Abstract: Proposed is a submodule of an MMC converter configured to stably supply power to a submodule controller controlling the submodule of an MMC converter. The submodule includes: an energy storage part storing electric energy therein; a plurality of switching elements connected in parallel to the energy storage part to have a shape of a bridge; a plurality of serially-connected resistors connected in parallel to the energy storage part; a plurality of DC-DC converters connected in parallel to a resistor of the plurality of resistors; a power switching part operating to select and output one voltage of voltages output from the plurality of DC-DC converters and a plurality of voltages input from outside; and a submodule controller operating with the voltage output by the power switching part so as to control switching operations of the plurality of switching elements.

Abstract: Provided is a semiconductor device including a substrate with an active pattern, a gate electrode crossing the active pattern, a source/drain region in an upper portion of the active pattern at a side of the gate electrode, the source/drain region including a recess region at an upper region thereof, a contact electrically connected to the source/drain region, the contact including a lower portion provided in the recess region, and a metal silicide layer provided at a lower region of the recess region and between the source/drain region and the contact.

Abstract: A method of removing a direct current component at an output terminal of an MMC converter according to the present invention includes a detection step of individually detecting charging voltages charged in capacitors of a plurality of sub-modules connected in series to each other in the MMC converter; outputting an average value of the individually detected charging voltages; delaying the outputted average value by a predetermined phase to output a phase-delayed average value; outputting the average value and the phase-delayed average value as a q-axis component voltage by using a predetermined dq conversion unit; calculating an error between the q-axis component voltage and a three-phase average voltage for the q-axis component voltage; and outputting, through a pre-determined first PI control unit, an offset voltage for reducing the error.

Abstract: Disclosed are a system and a method for automatic diagnosis of a power generation facility, and a system for automatic diagnosis of a power generation facility which include a data measuring unit for acquiring vibration data from a rotating body of a power facility, a signal processing unit for signal-processing acquired vibration data, and extracting and quantifying predetermined characteristic factors with respect to a time domain, a frequency domain, and a shape area, a characteristic pattern storage unit for storing a characteristic factor pattern classified for each failure type, and a failure diagnosis unit for diagnosing whether a power facility to be diagnosed has a failure and a failure type of the power facility, on the basis of a classified characteristic factor pattern.

Abstract: A method of removing a direct current component at an output terminal of an MMC converter according to the present invention includes a detection step of individually detecting charging voltages charged in capacitors of a plurality of sub-modules connected in series to each other in the MMC converter; outputting an average value of the individually detected charging voltages; delaying the outputted average value by a predetermined phase to output a phase-delayed average value; outputting the average value and the phase-delayed average value as a q-axis component voltage by using a predetermined dq conversion unit; calculating an error between the q-axis component voltage and a three-phase average voltage for the q-axis component voltage; and outputting, through a pre-determined first PI control unit, an offset voltage for reducing the error.

Abstract: Provided is a capacitor discharge device that quickly and safely discharges a capacitor charged with energy inside a sub-module of an MMC converter, the device including: a capacitor storing a DC voltage inside a sub-module of an MMC converter; a power supply unit supplying operating power required in the submodule by using the voltage stored in the capacitor; a first resistor connected in parallel to the capacitor; a second resistor having a lower resistance value and a larger heat capacity than the first resistor so as to rapidly discharge the capacitor storing the voltage; a first switching contact connecting and disconnecting the capacitor and the second resistor; a switching unit operating switching of the first switching contact by the operating power; a second switching contact connecting and disconnecting the power supply unit and the switching unit; and a control unit operating switching of the second switching contact.

Abstract: Proposed is a power supply device for a submodule controller of a modular multilevel converter (MMC) connected to a high voltage direct current (HVDC) system, which generates and supplies power through by hydraulic turbine generation using coolant flowing through a heat sink that cools a submodule. The power supply device includes a heat sink disposed inside the submodule of the MMC converter to cool the submodule using coolant; a pipe having an inlet configured to supply the coolant to the heat sink and an outlet configured to discharge the coolant to outside of the heat sink and configured to form a flow path to cause the coolant supplied through the inlet to flow to the heat sink; and a hydraulic turbine generator disposed at one side of the pipe to generate power by the coolant flowing through the pipe and supply the power to the submodule controller.

Abstract: A Modular Multilevel Converter (MMC) includes multiple sub-modules connected in series with each other and a controller for controlling on/off switching of the sub-modules, in which the multiple sub-modules include N sub-modules that participate in the operation of the MMC and M redundant sub-modules for replacing at least one N sub-modules when the at least one N sub-modules fail, and the controller switches on a sub-module if a carrier signal assigned thereto is higher than a preset reference signal, and switches off the sub-module if the carrier signal assigned thereto is lower than the preset reference signal.

Abstract: Provided is a semiconductor device having an enhanced characteristic and a resistor structure satisfying a desired target resistor value of a resistor device. A semiconductor device includes: a lower interlayer insulating layer disposed on a substrate comprising a resistor area; a resistor structure comprising a resistor layer and an etch stop pattern sequentially stacked on the lower interlayer insulating layer of the resistor area; an upper interlayer insulating layer configured to cover the resistor structure and disposed on the lower interlayer insulating layer; a resistor contact structure configured to pass through the upper interlayer insulating layer and the etch stop pattern and contact the resistor layer; and a resistor contact spacer disposed between the upper interlayer insulating layer, the etch stop pattern, and the resistor contact structure.

Abstract: Provided is a power control apparatus for sub-modules in an MMC, which controls stable supply of power to sub-modules in MMC connected to an HVDC system and a STATCOM. The power control apparatus has at least one first resistor connected between P and N buses of MMC; a second resistor connected in series with the first resistor; a switch connected in series with the second resistor; a third resistor connected in parallel with the second resistor and the switch which are connected in series; a Zener diode connected in parallel with the third resistor; and a DC/DC converter connected between both ends of the Zener diode and configured to convert voltage across both ends of the Zener diode into low voltage, and supply the low voltage to the sub-modules, wherein a magnitude of current flowing through the Zener diode is controlled depending on ON/OFF switching of the switch.

Abstract: Provided is a semiconductor device including a substrate with an active pattern, a gate electrode crossing the active pattern, a source/drain region in an upper portion of the active pattern at a side of the gate electrode, the source/drain region including a recess region at an upper region thereof, a contact electrically connected to the source/drain region, the contact including a lower portion provided in the recess region, and a metal silicide layer provided at a lower region of the recess region and between the source/drain region and the contact.

Abstract: Provided is a semiconductor device including a substrate with an active pattern, a gate electrode crossing the active pattern, a source/drain region in an upper portion of the active pattern at a side of the gate electrode, the source/drain region including a recess region at an upper region thereof, a contact electrically connected to the source/drain region, the contact including a lower portion provided in the recess region, and a metal silicide layer provided at a lower region of the recess region and between the source/drain region and the contact.

Abstract: Disclosed herein is a power supply apparatus for a sub-module controller of a Modular Multilevel Converter (MMC), which supplies driving power to the sub-module controller of an MMC connected to a High Voltage Direct Current (HVDC) system. The power supply apparatus includes a bridge circuit unit including N (N?2, integer) energy storage units for storing a DC voltage in series-connected sub-modules in the MMC and multiple power semiconductor devices connected in parallel with the N energy storage units in a form of a bridge; and a DC/DC converter for converting a voltage output from output terminals formed between both ends of n (1?n<N) series-connected energy storage units, among the N energy storage units, into a low voltage and supplying the low voltage to the sub-module controller.

Abstract: Provided is a capacitor discharge device that quickly and safely discharges a capacitor charged with energy inside a sub-module of an MMC converter, the device including: a capacitor storing a DC voltage inside a sub-module of an MMC converter; a power supply unit supplying operating power required in the submodule by using the voltage stored in the capacitor; a first resistor connected in parallel to the capacitor; a second resistor having a lower resistance value and a larger heat capacity than the first resistor so as to rapidly discharge the capacitor storing the voltage; a first switching contact connecting and disconnecting the capacitor and the second resistor; a switching unit operating switching of the first switching contact by the operating power; a second switching contact connecting and disconnecting the power supply unit and the switching unit; and a control unit operating switching of the second switching contact.

Abstract: A semiconductor device includes a first gate pattern and a second gate pattern on a substrate, the first gate pattern having a first height and the second gate pattern having a second height, an insulating pattern on the substrate covering the first and second gate patterns, the insulating pattern including a trench exposing the substrate between the first and second gate patterns, a spacer contacting at least a portion of a sidewall of the insulating pattern within the trench, the spacer spaced apart from the first and second gate patterns and having a third height larger than the first and second heights, and a contact structure filling the trench.

Abstract: Provided is a module replacement device of a high voltage direct current transmission system. In the device, a replacement base is provided in a structure by using a support member such that a sub-module movably provided at a fixing base of the structure can be replaced by being withdrawn outside of the structure. Further, the replacement base can easily and firmly be provided in the structure such that the module can be replaced in an easy and safe manner.

Abstract: Provided is a semiconductor device having an enhanced characteristic and a resistor structure satisfying a desired target resistor value of a resistor device. A semiconductor device includes: a lower interlayer insulating layer disposed on a substrate comprising a resistor area; a resistor structure comprising a resistor layer and an etch stop pattern sequentially stacked on the lower interlayer insulating layer of the resistor area; an upper interlayer insulating layer configured to cover the resistor structure and disposed on the lower interlayer insulating layer; a resistor contact structure configured to pass through the upper interlayer insulating layer and the etch stop pattern and contact the resistor layer; and a resistor contact spacer disposed between the upper interlayer insulating layer, the etch stop pattern, and the resistor contact structure.

Abstract: The present invention relates to a power control apparatus for sub-modules in a Modular Multilevel Converter (MMC), which controls the supply of power to sub-modules in an MMC connected to an HVDC system and to a STATCOM.

Abstract: Disclosed herein is a power supply apparatus for a sub-module controller of a Modular Multilevel Converter (MMC), which supplies driving power to the sub-module controller of an MMC connected to a High Voltage Direct Current (HVDC) system. The power supply apparatus includes a bridge circuit unit including N (N?2, integer) energy storage units for storing a DC voltage in series-connected sub-modules in the MMC and multiple power semiconductor devices connected in parallel with the N energy storage units in a form of a bridge; and a DC/DC converter for converting a voltage output from output terminals formed between both ends of n (1?n<N) series-connected energy storage units, among the N energy storage units, into a low voltage and supplying the low voltage to the sub-module controller.

Abstract: The present invention provides a Modular Multilevel Converter (MMC) in which M redundant sub-modules are additionally arranged in addition to the N sub-modules that are needed for operation, and the N+M sub-modules are controlled so as to participate in switching in turn. The MMC according to an embodiment of the present invention includes multiple sub-modules connected in series with each other and a controller for controlling on/off switching of the sub-modules. Here, the multiple sub-modules include N sub-modules that participate in the operation of the MMC and M redundant sub-modules for replacing a failing sub-module when at least one of the N sub-modules fails, and the controller switches on the sub-module if the carrier signal assigned thereto is higher than a preset reference signal, and switches off the sub-module if the carrier signal assigned thereto is lower than the reference signal.