Abstract: Techniques are provided for managing movements of virtual machines in a network. At a first switch, a virtual machine (VM) is detected. The VM is hosted by a physical server coupled to the first switch. A message is sent to other switches and it indicates that the VM is hosted by the physical server. When the first switch is paired with a second switch as a virtual port channel (vPC) pair, the message includes a switch identifier that identifies the second switch. A receiving switch receives the message from a source switch in the network comprising a route update associated with the VM. A routing table of the receiving switch is evaluated to determine whether the host route is associated with a server facing the physical port. The message is examined to determine it contains the switch identifier.

Abstract: A wireless network photographing apparatus and a setting method thereof are provided, where the wireless network photographing apparatus includes a switching unit, a network unit, and a processing unit. The processing unit enables a server mode or a client mode according to switching setting of the switching unit. When enabling the server mode, the processing unit enables, by using the network unit, an electronic apparatus to connect to the processing unit and set an apparatus connection parameter. When enabling the client mode, the processing unit performs a network connection according to the apparatus connection parameter and by using the network unit.

Abstract: A method of forming a patterned metal unit on an article. The method includes the steps of: providing an article that has an insulating surface; transferring a catalyst layer onto the insulating surface of the article, the catalyst layer including a catalytic material; removing a part of the catalyst layer to form a patterned catalyst layer; and forming a patterned metal layer on the patterned catalyst layer by an electroless plating technique to obtain a patterned metal unit that is constituted by the patterned catalyst layer and the patterned metal layer.

Abstract: A method for packaging a microelectromechanical system (MEMS) device with an integrated circuit die using wire bonds is provided. According to the method, a MEMS substrate having a MEMS device is provided. A cap substrate is secured to a top surface of the MEMS substrate. The cap substrate includes a recess corresponding to the MEMS device in a bottom surface of the cap substrate. An integrated circuit die is secured to a top surface of the cap substrate over the recess. A conductive stud or external wire bond electrically coupled with the integrated circuit die and extending vertically up is formed. A housing covering the MEMS substrate, the cap substrate, and the integrated circuit die, and with a top surface approximately coplanar with a top surface of the conductive stud or external wire bond, is formed. The structure resulting from application of the method is also provided.

Abstract: A touch panel including a substrate, first sensing series, second sensing series, first lines and second lines is provided. Each first sensing series includes first electrode portions and first crossing portions. Each second sensing series includes second electrode portions and second crossing portions. Any adjacent two among the first electrode portions and the second electrode portions are separated by a spacing region. Each first crossing portion crosses one second crossing portion. The first lines respectively connect to the first sensing series and extend to a bonding region of the substrate. The second lines are disposed along the spacing region to respectively connect to the second sensing series and extend to the bonding region. One second line connected to an Nth second sensing series crosses one second crossing portion of an Mth second sensing series, wherein N and M are different positive integers.

Abstract: A method for packaging a microelectromechanical system (MEMS) device with an integrated circuit die using through mold vias (TMVs) is provided. According to the method, a MEMS substrate having a MEMS device is provided. A cap substrate is secured to a top surface of the MEMS substrate. The cap substrate includes a recess corresponding to the MEMS device in a bottom surface of the cap substrate. An integrated circuit die is secured to a top surface of the cap substrate over the recess. A housing covering the MEMS substrate, the cap substrate, and the integrated circuit die is formed. A through mold via (TMV) electrically coupled with the integrated circuit die and extending between a top surface of the housing and the integrated circuit die is formed. The structure resulting from application of the method is also provided.

Abstract: A method for packaging a microelectromechanical system (MEMS) device with an integrated circuit die using wire bonds is provided. According to the method, a MEMS substrate having a MEMS device is provided. A cap substrate is secured to a top surface of the MEMS substrate. The cap substrate includes a recess corresponding to the MEMS device in a bottom surface of the cap substrate. An integrated circuit die is secured to a top surface of the cap substrate over the recess. A conductive stud or external wire bond electrically coupled with the integrated circuit die and extending vertically up is formed. A housing covering the MEMS substrate, the cap substrate, and the integrated circuit die, and with a top surface approximately coplanar with a top surface of the conductive stud or external wire bond, is formed. The structure resulting from application of the method is also provided.

Abstract: A method of forming a semiconductor device includes bonding a capping wafer and a base wafer to form a wafer package. The base wafer includes a first chip package portion, a second chip package portion, and a third chip package portion. The capping wafer includes a plurality of isolation trenches. Each isolation trench of the plurality of isolation trenches is substantially aligned with a corresponding trench region of one of the first chip package portion, the second chip package portion or the third chip package portion. The method also includes removing a portion of the capping wafer to expose a first chip package portion contact, a second chip package portion contact, and a third chip package portion contact. The method further includes separating the wafer package into a first chip package configured to perform a first operation, a second chip package configured to perform a second operation, and a third chip package configured to perform a third operation.

Abstract: A docking device including a casing and an extension supporting mechanism is disclosed. The extension supporting mechanism includes a sliding member, a transmission member, a supporting member and a clamping member. The sliding member is slidably disposed on the casing. The transmission member, the supporting member and the clamping member are pivoted to the casing, respectively. The transmission member is coupled to the sliding member. The supporting member is coupled to the transmission member. The clamping member further abuts against the sliding member and is for sliding the sliding member as rotating, such that the sliding member drives the transmission to rotate. Accordingly, the transmission member is driven to activate the supporting member to stretch an extension portion of the supporting member out of the casing.

Abstract: A circuit-and-heat-dissipation assembly includes: a heat sink including a heat absorbing base and a heat dissipating element, the heat absorbing base having a circuit-forming surface and an element-forming surface, the heat dissipating element protruding from the element-forming surface for dissipating heat conducted from the heat absorbing base into an ambient environment; an insulator layer formed on the circuit-forming surface; and a patterned circuit formed on the insulator layer.

Abstract: A vacuum sealed MEMS and CMOS package and a process for making the same may include a capping wafer having a surface with a plurality of first cavities, a first device having a first surface with a second plurality of second cavities, a hermetic seal between the first surface of the first device and the surface of the capping wafer, and a second device having a first surface bonded to a second surface of the first device. The second device is a CMOS device with conductive through vias connecting the first device to a second surface of the second device, and conductive bumps on the second surface of the second device. Conductive bumps connect to the conductive through vias and wherein a plurality of conductive bumps connect to the second device. The hermetic seal forms a plurality of micro chambers between the capping wafer and the first device.

Abstract: An embodiment is a method for forming a microelectromechanical system (MEMS) device. The method comprises forming a MEMS structure over a first substrate, wherein the MEMS structures comprises a movable element; forming a bonding structure over the first substrate; and forming a support structure over the first substrate, wherein the support structure protrudes from the bonding structure. The method further comprises bonding the MEMS structure to a second substrate; and forming a through substrate via (TSV) on a backside of the second substrate, wherein the overlying TSV is aligned with the bonding structure and the support structure.

Abstract: A mold machining method for computer numerical control includes steps of establishing a 3D pattern; performing an initial machining process on a mold material by the 3D pattern; calculating a total machining area corresponding to the 3D pattern; dividing the 3D pattern into a plurality of precise machining regions according to the total machining area and a predetermined machining area and enabling a boundary line between every two adjacent precise machining regions to be corresponding to a crest line of the 3D pattern; and performing a precise machining process on each of the precise machining regions and changing a cutting tool at the boundary line between every two adjacent precise machining regions.

Abstract: A method of preparing an organic-inorganic hybrid material is described. A M(OR)x and an organically modified Si-alkoxide having a predetermined functional group are dissolved in a first solvent and a second solvent to form a first solution and a second solution, respectively. The first solution and the second solution are then mixed and heated. As a result, the M(OR)x reacts with the organically modified Si-alkoxide to form a functionalized organic-inorganic hybrid material. Furthermore, the solid content of the functionalized organic-inorganic hybrid material is increased by transferring the same into another solvent. Therefore, a thick hybrid film is fabricated by means of the transferred functionalized organic-inorganic hybrid material.

Abstract: A method of forming a semiconductor device having through molding vias includes eutectic bonding a capping wafer and a base wafer to form a wafer package. The base wafer includes a first chip package portion, a second chip package portion, and a third chip package portion. The capping wafer includes a plurality of isolation trenches and a plurality of separation trenches having a depth greater than the isolation trenches with respect to a same surface of the capping wafer. The method also includes removing a portion of the capping wafer exposing a first chip package portion contact, a second chip package portion contact, and a third chip package portion contact. The method further includes separating the wafer package to separate the wafer package into a first chip package, a second chip package, and a third chip package.

Abstract: An avatar-based charting method for assisted diagnosis to improve the efficiency of medical practice. Through an anthropomorphic symptom record interface, the first page is the Genetic-Psycho-Social-Bio (GPSB) which assists in understanding the genetic, psychological, social-environmental, and biological characteristics of patients. A Subjective-Objective-Assessment-Plan (SOAP) diagnosis page aids in doctor diagnosis. A decision support diagnostic summary interface automatically generates the diagnosis summary and notifies of any unusual circumstances. Finally, a medical records module saves all information into a medical database in order to provide health care for subsequent tracking and evaluation.

Abstract: A touch panel including a substrate, first sensing series, second sensing series, first lines and second lines is provided. Each first sensing series includes first electrode portions and first crossing portions. Each second sensing series includes second electrode portions and second crossing portions. Any adjacent two among the first electrode portions and the second electrode portions are separated by a spacing region. Each first crossing portion crosses one second crossing portion. The first lines respectively connect to the first sensing series and extend to a bonding region of the substrate. The second lines are disposed along the spacing region to respectively connect to the second sensing series and extend to the bonding region. One second line connected to an Nth second sensing series crosses one second crossing portion of an Mth second sensing series, wherein N and M are different positive integers.

Abstract: An embodiment is a method for forming a microelectromechanical system (MEMS) device. The method comprises forming a MEMS structure over a first substrate, wherein the MEMS structures comprises a movable element; forming a bonding structure over the first substrate; and forming a support structure over the first substrate, wherein the support structure protrudes from the bonding structure. The method further comprises bonding the MEMS structure to a second substrate; and forming a through substrate via (TSV) on a backside of the second substrate, wherein the overlying TSV is aligned with the bonding structure and the support structure.

Abstract: An embodiment is MEMS device including a first MEMS die having a first cavity at a first pressure, a second MEMS die having a second cavity at a second pressure, the second pressure being different from the first pressure, and a molding material surrounding the first MEMS die and the second MEMS die, the molding material having a first surface over the first and the second MEMS dies. The device further includes a first set of electrical connectors in the molding material, each of the first set of electrical connectors coupling at least one of the first and the second MEMS dies to the first surface of the molding material, and a second set of electrical connectors over the first surface of the molding material, each of the second set of electrical connectors being coupled to at least one of the first set of electrical connectors.

Abstract: A micro electromechanical system (MEMS) device includes a MEMS section attached to a substrate, and a cap bonded to a first surface of the substrate. The MEMS device further includes a carrier bonded to a second surface of the substrate opposite the first surface, wherein the carrier is free of active devices, and the cap and the carrier define a vacuum region surrounding the MEMS section. The MEMS device further includes a bond pad on a surface of the carrier opposite the MEMS section, wherein the bond pad is electrically connected to the MEMS section.