Abstract: A method of cutting light emitting element packages includes preparing a ceramic substrate having a surface on which a plurality of light emitting element chips are mounted and a light-transmitting material layer is formed to cover the plurality of light emitting element chips; partially removing the light-transmitting material layer between the plurality of light emitting element chips along a cutting line by using a mechanical cutting method; and separating individual light emitting element packages by cutting the ceramic substrate along the cutting line by using a laser cutting method.

Abstract: A method of modulating data, which is represented by two data types of ‘high’ and ‘low’, and demodulating the modulated data, is disclosed. In a method of data modulation and demodulation for a communication system which has a transmitting end modulating a data and a receiving end demodulating the transmitted data from the transmitting end, the data is represented by two types including ‘high’ and ‘low’, and the receiving end receives at least one data which consists of at least one code-word spread by a unique orthogonal code. The receiving end adds up the received data in the unit of code-word, and subtracts the length of the orthogonal code from a value which is obtained by doubling the sum of the code-word, when the code-word of the orthogonal code is ‘0’. The receiving end then averages the result after the subtraction in the unit of orthogonal code length and extracts the result, and therefore, obtains the data from the transmitting end.

Abstract: Methods of forming through-silicon vias by using laser ablation. A method includes, laser drilling to form a plurality of grooves by irradiating a laser beam onto an upper surface of a silicon wafer, and grinding a lower surface of the silicon wafer to form a plurality of through-silicon vias by exposing the grooves on the lower surface of the silicon wafer.

Abstract: A television apparatus comprises a support frame and a leg member extending from the support frame to support the support frame in an inclined orientation. The television apparatus further comprises a display panel unit having a chassis movably mounted to the support frame via a first coupling assembly mounted between a right side edge portion of the chassis and a right side section of the support frame, and a second coupling assembly mounted between a left side edge portion of the chassis and a left side section of the support frame.

Abstract: Provided is a data security method and apparatus using a characteristic preserving encryption. The data security apparatus includes an interface communicating with a user terminal or a database server, an input unit receiving information, an output unit outputting information, an encryption unit encrypting data in the data security method, a storage unit storing information, and a control unit controlling functions of the interface, the input unit, the output unit, the encryption unit or the storing unit.

Abstract: Methods of cutting silicon substrates having a light-emitting element package. The method includes preparing a silicon substrate on which a plurality of light-emitting element chips are mounted and a transparent material layer that covers the light-emitting element chips is formed; removing the transparent material layer between the light-emitting element chips along a predetermined cutting line by using a mechanical cutting method; forming a scribing line corresponding to the predetermined cutting line on the silicon substrate by using a laser processing method; and cutting the silicon substrate to form individual light-emitting element packages by applying a mechanical impact to the silicon substrate along the scribing line. The method may enhance productivity of a cutting process of light-emitting element packages, and may prevent damage or transformation of the transparent material layer.