Abstract: A transaminase mutant and use hereof, the amino acid sequence of the transaminase mutant is an amino acid sequence in which the amino acid sequence as represented by SEQ ID NO: 1 is mutated, the mutated amino acid position being one or more selected from among F89, K193, P243, V234, I262, Q280, V379, R416, A417 and C418. The enzymatic activity and/or stability of the transaminase mutant is improved.

Abstract: A semiconductor device with dual side source/drain (S/D) contact structures and a method of fabricating the same are disclosed. The method includes forming a fin structure on a substrate, forming a superlattice structure on the fin structure, forming first and second S/D regions within the superlattice structure, forming a gate structure between the first and second S/D regions, forming first and second contact structures on first surfaces of the first and second S/D regions, and forming a third contact structure, on a second surface of the first S/D region, with a work function metal (WFM) silicide layer and a dual metal liner. The second surface is opposite to the first surface of the first S/D region and the WFM silicide layer has a work function value closer to a conduction band energy than a valence band energy of a material of the first S/D region.

Abstract: A particle structure of cathode material and a preparation method thereof is provided. Firstly, a precursor for forming a core is provided. The precursor includes at least nickel, cobalt and manganese. Secondly, a metal salt and a lithium ion compound are provided. The metal salt includes at least potassium, aluminum and sulfur. After that, the metal salt, the lithium ion compound and the precursor are mixed, and a mixture is formed. Finally, the mixture is subjected to a heat treatment step, and a cathode material particle structure is formed to include the core, a first coating layer coated on the core and a second coating layer coated on the first coating layer. The core includes potassium, aluminum and a Li-M-O based material. The first coating layer includes potassium and aluminum, and a potassium content of the first coating layer is higher than a potassium content of the core. The second coating layer includes sulfur.

Abstract: A semiconductor device structure includes a source/drain feature comprising a first surface, a second surface opposing the first surface, and a sidewall connecting the first surface to the second surface. The structure also includes a dielectric layer having a continuous surface in contact with the entire second surface of the source/drain feature, a semiconductor layer having a first surface, a second surface opposing the first surface, and a sidewall connecting the first surface to the second surface, wherein the sidewall of the semiconductor layer is in contact with the sidewall of the source/drain feature. The structure also includes a gate dielectric layer in contact with the continuous surface of the dielectric layer and the second surface of the semiconductor layer, and a gate electrode layer surrounding a portion of the semiconductor layer.

Abstract: Provided is a hemostatic composition comprising trypsin and zeolite, wherein pore channels of the zeolite are micropores, the zeolite contains divalent metal cations, and the mass ratio of the trypsin to the zeolite is 1:200-4:10. In the present invention, the trypsin specifically binds to the zeolite, allowing the trypsin to maintain a certain conformation on the surface of the zeolite and to obtain a higher procoagulant activity, thereby obtaining a hemostatic composition with an excellent blood coagulation effect. The hemostatic composition of the present invention has the advantages of a simple preparation method, low cost and convenient use, and can be widely used in hemostasis during trauma and operations, especially in emergent hemostasis in hemophilia patients.

Abstract: Semiconductor structures and methods for forming the same are provided. The semiconductor structure includes a plurality of first nanostructures formed over a substrate, and a dielectric wall adjacent to the first nanostructures. The semiconductor structure also includes a first liner layer between the first nanostructures and the dielectric wall, and the first liner layer is in direct contact with the dielectric wall. The semiconductor structure also includes a gate structure surrounding the first nanostructures, and the first liner layer is in direct contact with a portion of the gate structure.

Abstract: An intelligent orthopedic external fixing system based on a cloud platform, includes a cloud platform, an intelligent recognition unit and a Taylor spatial frame manufacturing module, wherein the intelligent recognition unit comprises an osteotrauma reconstruction module, a three-dimensional medical model registration module, a condition characteristic extraction module, an image recognition module, a personalized designed module and a basic module. According to the disclosure, the cloud platform integrates medical registration technology, computer image recognition technology, three-dimensional reconstruction technology and deep machine learning technology.

Abstract: A semiconductor device according to the present disclosure includes a source feature and a drain feature, a plurality of semiconductor nanostructures extending between the source feature and the drain feature, a gate structure wrapping around each of the plurality of semiconductor nanostructures, a bottom dielectric layer over the gate structure and the drain feature, a backside power rail disposed over the bottom dielectric layer, and a backside source contact disposed between the source feature and the backside power rail. The backside source contact extends through the bottom dielectric layer.

Abstract: An actuating and sensing module is disclosed and includes a bottom plate, a gas pressure sensor, a thin gas transportation device and a cover plate. The bottom plate includes a pressure relief orifice, a discharging orifice and a communication orifice. The gas pressure sensor is disposed on the bottom plate and seals the communication orifice. The thin gas transportation device is disposed on the bottom plate and seals the pressure relief orifice and the discharging orifice. The cover plate is disposed on the bottom plate and covers the gas pressure sensor and the thin gas-transportation device. The cover plate includes an intake orifice. The thin gas transportation device is driven to inhale gas through the intake orifice, the gas is then discharged through the discharging orifice by the thin gas transportation device, and a pressure change of the gas is sensed by the gas pressure sensor.

Abstract: The disclosed computer-implemented method may include dynamically selecting transportation options to present to a transportation requestor device based on current transportation network conditions and transportation requestor device history. In some embodiments, transportation network may have many different ways of arranging a transportation requestor's trip, such as private rides, shared rides, immediate rides, and delayed rides. In some examples, the requestor's choice of transportation option may have an impact on the transportation network. In anticipation of or in response to a transportation request, the method may determine which transportation options will better benefit the transportation network and determine which transportation options to display to the requestor and/or the prominence with which the transportation products are displayed. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: A semiconductor device structure, along with methods of forming such, are described. The semiconductor device structure includes a device, a first dielectric material disposed over the device, and an opening is formed in the first dielectric material. The semiconductor device structure further includes a conductive structure disposed in the opening, and the conductive structure includes a first sidewall. The semiconductor device structure further includes a surrounding structure disposed in the opening, and the surrounding structure surrounds the first sidewall of the conductive structure. The surrounding structure includes a first spacer layer and a second spacer layer adjacent the first spacer layer. The first spacer layer is separated from the second spacer layer by an air gap.

Abstract: A method of manufacturing a package structure at least includes the following steps. An encapsulant laterally is formed to encapsulate the die and the plurality of through vias. A plurality of first connectors are formed to electrically connect to first surfaces of the plurality of through vias. A warpage control material is formed over the die, wherein the warpage control material is disposed to cover an entire surface of the die. A protection material is formed over the encapsulant and around the plurality of first connectors and the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: Optical devices and methods of manufacture are presented in which a laser die or other heterogeneous device is embedded within an optical device and evanescently coupled to other devices. The evanescent coupling can be performed either from the laser die to a waveguide, to an external cavity, to an external coupler, or to an interposer substrate.

Abstract: A package includes a memory stack attached to a logic device, the memory stack including first memory structures, a first redistribution layer over and electrically connected to the first memory structures, second memory structures on the first redistribution layer, a second redistribution layer over and electrically connected to the second memory structures, and first metal pillars on the first redistribution layer and adjacent the second memory structures, the first metal pillars electrically connecting the first redistribution layer and the second redistribution layer, wherein each first memory structure of the first memory structures includes a memory die comprising first contact pads and a peripheral circuitry die comprising second contact pads, wherein the first contact pads of the memory die are bonded to the second contact pads of the peripheral circuitry die.

Abstract: A flexible tube includes a first connecting portion and a second connecting section. The second connecting section and the first connecting section are integrally connected to each other. The first connecting section has a first end surface, and the second connecting section has a second end surface, wherein there is an acute angle between the first end surface and the second end surface.

Abstract: A power supply is provided. The power supply includes a power supply circuit and a control circuit. The power supply circuit includes a voltage converter and multiple point-of-load circuits. The voltage converter generates a third voltage according to a first voltage. The load point-of-load circuits generate at least one second voltage and at least one state signal according to the third voltage. The at least one second voltage is suitable for supplying power to a load. The control circuit is coupled to the power supply circuit. The control circuit determines whether a single event latch-up occurs in the power supply circuit according to the at least one state signal. When the single event latch-up occurs in the power supply circuit, the control circuit switches off the power supply circuit to stop generating the at least one second voltage and the at least one state signal.

Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.

Abstract: A method for wireless communication performed by a user equipment (UE) is provided. The UE includes a plurality of antenna panels. The method includes transmitting, to a Base Station (BS), a UE capability message that includes a number of the plurality of antenna panels; and transmitting, to the BS, a panel report that includes information of the plurality of antenna panels, the information associated with at least one of a Synchronization Signal Block (SSB) and a Channel State Information Reference Signal (CSI-RS).

Abstract: The present disclosure relates to a method for producing vinyl acetate, comprising a vinyl acetate synthesis process, a vinyl acetate refining process and a separation process of vinyl acetate and ethyl acetate, including an acetic acid evaporator, an oxygen mixer, a vinyl acetate synthesis reactor, a first gas separating tower, a second gas separating tower, a recovered gas compressor, a water washing tower, an absorption tower and a desorption tower, a recycling gas compressor; the vinyl acetate refining process comprising an acetic acid tower, a crude VAC tower, and a fine VAC tower, a rectifying tower, an ethyl acetate tower, a water phase receiving tank, an extracting and rectifying tower and an ethyl acetate phase separator.

Abstract: A computer implemented method for managing the scope of permissions granted by users to application that includes collecting a set of permissions for an application from an application provider publication; and collecting a process flow for functional steps of the application from a review of the application that is published on a product review type publication. The computer implemented method further includes dividing the functional steps of the application into a plurality of journeys, each of said plurality of journeys having a function associated with a stage of a functional step from a perspective of a user; and matching permissions from the set of permissions for each journey of said plurality of journeys to provide matched permissible permissions to journeys stored in a customer journey store.