Patents by Inventor Chia Tsai

Chia Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CIRCUIT-AND-HEAT-DISSIPATION ASSEMBLY AND METHOD OF MAKING THE SAME
    Publication number: 20170290147
    Abstract: Disclosed herein is a circuit-and-heat-dissipation assembly which includes: a heat sink including a heat absorbing base and a heat dissipating element, the heat absorbing base having a circuit-forming surface and an element-forming surface, the heat dissipating element protruding from the element-forming surface for dissipating heat conducted from the heat absorbing base into an ambient environment; an insulator layer formed on the circuit-forming surface; and a patterned circuit formed on the insulator layer and having an electroless plating layer which has a patterned catalyst seed layer comprising an active metal and formed on the insulator layer, and a reduced metal layer formed on the catalyst seed layer. Also disclosed herein is a method of making the circuit-and-heat-dissipation assembly.
    Type: Application
    Filed: June 14, 2017
    Publication date: October 5, 2017
    Applicant: Taiwan Green Point Enterprises Co., Ltd.
    Inventors: Pen-Yi LIAO, Hung-San PAN, Yu-Cheng CHEN, Hui-Ching CHUANG, Wen-Chia TSAI
  • Vacuum sealed MEMS and CMOS package
    Patent number: 9776856
    Abstract: A vacuum sealed MEMS and CMOS package and a process for making the same may include a capping wafer having a surface with a plurality of first cavities, a first device having a first surface with a second plurality of second cavities, a hermetic seal between the first surface of the first device and the surface of the capping wafer, and a second device having a first surface bonded to a second surface of the first device. The second device is a CMOS device with conductive through vias connecting the first device to a second surface of the second device, and conductive bumps on the second surface of the second device. Conductive bumps connect to the conductive through vias and wherein a plurality of conductive bumps connect to the second device. The hermetic seal forms a plurality of micro chambers between the capping wafer and the first device.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: October 3, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Wen Cheng, Yi-Chuan Teng, Hung-Chia Tsai, Chia-Hua Chu
  • Intelligent host route distribution for low latency forwarding and ubiquitous virtual machine mobility in interconnected data centers
    Patent number: 9742586
    Abstract: Techniques are presented for distributing host route information of virtual machines to routing bridges (RBridges). A first RBridge receives a routing message that is associated with a virtual machine and is sent by a second RBridge. The routing message comprises of mobility attribute information associated with a mobility characteristic of the virtual machine obtained from an egress RBridge that distributes the routing message. The first RBridge adds a forwarding table attribute to the routing message that indicates whether or not the first RBridge has host route information associated with the virtual machine in a forwarding table of the first RBridge. The first RBridge also distributes the routing message including the mobility attribute information and the forwarding table attribute, to one or more RBridges in the network.
    Type: Grant
    Filed: December 19, 2014
    Date of Patent: August 22, 2017
    Assignee: Cisco Technology, Inc.
    Inventors: Yibin Yang, Chia Tsai, Liqin Dong
  • Two-Stage Port-Channel Resolution in a Multistage Fabric Switch
    Publication number: 20170237689
    Abstract: In some embodiments, a data packet may be received at a leaf switch. A port-channel associated with a destination port for the data packet may be identified, and the data packet may be transmitted to the destination port via the identified port-channel.
    Type: Application
    Filed: May 3, 2017
    Publication date: August 17, 2017
    Applicant: Cisco Technology, Inc.
    Inventors: Rajagopalan Janakiraman, Shyam Kapadia, Nilesh Shah, Chia Tsai, Vinay Parameswarannair
  • Level of hierarchy in MST for traffic localization and load balancing
    Patent number: 9736065
    Abstract: In one embodiment, a multiple spanning tree (MST) region is defined in a network, where the MST region includes a plurality of network nodes interconnected by links. A MST cluster is defined within the MST region, where the MST cluster includes a plurality of network nodes selected from the plurality of network nodes of the MST region. A network node of the MST cluster generates one or more MST bridge protocol data units (BPDUs) that present the MST cluster as a single logical entity to network nodes of the MST region that are not included in the MST cluster, yet enables per-multiple spanning tree instance (per-MSTI) load balancing of traffic across inter-cluster links that connect network nodes included in the MST cluster and network nodes of the MST region that are not included in the MST cluster.
    Type: Grant
    Filed: June 24, 2011
    Date of Patent: August 15, 2017
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Chia Tsai, Norman W. Finn, Yibin Yang, Debashis Patnala Rao
  • Micro electromechanical system sensor and method of forming the same
    Patent number: 9725310
    Abstract: A micro electromechanical system (MEMS) device includes a MEMS section attached to a substrate, and a cap bonded to a first surface of the substrate. The MEMS device further includes a carrier bonded to a second surface of the substrate opposite the first surface, wherein the carrier is free of active devices, and the cap and the carrier define a vacuum region surrounding the MEMS section. The MEMS device further includes a bond pad on a surface of the carrier opposite the MEMS section, wherein the bond pad is electrically connected to the MEMS section.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: August 8, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chun-wen Cheng, Hung-Chia Tsai, Lan-Lin Chao, Yuan-Chih Hsieh, Ping-Yin Liu
  • Circuit-and-heat-dissipation assembly and method of making the same
    Patent number: 9713263
    Abstract: A circuit-and-heat-dissipation assembly includes: a heat sink including a heat absorbing base and a heat dissipating element, the heat absorbing base having a circuit-forming surface and an element-forming surface, the heat dissipating element protruding from the element-forming surface for dissipating heat conducted from the heat absorbing base into an ambient environment; an insulator layer formed on the circuit-forming surface; and a patterned circuit formed on the insulator layer.
    Type: Grant
    Filed: June 19, 2015
    Date of Patent: July 18, 2017
    Assignee: Taiwan Green Point Enterprises Co., Ltd.
    Inventors: Pen-Yi Liao, Hung-San Pan, Yu-Cheng Chen, Hui-Ching Chuang, Wen-Chia Tsai
  • Electronic device and image processing method
    Patent number: 9706133
    Abstract: An image processing method is provided. The method includes following steps. Firstly, a first image is obtained by shooting photo at a first shutter speed, wherein the first image includes a first object image and a first background image, and the first object image and the first background image are clear. Next, a second image is obtained by shooting photo at a second shutter speed lower than the first shutter speed, wherein the second shutter speed is lower than the first shutter speed, the first image and the second image are obtained by shooting photo within substantially the same shooting range, the second image includes a second object image and a second background image, the second object image is blurry but the second background image is clear. After that, a third image is generated from at least the first image and the second object image.
    Type: Grant
    Filed: January 6, 2016
    Date of Patent: July 11, 2017
    Assignee: WISTRON CORPORATION
    Inventors: Yao-Tsung Chang, Chu-Chia Tsai, Ping-Hung Chen, I-Chun Wu, Chih-Yang Hung
  • LIGHT EMITTING DEVICE AND A METHOD OF MAKING THE SAME
    Publication number: 20170194544
    Abstract: A light emitting device includes a heat sinking substrate, an electrically insulating layer, a circuit pattern layer, and at least one light emitting diode (LED) chip. The electrically insulating layer is partially formed on the heat sinking substrate so as to expose a portion of the heat sinking substrate. The circuit pattern layer is formed on the electrically insulating layer. The LED chip is electrically connected to the circuit pattern layer, and is indirectly and non-electrically mounted to the portion of the heat sinking substrate exposed from the electrically insulating layer and the circuit pattern layer. A method of making the light emitting device is also provided.
    Type: Application
    Filed: December 28, 2016
    Publication date: July 6, 2017
    Applicant: Taiwan Green Point Enterprises Co., Ltd.
    Inventors: Pen-Yi LIAO, Chia-Tai CHEN, Wen-Chia TSAI, Jing-Yi YANG, Ai-Ling LIN
  • Two-stage port-channel resolution in a multistage fabric switch
    Patent number: 9660938
    Abstract: In some embodiments, a data packet may be received at a leaf switch. A port-channel associated with a destination port for the data packet may be identified, and the data packet may be transmitted to the destination port via the identified port-channel.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: May 23, 2017
    Assignee: Cisco Technology, Inc.
    Inventors: Rajagopalan Janakiraman, Shyam Kapadia, Nilesh Shah, Chia Tsai, Vinay Parameswarannair
  • Techniques for scalable and foolproof virtual machine move handling with virtual port channels
    Patent number: 9660941
    Abstract: Techniques are provided for managing movements of virtual machines in a network. At a first switch, a virtual machine (VM) is detected. The VM is hosted by a physical server coupled to the first switch. A message is sent to other switches and it indicates that the VM is hosted by the physical server. When the first switch is paired with a second switch as a virtual port channel (vPC) pair, the message includes a switch identifier that identifies the second switch. A receiving switch receives the message from a source switch in the network comprising a route update associated with the VM. A routing table of the receiving switch is evaluated to determine whether the host route is associated with a server facing the physical port. The message is examined to determine it contains the switch identifier.
    Type: Grant
    Filed: April 11, 2016
    Date of Patent: May 23, 2017
    Assignee: Cisco Technology, Inc.
    Inventors: Yibin Yang, Liqin Dong, Chia Tsai
  • ELECTRONIC DEVICE AND IMAGE PROCESSING METHOD THEREOF
    Publication number: 20170142346
    Abstract: An example of the invention provides an electronic device. The electronic device includes a camera module, a control unit and a computing unit. The control unit controls the camera module to acquire a first image and a second image. The computing unit receives the first image and the second image to generate a third image, wherein the resolution of the third image is greater than the resolution of the first image and the resolution of the second image.
    Type: Application
    Filed: April 25, 2016
    Publication date: May 18, 2017
    Inventors: Chih-Yang Hung, Yao-Tsung Chang, Chu-Chia Tsai, Ping-Hung Chen, Ching-Fu Hsu
  • Electronic device and image processing method
    Patent number: 9652866
    Abstract: An image processing method is provided. A first image is obtained at a first time point, the first image includes a first object image and a first background image, the first object image corresponds to the position of an object at the first time point. A second image is obtained at a second time point, the second image includes a second object image and a second background image, the second object image corresponds to the position of the object at the second time point, and the first and the second images are shot within substantially the same shooting range. A sum motion vector of the object is obtained according to the first and the second object images. The second object image is kept, and a process is applied to each pixel of the second background image in the second image to generate a third image.
    Type: Grant
    Filed: January 5, 2016
    Date of Patent: May 16, 2017
    Assignee: WISTRON CORPORATION
    Inventors: Yao-Tsung Chang, Chu-Chia Tsai, Ping-Hung Chen, Chih-Yang Hung, I-Chun Wu
  • Semiconductor device
    Patent number: 9617143
    Abstract: A method of forming a semiconductor device comprises bonding a capping wafer and a base wafer to form a wafer package. The base wafer comprises a plurality of chip package portions. The capping wafer comprises a plurality of isolation trenches. Each isolation trench of the plurality of isolation trenches is configured to substantially align with a corresponding chip package portion of the plurality of chip package portions. The method also comprises separating the wafer package into a plurality of chip packages. Each chip package of the plurality of chip packages comprises at least one chip package portion of the plurality of chip package portions.
    Type: Grant
    Filed: December 30, 2014
    Date of Patent: April 11, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chun-wen Cheng, Jung-Huei Peng, Shang-Ying Tsai, Hung-Chia Tsai, Yi-Chuan Teng
  • TITANIUM-ALLOY SUBSTRATE
    Publication number: 20170081744
    Abstract: The present invention discloses a titanium-alloy substrate which is formed plastically by performing die casting and forging to alloyed titanium at least one time. The present invention is characterized in that this titanium-alloy substrate is provided with a first structure layer which is arranged in a configuration of long axis crystal structure, and a second structure layer which is disposed on a side in adjacent to the first structure layer and is arranged in a configuration of equiaxed crystal structure.
    Type: Application
    Filed: September 23, 2015
    Publication date: March 23, 2017
    Inventors: TIEN-KEN LIANG, CHUN-YUNG HUANG, MING-CHIA TSAI, WEIDONG XING, NING ZHANG
  • Scalable network virtualization with aggregate endpoints
    Patent number: 9596099
    Abstract: Techniques provided herein use aggregate endpoints in a virtual overlay network. In general, aggregate endpoints operate as a single receiving entity for certain packets/frames sent between different physical proximities of the virtual overlay network.
    Type: Grant
    Filed: May 6, 2015
    Date of Patent: March 14, 2017
    Assignee: Cisco Technology, Inc.
    Inventors: Yibin Yang, Liqin Dong, Chia Tsai, Weng Hong Chan, Yuchen Zhou, Fang Yang, Jeffrey Cai, Yuefeng Jiang, Xiaopu Zhang
  • WIRELESS CHARGING METHOD, WIRELESS CHARGING DEVICE, AND WIRELESS CHARGING SYSTEM
    Publication number: 20170063139
    Abstract: A wireless charging method includes obtaining charging information of a plurality of electronic devices, and charging the plurality of electronic devices in sequence according to the charging information of the plurality of electronic devices. For each electronic device, a charging resonance frequency is chosen and accordingly the corresponding wireless charging power is provided for charging.
    Type: Application
    Filed: March 14, 2016
    Publication date: March 2, 2017
    Inventors: Yao-Tsung Chang, Te-Lung Wu, Chu-Chia Tsai
  • ELECTRONIC DEVICE AND IMAGE PROCESSING METHOD
    Publication number: 20170039730
    Abstract: An image processing method is provided. A first image is obtained at a first time point, the first image includes a first object image and a first background image, the first object image corresponds to the position of an object at the first time point. A second image is obtained at a second time point, the second image includes a second object image and a second background image, the second object image corresponds to the position of the object at the second time point, and the first and the second images are shot within substantially the same shooting range. A sum motion vector of the object is obtained according to the first and the second object images. The second object image is kept, and a process is applied to each pixel of the second background image in the second image to generate a third image.
    Type: Application
    Filed: January 5, 2016
    Publication date: February 9, 2017
    Inventors: Yao-Tsung Chang, Chu-Chia Tsai, Ping-Hung Chen, Chih-Yang Hung, I-Chun Wu
  • ELECTRONIC DEVICE AND IMAGE PROCESSING METHOD
    Publication number: 20170041533
    Abstract: An image processing method is provided. The method includes following steps. Firstly, a first image is obtained by shooting photo at a first shutter speed, wherein the first image includes a first object image and a first background image, and the first object image and the first background image are clear. Next, a second image is obtained by shooting photo at a second shutter speed lower than the first shutter speed, wherein the second shutter speed is lower than the first shutter speed, the first image and the second image are obtained by shooting photo within substantially the same shooting range, the second image includes a second object image and a second background image, the second object image is blurry but the second background image is clear. After that, a third image is generated from at least the first image and the second object image.
    Type: Application
    Filed: January 6, 2016
    Publication date: February 9, 2017
    Inventors: Yao-Tsung Chang, Chu-Chia Tsai, Ping-Hung Chen, I-Chun Wu, Chih-Yang Hung
  • CAST MOLDING METHOD AND DEVICES THEREOF
    Publication number: 20170008079
    Abstract: A cast molding method accomplishes the cast molding by a smelting chamber, a casting chamber, a hinge press system and a vacuum system. First, a metallic die is assembled in the casting chamber and then a metallic material is put in the smelting chamber. Next, the metallic material is heated up in a vacuum state and the casting chamber is pre-heated at a same time. After the metallic material in the smelting chamber has been melted down and the casting chamber has been vacuumized, the melted metallic material is filled into the metallic die, and then the hinge press system is turned on to cast mold the metallic die, resulting in a semi-solid product. After the semi-solid product has been cooled down, the product of cast molding is accomplished according to the present invention.
    Type: Application
    Filed: July 8, 2015
    Publication date: January 12, 2017
    Inventors: TIEN-KEN LIANG, CHUN-YUNG HUANG, MING-CHIA TSAI, WEIDONG XING, NING ZHANG