Abstract: The present invention deals with a flexible printed wiring board in the form of a printed wiring board wherein the conductive elements are fully encapsulated by an epoxy adhesive comprising a novel aromatic di-isoimide chemical compound. The conductive elements are thereby protected. The flexible printed wiring board is readily cured at a temperature in the range of 100 to 250° C. However, before curing, by virtue of the latent cure feature of the epoxy adhesive, the adhesive component of the printed wiring board has an extended shelf life, and avoids premature curing during processing.

Abstract: The present invention deals with a novel process directed to the preparation of a novel aromatic di-isoimide chemical compound that has utility as a catalyst and as a curing agent in epoxy compositions. The di-isoimide serves effectively as a thermally activated latent catalyst in epoxy curing, thereby increasing shelf life, and avoids premature cross-linking. The process involves the reaction in a non-aqueous dipolar solvent of a dispersion PMDA and a substituted or unsubstituted diamino-triazine, preferably melamine. Reaction in the presence of rubber is also disclosed.

Abstract: The present invention deals with a laminate useful for forming fully encapsulated flexible printed wiring boards. The laminate comprises a dielectric substrate coated with a curable composition comprising an epoxy and a novel aromatic di-isoimide chemical compound. The curable composition provides the benefit of thermal latency, improving shelf-life, and reducing premature curing during processing. Fully encapsulated printed wiring boards are also disclosed.

Abstract: The present invention deals with a novel curable epoxy composition comprising an aromatic di-isoimide chemical compound. The di-isoimide serves effectively as a thermally activated latent catalyst in epoxy curing, thereby increasing shelf life, and avoids premature cross-linking. Novel laminated articles and printed wiring boards, including encapsulated printed wiring boards are also disclosed.

Abstract: Provided are processes for making multi-layer chip carriers comprising an asymmetric cross-linked polymeric dielectric film.

Abstract: The present invention deals with a novel aromatic di-isoimide chemical compound that has utility as a catalyst and as a curing agent in epoxy compositions. The di-isoimide serves effectively as a thermally activated latent catalyst in epoxy curing, thereby increasing shelf life, and avoids premature cross-linking. Novel laminated articles and printed wiring boards, including encapsulated printed wiring boards are also disclosed. The composition hereof also can be used as a flame retardant in thermoplastic and thermoset polymers.

Abstract: A method for communication, in a network element that includes multiple ports, includes buffering data packets entering the network element via the ports in input buffers that are respectively associated with the ports. Storage of the data packets is shared among the input buffers by evaluating a condition related to the ports, and, when the condition is met, moving at least one data packet from a first input buffer of a first port to a second input buffer of a second port, different from the first port. Respective output ports, via which the buffered data packets are to exit the network element, are selected from among the ports. The buffered data packets are forwarded to the selected output ports.

Abstract: The present invention deals with a laminate useful for forming fully encapsulated flexible printed wiring boards. The laminate comprises a dielectric substrate coated with a curable composition comprising an epoxy and a novel aromatic di-isoimide chemical compound. The curable composition provides the benefit of thermal latency, improving shelf-life, and reducing premature curing during processing. Fully encapsulated printed wiring boards are also disclosed.

Abstract: The present invention deals with a novel process directed to the preparation of a novel aromatic di-isoimide chemical compound that has utility as a catalyst and as a curing agent in epoxy compositions. The di-isoimide serves effectively as a thermally activated latent catalyst in epoxy curing, thereby increasing shelf life, and avoids premature cross-linking. The process involves the reaction in a non-aqueous dipolar solvent of a dispersion PMDA and a substituted or unsubstituted diamino-triazine, preferably melamine. Reaction in the presence of rubber is also disclosed.

Abstract: The present invention deals with a flexible printed wiring board in the form of a printed wiring board wherein the conductive elements are fully encapsulated by an epoxy adhesive comprising a novel aromatic di-isoimide chemical compound. The conductive elements are thereby protected. The flexible printed wiring board is readily cured at a temperature in the range of 100 to 250° C. However, before curing, by virtue of the latent cure feature of the epoxy adhesive, the adhesive component of the printed wiring board has an extended shelf life, and avoids premature curing during processing.

Abstract: The present invention deals with a novel curable epoxy composition comprising an aromatic di-isoimide chemical compound. The di-isoimide serves effectively as a thermally activated latent catalyst in epoxy curing, thereby increasing shelf life, and avoids premature cross-linking. Novel laminated articles and printed wiring boards, including encapsulated printed wiring boards are also disclosed.

Abstract: The present invention deals with a novel aromatic di-isoimide chemical compound that has utility as a catalyst and as a curing agent in epoxy compositions. The di-isoimide serves effectively as a thermally activated latent catalyst in epoxy curing, thereby increasing shelf life, and avoids premature cross-linking. Novel laminated articles and printed wiring boards, including encapsulated printed wiring boards are also disclosed. The composition hereof also can be used as a flame retardant in thermoplastic and thermoset polymers.

Abstract: Provided is a composite comprising a polymer and a plurality of surface-modified hexagonal boron nitride particles dispersed therewithin. Suitable polymers include polyimide and epoxy. A process is also provided. The surface modified hexagonal boron nitride particles comprise surface-bonded substituted phenyl radicals.

Abstract: Provided are processes for making multi-layer chip carriers comprising an asymmetric cross-linked polymeric dielectric film.

Abstract: Provided, are multi-layer chip carriers comprising an asymmetric cross-linked polymeric dielectric film, and processes for making the chip carriers.

Abstract: Provided is a film having a thickness of less than 500 ?m comprising a polymer and a plurality of surface-modified hexagonal boron nitride particles dispersed therewithin. The polymers can be polyimide or epoxy. A process for preparing the film by casting is provided.

Abstract: Provided is a composite comprising a polymer and a plurality of surface-modified hexagonal boron nitride particles dispersed therewithin. Suitable polymers include polyimide and epoxy. A process is also provided.

Abstract: Epoxy compositions exhibiting low viscosity in the uncured state and low coefficient of thermal expansion in the cured state are provided. Also provided are processes for making the epoxy compositions. The low dielectric constant compositions are well-suited for use in multi-layer printed circuit boards. The desired properties are achieved by employment of a bimodal distribution of nano-scale fillers in the epoxy compositions.

Abstract: Provided, are multi-layer chip carriers comprising an asymmetric cross-linked polymeric dielectric film, and processes for making the chip carriers.

Abstract: Compositions and processes for the preparation of printed circuits from epoxy compositions are provided. The epoxy compositions exhibit low viscosity in the uncured state and low coefficient of thermal expansion in the cured state. The low dielectric constant compositions of the invention are well-suited for use in multi-layer printed circuit boards.