Abstract: A circuit and method are disclosed for monitoring the voltage level of an electrical signal, such as an unregulated power supply. The circuit includes a comparator that compares the electrical to the voltage reference and generates an output having a value that is based upon the comparison. A oscillation suppression circuit receives the output of the comparator and generates an output signal that follows the output of the comparator once the output of the comparator remains stable and in the same logic state for a predetermined of time.

Abstract: A circuit and method are disclosed for asynchronously accessing accessing a ferroelectric memory device. The ferroelectric memory device internally generates timing signals for latching a received address signal and driving the row lines of the device based upon transitions appearing on the received address signal. The circuit receives an address signal and asserts an edge detect signal in response. The address signal is latched following the edge detect a signal being asserted. Address decode circuitry receives the latched address and generates decoded output signals that identify a row of memory cells to be accessed. In this way, a ferroelectric memory device may effectively replace an asynchronous static random access random access memory (SRAM) device.

Abstract: A test circuit and method are disclosed for testing memory cells of a ferroelectric memory device having an array of ferroelectric memory cells. The test circuitry is coupled to the column lines, for selectively sensing voltage levels appearing on the column lines and providing externally to the ferroelectric memory device an electrical signal representative of the sensed voltage levels. In this way, ferroelectric memory cells exhibiting degraded performance may be identified.

Abstract: A circuit and method for performing a stress test on a ferroelectric memory device. The memory device includes a memory cell array having a plurality of row lines, column lines and plate lines. The memory device further includes test circuitry for receiving at least one test control signal and in response to the at least one test control signal allowing a voltage differential to be applied between the column lines and the plate lines, so that a stress voltage may be applied across each of the memory cells at one time.

Abstract: A circuit and method for performing a stress test on a ferroelectric memory device. The memory device includes a memory cell array having a plurality of row lines, column lines and plate lines. The memory device further includes test circuitry for receiving at least one test control signal and in response to the at least one test control signal allowing a voltage differential to be applied between the column lines and the plate lines, so that a stress voltage may be applied across each of the memory cells at one time.

Abstract: A reference voltage trim circuit includes a voltage follower receiving the reference voltage to be trimmed, with one or more resistive loads providing predefined voltage shifts serially connected between the output of the voltage follower and the output of the trim circuit. The voltage follower includes a current mirror differential amplifier receiving the reference voltage at one input and the output of the voltage follower at the other input, and a transistor with a resistive load connected between the power supply voltages and receiving the output of the current mirror differential amplifier at the transistor's gate. The resistive loads provide varying preselected voltage drop and are each shunted by corresponding fuses, with the entire series of resistive loads shunted by a master fuse. To trim the reference voltage, at least the master fuse is blown, together with the fuse(s) shunting resistive loads which combine to result in the desired trim voltage.

Abstract: A detection circuit and a test mode circuit incorporating the detection circuit is disclosed. The detection circuit includes an N-channel transistor having a first source, a first gate, and a first drain, wherein the first drain is connected to a supply voltage. The detection circuit also includes a P-channel transistor having a second source, a second gate, and a second drain, wherein the second source is connected to the first source and the second drain provides an output signal indicative of a supervoltage being applied to the first gate. The test mode circuit also includes a memory access cycle time-out feature override circuit.

Abstract: A memory device with a test mode control circuit for entering a test mode responsive to a high on the Vss pin or a low on the Vcc pin that supply power to the output pins during normal operation of the memory device. In test mode the wordlines and bitlines of the memory remain active from the time they are activated, typically when the clock switched from a first to a second logic state, until the clock switches back to the first logic state.

Abstract: A substantially noise-free data input buffer for an asynchronous device, such as a static random access memory (SRAM). The input buffer generates either a logical true or complement output signal representation of a data input signal and includes timing circuitry to delay an edge transition on the output signal for a predetermined period of time in response to a signal edge transition appearing on the data input signal. The input buffer further includes edge transition detection (ETD) circuitry for generating an initialization signal in response to the generation of the data output signal.

Abstract: A reference voltage trim circuit includes a voltage follower receiving the reference voltage to be trimmed, with one or more resistive loads providing predefined voltage shifts serially connected between the output of the voltage follower and the output of the trim circuit. The voltage follower includes a current mirror differential amplifier receiving the reference voltage at one input and the output of the voltage follower at the other input, and a transistor with a resistive load connected between the power supply voltages and receiving the output of the current mirror differential amplifier at the transistor's gate. The resistive loads provide varying preselected voltage drop and are each shunted by corresponding fuses, with the entire series of resistive loads shunted by a master fuse. To trim the reference voltage, at least the master fuse is blown, together with the fuse(s) shunting resistive loads which combine to result in the desired trim voltage.

Abstract: A memory device with a test mode control circuit for entering a test mode responsive to a high on the Vss pin or a low on the Vcc pin that supply power to the output pins during normal operation of the memory device. In test mode the wordlines and bitlines of the memory remain active from the time they are activated, typically when the clock switched from a first to a second logic state, until the clock switches back to the first logic state.

Abstract: A low/zero power memory device includes a deselect mode of operation wherein row decoders, column decoders, write decoders, pre-coders, post-coders and like operational circuits of the memory device needed for wordline and column activation are disabled until such time as a memory device supply voltage exceeds a certain threshold. An included test mode circuit detects test mode activation and overrides application of the power fail deselect mode of operation of the device. This activates the wordline and column related operational circuits immediately at power up such that the device powers up with multiple wordlines and columns activated and ready for application of a stress test overvoltage.

Abstract: A memory, such as a static random access memory (SRAM), includes at least one memory cell. The bit lines for that memory cell are selectively connected to corresponding write bit lines through a column select pass transistor and a selectively blowable fuse. A reset circuit is connected to the same write bit lines through a fuse structure mimic circuit. Responsive to data transitions on the write bit lines, the reset circuit operates to detect the occurrence of a memory operation to the memory cell and generate a reset signal for resetting the memory in preparation for a next write operation. To support substantially simultaneous presentation of write data to both the reset circuit and the memory cell, the fuse structure mimic circuit delays presentation of the write bit line data to the reset circuit.

Abstract: A circuit and method are provided for generating an initializing signal to a master enable fuse circuit on a redundant line decoder. An initialization pulse may be applied to a master enable circuit having a master enable fuse. The master enable fuse may be coupled to a switched voltage supply powered selectively by battery voltage and external Vcc. A circuit for generating the INITIAL signal determines the transition from a power down state to a powered state. A series of delay elements in a generating circuit generates a predetermined initialization pulse of around 3 ns to 5 ns. Half-latch circuits may be initialized between a first and second voltage threshold. Accordingly, the master enable circuits may be set to the proper initialization states for proper operation and minimum power consumption.

Abstract: A multiplexing circuit includes a reference terminal, a plurality of multiplexing input terminals, and a buffer having an input terminal and an output terminal. The multiplexing circuit also includes a plurality of first elements that each have a programmable conductivity and that are each serially coupled between a corresponding one of the multiplexing input terminals and the input terminal of the buffer. When one of the input signals is to be coupled to the multiplexer output terminal, the element corresponding to the selected input signal is programmed in a conductive state, and the remaining elements are programmed in a nonconductive state. When none of the input signals are selected, each element is programmed in a conductive state and the input signals each have the same value so as to prevent signal conflicts and short circuits at nodes within the multiplexing circuit.

Abstract: A control circuit for terminating a memory access cycle in a memory block having at least one memory cell is disclosed. The at least one memory cell has unique process characteristics. The control circuit includes a memory block activation circuit for generating a memory block activation signal. The memory block activation circuit includes a reset circuit for terminating the memory block activation signal when activated. The control circuit also includes a memory access cycle tracking circuit, responsive to the memory block activation signal, for generating a reset signal. The memory access cycle tracking circuit includes the unique process characteristics of the at least one memory cell for tracking an operation of the at least one memory cell. The reset signal activates the reset circuit so as to terminate the memory block activation signal and terminate the memory access cycle in the memory block.

Abstract: A circuit and method for varying the time of a write cycle. A variable timer circuit is provided coupled to a write simulation circuit. The write simulation circuit receives a signal from a start write sensing circuit indicating that data is being written to memory cells of the array. The write simulation circuit includes a memory cell replicate which replicates the time required for writing data to memory cells of the array. After the memory cell replicate has changed state, a signal is output via a switching circuit to the variable timer circuit for generation of a write termination signal. The memory cells are tested at various write cycle speeds by controlling the variable timer circuit. The variable timer circuit is set to terminate the write as quickly as possible after a successful write to the memory cells has been completed.

Abstract: An integrated circuit device such as an SRAM operating in a battery backup mode, or operating in a quiescent mode when deselected in the operation of a portable electronic device, includes a power dissipation control circuit that reduces the voltage on an internal power supply node so that the memory array is powered at a minimum level sufficient to retain the data stored therein intact.

Abstract: A signal driver receives an input signal and an enable signal, and generates an output signal from the input signal when the enable signal has an active state. When the enable signal has an inactive state, the signal driver draws substantially zero supply current regardless of the level of the input signal. The enable signal may be the sense-amplifier enable signal. The signal driver may also include an input circuit that receives the input signal and generates an intermediate signal from the input signal when the enable signal has the first state. An output circuit is coupled to the input circuit, receives the intermediate signal, and generates the output signal from the intermediate signal. A switch circuit is coupled to the input circuit, receives the enable signal, and cuts off substantially all supply current to the input circuit when the enable signal has the second state.

Abstract: A semiconductor integrated-circuit die includes a substrate of semiconductor material that has an edge. A conductive layer is disposed on the substrate, and a first insulator layer is disposed between the said substrate and the conductive layer. A functional circuit is disposed in the die. A conductive path is disposed beneath the insulator layer and is coupled to the circuit, the conductive path having an end portion that is located substantially at the edge of the substrate. The wafer on which the die is disposed has one or more signal lines that run along the scribe lines of the wafer. Before the die is scribed from the wafer, the conductive path couples the circuit on the die to one of these signal lines. The end portion of the conductive path is formed when the die is scribed from the wafer.