer, and a second portion under the first portion and extending to a portion of the first copper pattern in the pad pattern. A boundary of the through silicon via has a bent portion between the first portion and the second portion.
    Type: Grant
    Filed: June 10, 2021
    Date of Patent: March 7, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ju-Bin Seo, Su-Jeong Park, Tae-Seong Kim, Kwang-Jin Moon, Dong-Chan Lim, Ju-Il Choi
  • Publication number: 20230049476
    Abstract: The present invention provides a silicon-silicon composite oxide-carbon composite, a method for preparing same, and a negative electrode active material for a lithium secondary battery, comprising same. More particularly, the silicon-silicon composite oxide-carbon composite of the present invention has a core-shell structure wherein the core comprises silicon, a silicon oxide compound, and magnesium silicate, and the shell comprises a carbon layer. In addition, by having a specific range of span values through the adjustment of particle size distribution of the composite, when used as a negative electrode active material of a secondary battery, the composite can improve not only the capacity of the secondary battery but also the cycle characteristics and initial efficiency thereof.
    Type: Application
    Filed: January 19, 2021
    Publication date: February 16, 2023
    Applicant: DAEJOO ELECTRONIC MATERIALS CO., LTD.
    Inventors: Eorang Lee, Heonsoo Park, Sung Woo Lim, Seung Min Oh, Jong Chan Lim
  • Patent number: 11581279
    Abstract: Disclosed is a semiconductor device including a conductive pattern on a substrate, a passivation layer on the substrate and including an opening that partially exposes the conductive pattern, and a pad structure in the opening of the passivation layer and connected to the conductive pattern. The pad structure includes a first metal layer that fills the opening of the passivation layer and has a width greater than that of the opening, and a second metal layer on the first metal layer. The first metal layer has a first thickness at an outer wall of the first metal layer, a second thickness on a top surface of the passivation layer, and a third thickness on a top surface of the conductive pattern. The second thickness is greater than the first thickness, and the third thickness is greater than the second thickness.
    Type: Grant
    Filed: April 13, 2021
    Date of Patent: February 14, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ju-il Choi, Kwangjin Moon, Sujeong Park, JuBin Seo, Jin Ho An, Dong-chan Lim, Atsushi Fujisaki
  • Patent number: 11511532
    Abstract: The present disclosure relates to a manufacturing method of a vehicle seatback cover, comprising a lightweight composite manufacturing step of manufacturing a lightweight composite using a reinforcing fiber and a thermoplastic resin fiber, a lightweight composite forming step of forming the lightweight composite into a vehicle seatback cover shape and preparing a vehicle seatback cover material, and a carpet bonding step of bonding the vehicle seatback cover material and a carpet material.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: November 29, 2022
    Assignee: LG HAUSYS, LTD.
    Inventors: Sung Chan Lim, Seunghyun Ahn, Kyungseok Han, Jiwon Lim, Heejune Kim
  • Publication number: 20220352156
    Abstract: A semiconductor device includes an interlayer dielectric layer on a substrate, a first connection line that fills a first trench of the interlayer dielectric layer, the first trench having a first width, and a second connection line that fills a second trench of the interlayer dielectric layer, the second trench having a second width greater than the first width, and the second connection line including a first metal layer that covers an inner sidewall of the second trench, a barrier layer that covers a bottom surface of the second trench, and a second metal layer on the first metal layer and the barrier layer, the first connection line and the first metal layer include a first metal, and the second metal layer includes a second metal different from the first metal.
    Type: Application
    Filed: June 22, 2022
    Publication date: November 3, 2022
    Inventors: Sunyoung NOH, Wandon KIM, Hyunbae LEE, Donggon YOO, Dong-Chan LIM
  • Patent number: 11488860
    Abstract: An integrated circuit device includes a substrate, a landing pad on the substrate, and a through-via structure passing through the substrate and connected to the landing pad. The through-via structure may include a conductive plug, a first conductive barrier layer covering a sidewall and a lower surface of the conductive plug, and a second conductive barrier layer covering a sidewall of the first conductive barrier layer.
    Type: Grant
    Filed: July 24, 2020
    Date of Patent: November 1, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Su-jeong Park, Dong-chan Lim, Kwang-jin Moon, Ju-bin Seo, Ju-Il Choi, Atsushi Fujisaki
  • Patent number: 11478951
    Abstract: A rule to be inserted into a die-board that is pressed onto a plate matter, the rule including: a multi-edge cutting blade having a cutting blade edge, the cutting blade edge divided into multiple sections with multiple spacings between the multiple sections; and a plurality of connecting pieces configured to fit into the multiple spacings and to provide support for the multiple sections of the cutting blade edge when the rule is pressed onto the plate matter.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: October 25, 2022
    Assignee: Seoul Laser Dieboard System Co., Ltd.
    Inventor: Kyong Chan Lim
  • Patent number: 11474420
    Abstract: An image projection device includes: a panel unit configured to emit light rays; a projection optical system configured to receive the light rays emitted from the panel unit and to refract the light rays; a reflection unit having a reflection surface for receiving the light rays refracted by the projection optical system and reflecting the light rays; and a screen unit configured to display an image upon receiving the light rays reflected from the reflection surface. The panel unit, the projection optical system, the reflection unit, and the screen unit are arranged such that a distance of a shortest path among paths extending from the panel unit to the reflection unit through the projection optical system along a predetermined linear axis is longer than a distance of a longest path among paths extending from the reflection unit to the screen unit along the predetermined linear axis.
    Type: Grant
    Filed: January 11, 2021
    Date of Patent: October 18, 2022
    Assignee: SK TELECOM CO., LTD.
    Inventors: Dong Youb Sinn, Yong Woo Bae, Seung Ho Shin, Jae Hwang Yu, Hak Soon Lee, Guk Chan Lim, Ku Ik Chung, Jin Yong Han
  • Publication number: 20220324748
    Abstract: A mixed silver powder and a conductive paste comprising the powder are disclosed. The mixed silver powder is obtained by mixing two or more spherical silver powders having different properties from each other. The mixed powder may minimize the disadvantages of the respective types of the two or more powders and maximize the advantages thereof, thereby improving the characteristics of products. In addition, by comprehensively controlling the particle size distribution of surface-treated mixed silver powder and the particle diameter and specific gravity of primary particles, a high-density conductor pattern, a precise line pattern, and the suppression of aggregation over time can be simultaneously achieved.
    Type: Application
    Filed: June 21, 2022
    Publication date: October 13, 2022
    Applicant: DAEJOO ELECTRONIC MATERIALS CO., LTD.
    Inventors: Chi Ho YOON, Jin Ho KWAK, Won Jun JO, Young Ho LEE, Jong Chan LIM, Moo Hyun LIM
  • Patent number: 11453775
    Abstract: Disclosed are: a thermoplastic elastomer resin composition comprising a thermoplastic elastomer resin and, as a reactive additive, a compound containing one or more isocyanurate functional groups; a molded product comprising the same.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: September 27, 2022
    Assignee: SAMYANG CORPORATION
    Inventors: Jae-Kwan Kwon, Jin Yoo, Cheol-Han Lee, Yong-Chan Lim, Sang-Hyun Park
  • Publication number: 20220302428
    Abstract: A secondary battery contains a lithium-predoped, silicon-based negative active material. The secondary battery realizes safety and further enhances energy density, cycle characteristics, and rate characteristics. The secondary battery can remarkably improve initial discharge capacity and capacity retention. A method for manufacturing the secondary battery is also disclosed. The method incudes preparing a negative electrode, interposing a separator between the negative electrode and a lithium metal plate to prepare a cell, electrochemically activating the cell to predope the negative electrode with lithium.
    Type: Application
    Filed: August 19, 2020
    Publication date: September 22, 2022
    Applicant: DAEJOO ELECTRONIC MATERIALS CO., LTD.
    Inventors: Hyun Hee LIM, Seung Min OH, Jong Chan LIM
  • Patent number: 11426795
    Abstract: The present invention relates to silver particles capable of having a uniform particle distribution, preventing agglomeration of a powder, and significantly improving dispersibility, the silver particles each having pores therein, and to a manufacturing method therefor and, more specifically, to a manufacturing method for silver particles, the method comprising a silver-complex forming step, a silver slurry preparing step, and a silver particle obtaining step, and to silver particles manufactured therefrom.
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: August 30, 2022
    Assignee: DAE JOO ELECTRONIC MATERIALS CO., LTD.
    Inventors: Sangwoo Kim, Chiho Yoon, Youngho Lee, Jong Chan Lim, Moohyun Lim, Wonjun Jo
  • Publication number: 20220271289
    Abstract: A silicon ? silicon oxide-carbon complex has a core-shell structure in which the core comprises silicon particles, a silicon oxide compound represented by SiOx (0<×2), and magnesium silicate, and the shell forms a carbon coating, and has a specific range of conductivity, whereby the use of the complex as a negative electrode active material for a secondary battery can provide the secondary battery with an improvement in capacity as well as cycle characteristics and initial efficiency.
    Type: Application
    Filed: August 19, 2020
    Publication date: August 25, 2022
    Applicant: DAEJOO ELECTRONIC MATERIALS CO., LTD
    Inventors: Seul Gi LEE, Hyeon Soo PARK, Seung Min OH, Jong Chan LIM
  • Patent number: 11421092
    Abstract: Provided are a method for preparing a unidirectionally aligned discontinuous fiber reinforcement composite material, a unidirectionally aligned discontinuous fiber reinforcement composite material, and a sandwich structure. The method for preparing a unidirectionally aligned discontinuous fiber reinforcement composite material comprises discontinuously aligning short fibers on a polymer substrate in one direction by using an air-laid method.
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: August 23, 2022
    Assignee: LG Hausys, Ltd.
    Inventors: Seung-Hyun Ahn, Kyung-Seok Han, Sung-Chan Lim, Hee-June Kim
  • Patent number: 11401200
    Abstract: A mixed silver powder and a conductive paste comprising the powder are disclosed. The mixed silver powder is obtained by mixing two or more spherical silver powders having different properties from each other. The mixed powder may minimize the disadvantages of the respective types of the two or more powders and maximize the advantages thereof, thereby improving the characteristics of products. In addition, by comprehensively controlling the particle size distribution of surface-treated mixed silver powder and the particle diameter and specific gravity of primary particles, a high-density conductor pattern, a precise line pattern, and the suppression of aggregation over time can be simultaneously achieved.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: August 2, 2022
    Assignee: DAEJOO ELECTRONIC MATERIALS CO., LTD.
    Inventors: Chi Ho Yoon, Jin Ho Kwak, Won Jun Jo, Young Ho Lee, Jong Chan Lim, Moo Hyun Lim