Abstract: An integrated optical circuit includes waveguides formed in the integrated optical circuit. One set of waveguides is a set of optical amplifiers doped with rare earth ions. A second set of waveguides is a multiplexer or demultiplexer, such as an arrayed waveguide grating (AWG). The set of optical amplifiers and the AWG are coupled together via waveguides formed in the integrated optical circuit. Other elements on the integrated optical circuit are coupled to the set of optical amplifiers and the AWG via optical fibers. The spectral response of the AWG is modified to compensate for the spectral gain of the AWG. The lengths of the individual optical amplifiers in the set of optical amplifiers may be varied to cause uniform power distribution across channels. The integrated optical circuit also has a pump coupler to couple a pump source to the set of optical amplifiers.

Abstract: A surface-emitting laser may be coupled to a waveguide that includes a Bragg grating that acts as an external cavity. The surface-emitting laser may be attached using surface mount techniques to the chip containing waveguides. The light of the laser can be coupled into the waveguide using an angled reflector. The Bragg reflector in the waveguide serves to stabilize the wavelength and to increase the power of the laser. Such integrated surface emitting laser can be used as a pump laser for a waveguide optical amplifier.

Abstract: A compensator for a display may include a diffraction grating formed by making grooves in the surface of a glass plate. In some embodiments, the diffraction grating acting as a wave plate may be separate from the light engine and in other embodiments, it may be integrated into the cover glass of the light engine.

Abstract: An arrayed waveguide grating may include a plurality of waveguides, each associated with a different channel in a wavelength division multiplexed system. Each incoming signal channel in a node of a wavelength division multiplexed network may be of an arbitrary wavelength and is provided to one of the wavelength converters attached on the arrayed waveguide grating. Each converter also receives one of blank light channels of different wavelengths on a grid. The converters convert each of the incoming wavelength signals to one of the distinct new wavelength signals on the grid of wavelengths, and these new wavelength signals are multiplexed into a fiber.

Abstract: A method of testing a planar lightwave circuit is achieved by coupling an optical probe to the planar lightwave circuit. In one embodiment, a second probe is used in combination with the first probe to test the planar lightwave circuit by sending and receiving a light beam through the planar lightwave circuit.

Abstract: An optical element, such as a waveguide or fiber ribbon, may be formed with an edge surface that reduces back reflections when light travels between optical elements butted against one another. Instead of cutting the surface at an oblique angle to the plane of the element, the surface may be cut transversely to this plane but at an angle to the optical axis, in order to facilitate the fabrication of an appropriately inclined optical interface.

Abstract: An optical modulator that modulates an optical beam through directed through an integrated circuit die. In one embodiment, the optical beam is directed into and out of a flip chip packaged integrated circuit die. In one embodiment, the optical modulator includes a resonant cavity structure. In one embodiment, the resonant cavity structure is disposed in the dielectric layer of the integrated circuit die. In one embodiment, the optical beam is directed into the integrated circuit die and through the resonant cavity structure and is modulated in response to an integrated circuit signal of the integrated circuit die. In one embodiment, the optical beam is modulated by modulating the resonant wavelength of the resonant cavity structure in response to the integrated circuit signal. A modulated optical beam is directed from the resonant cavity structure back out of the integrated circuit die.

Abstract: An optical modulator that modulates light through the semiconductor substrate through the back side of an integrated circuit die. In one embodiment, an optical modulator is disposed within a flip chip packaged integrated circuit die. The optical modulator includes a modulation region through which an optical beam is passed a plurality of times. In one embodiment, the optical beam enters through the back side of the semiconductor substrate at a first location and the modulated optical beam is deflected out through a second location on the back side of the semiconductor substrate. The interaction length of the optical modulator is increased by internally deflecting and passing the optical beam through the modulation region a plurality of times. In one embodiment, total internal reflection is used to deflect the optical beam. In another embodiment, reflective materials are used to internally deflect the optical beam.