Abstract: The present invention discloses a titanium-alloy substrate which is formed plastically by performing die casting and forging to alloyed titanium at least one time. The present invention is characterized in that this titanium-alloy substrate is provided with a first structure layer which is arranged in a configuration of long axis crystal structure, and a second structure layer which is disposed on a side in adjacent to the first structure layer and is arranged in a configuration of equiaxed crystal structure.

Abstract: Techniques provided herein use aggregate endpoints in a virtual overlay network. In general, aggregate endpoints operate as a single receiving entity for certain packets/frames sent between different physical proximities of the virtual overlay network.

Abstract: A wireless charging method includes obtaining charging information of a plurality of electronic devices, and charging the plurality of electronic devices in sequence according to the charging information of the plurality of electronic devices. For each electronic device, a charging resonance frequency is chosen and accordingly the corresponding wireless charging power is provided for charging.

Abstract: An image processing method is provided. A first image is obtained at a first time point, the first image includes a first object image and a first background image, the first object image corresponds to the position of an object at the first time point. A second image is obtained at a second time point, the second image includes a second object image and a second background image, the second object image corresponds to the position of the object at the second time point, and the first and the second images are shot within substantially the same shooting range. A sum motion vector of the object is obtained according to the first and the second object images. The second object image is kept, and a process is applied to each pixel of the second background image in the second image to generate a third image.

Abstract: An image processing method is provided. The method includes following steps. Firstly, a first image is obtained by shooting photo at a first shutter speed, wherein the first image includes a first object image and a first background image, and the first object image and the first background image are clear. Next, a second image is obtained by shooting photo at a second shutter speed lower than the first shutter speed, wherein the second shutter speed is lower than the first shutter speed, the first image and the second image are obtained by shooting photo within substantially the same shooting range, the second image includes a second object image and a second background image, the second object image is blurry but the second background image is clear. After that, a third image is generated from at least the first image and the second object image.

Abstract: A cast molding method accomplishes the cast molding by a smelting chamber, a casting chamber, a hinge press system and a vacuum system. First, a metallic die is assembled in the casting chamber and then a metallic material is put in the smelting chamber. Next, the metallic material is heated up in a vacuum state and the casting chamber is pre-heated at a same time. After the metallic material in the smelting chamber has been melted down and the casting chamber has been vacuumized, the melted metallic material is filled into the metallic die, and then the hinge press system is turned on to cast mold the metallic die, resulting in a semi-solid product. After the semi-solid product has been cooled down, the product of cast molding is accomplished according to the present invention.

Abstract: An embodiment is MEMS device including a first MEMS die having a first cavity at a first pressure, a second MEMS die having a second cavity at a second pressure, the second pressure being different from the first pressure, and a molding material surrounding the first MEMS die and the second MEMS die, the molding material having a first surface over the first and the second MEMS dies. The device further includes a first set of electrical connectors in the molding material, each of the first set of electrical connectors coupling at least one of the first and the second MEMS dies to the first surface of the molding material, and a second set of electrical connectors over the first surface of the molding material, each of the second set of electrical connectors being coupled to at least one of the first set of electrical connectors.

Abstract: The present disclosure provides an input apparatus, which is coupled to a handheld electronic device. The input apparatus includes a touchpad and a processing unit. The touchpad includes a button region having a plurality of virtual buttons defined therein. The touchpad is used for sensing a touch gesture of a user over the button region and correspondingly generating a touch coordinate data and a touch pressure value. The processing unit is coupled to the touchpad. The processing unit determines whether to cause the handheld electronic device to enter a keyboard mode or a cursor control mode according to the touch pressure value. When the input apparatus operates in the keyboard mode, the processing unit outputs a button signal to the handheld electronic device. When the input apparatus operates in the cursor control mode, the processing unit outputs a cursor control signal to the handheld electronic device.

Abstract: Techniques provided herein use aggregate endpoints in a virtual overlay network. In general, aggregate endpoints operate as a single receiving entity for certain packets/frames sent between different physical proximities of the virtual overlay network.

Abstract: An external electronic device for connecting to a portable electronic device is disclosed in the present invention. The external electronic device includes a base, a sliding component, a holder and a first hinge mechanism. The sliding component is slidably disposed on the base. The holder includes a body, an accommodating portion, an attractive component and a pushing portion. The body supports the portable electronic device. The accommodating portion whereinside the magnetic is movably disposed is formed on the body. The holder utilizes a magnetic force to attract a magnetic of the portable electronic device, so as to connect the portable electronic device with the holder. The pushing portion is disposed on an outer surface of the body for contacting an inclined guiding structure of the sliding component, so as to move the sliding component relative to the base. The first hinge mechanism is disposed between the base and the holder.

Abstract: A method of forming a semiconductor device includes bonding a capping wafer and a base wafer to form a wafer package. The base wafer includes a first chip package portion, a second chip package portion, and a third chip package portion. The capping wafer includes a plurality of isolation trenches. Each isolation trench of the plurality of isolation trenches is substantially aligned with a corresponding trench region of one of the first chip package portion, the second chip package portion or the third chip package portion. The method also includes removing a portion of the capping wafer to expose a first chip package portion contact, a second chip package portion contact, and a third chip package portion contact. The method further includes separating the wafer package into a first chip package configured to perform a first operation, a second chip package configured to perform a second operation, and a third chip package configured to perform a third operation.

Abstract: A catalyst for a catalytic ink includes a support particle and a metallic material supported on the support particle. The metallic material is diamminesilver hydroxide, a silver salt, a palladium salt, a gold salt, chloroauric acid, or combinations thereof. A catalytic ink obtained from the catalyst and use of the same to fabricate a conductive circuit are also disclosed.

Abstract: A distributor private cloud management system and a management method are provided. The system includes a public cloud management device and a cluster device that provides a public cloud network. The public cloud management device plans, in the public cloud network according to distributor private cloud setting information input externally, a virtual private cloud network corresponding to the distributor private cloud setting information, and defines a private resource apparatus controlled and managed by the virtual private cloud network among network resource apparatuses included by the public cloud network. The present disclosure can properly improve a positioning and function of a distributor in a cloud service mechanism, and highlight value of the distributor in a cloud service.

Abstract: An embodiment is a method for forming a microelectromechanical system (MEMS) device. The method comprises forming a MEMS structure over a first substrate, wherein the MEMS structures comprises a movable element; forming a bonding structure over the first substrate; and forming a support structure over the first substrate, wherein the support structure protrudes from the bonding structure. The method further comprises bonding the MEMS structure to a second substrate; and forming a through substrate via (TSV) on a backside of the second substrate, wherein the overlying TSV is aligned with the bonding structure and the support structure.

Abstract: Techniques are provided for managing movements of virtual machines in a network. At a first switch, a virtual machine (VM) is detected. The VM is hosted by a physical server coupled to the first switch. A message is sent to other switches and it indicates that the VM is hosted by the physical server. When the first switch is paired with a second switch as a virtual port channel (vPC) pair, the message includes a switch identifier that identifies the second switch. A receiving switch receives the message from a source switch in the network comprising a route update associated with the VM. A routing table of the receiving switch is evaluated to determine whether the host route is associated with a server facing the physical port. The message is examined to determine it contains the switch identifier.

Abstract: A method for packaging a microelectromechanical system (MEMS) device with an integrated circuit die using through mold vias (TMVs) is provided. According to the method, a MEMS substrate having a MEMS device is provided. A cap substrate is secured to a top surface of the MEMS substrate. The cap substrate includes a recess corresponding to the MEMS device in a bottom surface of the cap substrate. An integrated circuit die is secured to a top surface of the cap substrate over the recess. A housing covering the MEMS substrate, the cap substrate, and the integrated circuit die is formed. A through mold via (TMV) electrically coupled with the integrated circuit die and extending between a top surface of the housing and the integrated circuit die is formed. The structure resulting from application of the method is also provided.

Abstract: A docking device including a casing and an extension supporting mechanism is disclosed. The extension supporting mechanism includes a sliding member, a transmission member, a supporting member and a clamping member. The sliding member is slidably disposed on the casing. The transmission member, the supporting member and the clamping member are pivoted to the casing, respectively. The transmission member is coupled to the sliding member. The supporting member is coupled to the transmission member. The clamping member further abuts against the sliding member and is for sliding the sliding member as rotating, such that the sliding member drives the transmission to rotate. Accordingly, the transmission member is driven to activate the supporting member to stretch an extension portion of the supporting member out of the casing.

Abstract: A hand-held computer apparatus includes a tablet having a first connecter and an accessory docking having a second connecter for connecting to the first connecter. The second connecter has a symmetric structure, which allows the first connecter to be plugged to the second connecter in a first or a second direction. The first direction and the second direction are opposite to each other at an angle of 180 degrees. When the tablet is in a first status, in which the tablet is plugged to the accessory docking in the first direction, the tablet enters a notebook mode. When the tablet is in a second status, in which the tablet is plugged to the accessory docking in the second direction, the tablet enters a tablet mode. When the tablet is in a third status, in which the tablet is unplugged from the accessory docking, the tablet enters a regular mode.

Abstract: Examples provided herein describe a female connector in a computing device that includes a plurality of sensors for determining if a male connector has established a proper connection with the female connector. To do so, in one example, each of the sensors is coupled to an actuator that protrudes into an aperture defined by an inner surface of the female connector. As the male connector is inserted into this aperture, the actuators are pressed down which activates the sensors. Furthermore, the actuators are arranged such that a first actuator is deeper within the aperture than a second actuator. Thus, if the male connector pressed down the first actuator but not the second, a computing device can determine that only a partially connection was made. By using at least two actuators arranged at different depths in the aperture, the computing device is able to detect a proper or improper connection.

Abstract: An embodiment is MEMS device including a first MEMS die having a first cavity at a first pressure, a second MEMS die having a second cavity at a second pressure, the second pressure being different from the first pressure, and a molding material surrounding the first MEMS die and the second MEMS die, the molding material having a first surface over the first and the second MEMS dies. The device further includes a first set of electrical connectors in the molding material, each of the first set of electrical connectors coupling at least one of the first and the second MEMS dies to the first surface of the molding material, and a second set of electrical connectors over the first surface of the molding material, each of the second set of electrical connectors being coupled to at least one of the first set of electrical connectors.