Abstract: The present technology provides a surface emitting element capable of enabling highly accurate detection of an optical characteristic of an emitted light and/or enabling adjustment of the optical characteristic of the emitted light. The surface emitting element of the present technology provides a surface emitting element including a light emitting layer, a characteristic layer that is disposed on an optical path of light generated in the light emitting layer, exhibits an electrical characteristic due to light incidence, and/or has variability in an optical characteristic due to voltage application, and a plurality of electrodes provided on the characteristic layer.

Abstract: A processing apparatus using laser according to an embodiment includes a stage configured to hold a substrate and rotate, and a laser irradiation apparatus capable of moving in a radial direction of the rotation. The laser irradiation apparatus includes a control unit configured to control an output of an infrared pulsed laser so that L1/L2 satisfies 1.2 or more and 10 or less when a distance between laser spots adjacent to each other in a rotation direction of the stage is L1 and a distance between laser spots adjacent to each other in the radial direction of the rotation is L2.

Abstract: A synthetic polymer film (35), (36) having a surface which has a plurality of raised portions (35p), (36p), wherein a two-dimensional size of the plurality of raised portions is in a range of more than 20 nm and less than 500 nm when viewed in a normal direction of the synthetic polymer film, the surface having a microbicidal effect, and the synthetic polymer film includes a fluorine element in such a profile that a fluorine content is not constant in a thickness direction but is higher in a portion closer to the plurality of raised portions than in a portion farther from the plurality of raised portions.

Abstract: A display device includes a display panel including a substrate including a first side extending in a first direction and a second side extending in a second direction intersecting the first direction, and a light emitting element layer positioned on a first surface of the substrate, a first vibrating element disposed on a second surface of the substrate and that vibrates the display panel to output a first sound, a first buffer layer disposed on the second surface of the substrate and disposed between the first side and the first vibrating element, and a second buffer layer disposed on the second surface of the substrate and disposed between the second side and the first vibrating element. The first buffer layer includes a first pore, and the second buffer layer includes a second pore.

Abstract: For an easy calibration using calibration particles, provided is a measuring device to capture images of target objects. An image analyzer acquires multiple images obtained at a predetermined time interval, (a) specifies the mean-square displacement of a bright point of a calibration particle based on the displacement of the bright point of the calibration particle in the multiple images in a calibration mode, and (b) specifies the mean-square displacement of a bright point of the target particle based on the displacement of the bright point of the target particle in the multiple images in a measurement mode. A particle size analyzer (c) derives the particle size of the target particle from the mean-square displacement of the bright point of the target particle based on the mean-square displacement of the bright point of the calibration particle and the particle size of the calibration particle in an analysis mode.

Abstract: In one embodiment, a method of manufacturing a semiconductor device includes forming a first film on a first substrate, forming a porous layer in a first portion of the first film and a non-porous layer in a second portion of the first film, forming a second film including a first device on the first film, forming a third film including a second device on a second substrate, and bonding the second film on the first substrate and the third film on the second substrate to be opposite to each other. Furthermore, the semiconductor device includes a first region and a second region. Moreover, the first device and the second device are located in the first region, the first portion is located among the first region and the second region, and the second portion is located in the second region.

Abstract: In one embodiment, a method of manufacturing a semiconductor device includes forming a first semiconductor layer including impurity atoms with a first density, on a first substrate, forming a second semiconductor layer including impurity atoms with a second density higher than the first density, on the first semiconductor layer, and forming a porous layer resulting from porosification of at least a portion of the second semiconductor layer. The method further includes forming a first film including a device, on the porous layer, providing a second substrate provided with a second film including a device, and bonding the first and second substrates to sandwich the first and second films. The method further includes separating the first and second substrates from each other such that a first portion of the porous layer remains on the first substrate and a second portion of the porous layer remains on the second substrate.

Abstract: The present invention provides a method for producing an optical film excellent in anti-fouling properties and scratch resistance as well as anti-reflection properties. The method includes the steps of: (1) applying a lower layer resin and an upper layer resin; (2) forming a resin layer having the uneven structure on a surface thereof by pressing a mold against the lower layer resin and the upper layer resin from the upper layer resin side in the state where the applied lower layer resin and upper layer resin are stacked; and (3) curing the resin layer, the lower layer resin containing at least one kind of first monomer that contains no fluorine atoms, the upper layer resin containing a fluorine-containing monomer and at least one kind of second monomer that contains no fluorine atoms, at least one of the first monomer and the second monomer containing a compatible monomer that is compatible with the fluorine-containing monomer and being dissolved in the lower layer resin and the upper layer resin.

Abstract: In one embodiment, a method of manufacturing a semiconductor device includes forming a first semiconductor layer including impurity atoms with a first density, on a first substrate, forming a second semiconductor layer including impurity atoms with a second density higher than the first density, on the first semiconductor layer, and forming a porous layer resulting from porosification of at least a portion of the second semiconductor layer. The method further includes forming a first film including a device, on the porous layer, providing a second substrate provided with a second film including a device, and bonding the first and second substrates to sandwich the first and second films. The method further includes separating the first and second substrates from each other such that a first portion of the porous layer remains on the first substrate and a second portion of the porous layer remains on the second substrate.

Abstract: A processing apparatus using laser according to an embodiment includes a stage configured to hold a plurality of substrates on concentric circles and rotates around a center of the concentric circles, and a laser irradiation apparatus capable of moving in a radial direction of the concentric circles, the laser irradiation apparatus including a control unit configured to control an output of an infrared pulsed laser so that a plurality of laser spots adjacent to each other are separated from each other.

Abstract: A power supply controller used in a DC/DC converter includes a feedback control unit that generates a pulse-shaped PWM signal having a first level that is one of a high level and a low level and a second level that is the other of the high level and the low level, on the basis of a feedback voltage based on an output voltage of the DC/DC converter; a low voltage detection unit that detects a low voltage of the feedback voltage; and a selection unit that chooses, as a chosen clock signal, a first clock signal having a high duty when the low voltage is not detected by the low voltage detection unit, and chooses a second clock signal having a low duty when the low voltage is detected by the low voltage detection unit.

Abstract: A manufacturing method of a semiconductor device according to an embodiment comprises, bonding a first semiconductor substrate and a second semiconductor substrate to form a stack, filling a first fill material having a first viscosity in a gap located between an outer peripheral portion of the first semiconductor substrate and an outer peripheral portion of the second semiconductor substrate, filling a second fill material having a second viscosity higher than the first viscosity in the gap so as to be adjacent to the first fill material after filling the first fill material in the gap and thinning the second semiconductor.

Abstract: An optical device case (100A) of an embodiment includes: a light-transmitting window member (20A); and a housing (10) which has a space for accommodating a light-receiving element and/or a light-emitting element (OE), wherein the window member (20A) includes a light-transmitting member (22), a polymer film (50) provided on an outer surface of the light-transmitting member (22), the polymer film (50) having a moth-eye structure at its surface, a contact angle of the surface with respect to water being not less than 140°, and a resistance heater (24) provided on an inner surface of the light-transmitting member (22).

Abstract: The present invention provides a method for producing an optical film excellent in anti-fouling properties and scratch resistance as well as anti-reflection properties. The method includes the steps of: (1) applying a lower layer resin and an upper layer resin; (2) forming a resin layer having the uneven structure on a surface thereof by pressing a mold against the lower layer resin and the upper layer resin from the upper layer resin side in the state where the applied lower layer resin and upper layer resin are stacked; and (3) curing the resin layer, the lower layer resin containing at least one kind of first monomer that contains no fluorine atoms, the upper layer resin containing a fluorine-containing monomer and at least one kind of second monomer that contains no fluorine atoms, at least one of the first monomer and the second monomer containing a compatible monomer that is compatible with the fluorine-containing monomer and being dissolved in the lower layer resin and the upper layer resin.

Abstract: A battery pack includes a battery cell case, a plurality of battery cells accommodated in the battery cell case, a plurality of lead plates connected to the battery cells, arranged on a same side surface of the battery cell case, and arranged to be separated from each other, and one or more insulation sheets. A first insulation sheet included in the one or more insulation sheets is adhered to a surface of a first lead plate so as to cover the first lead plate at least partially and not to cover lead plates other than the first lead plate.

Abstract: A semiconductor manufacturing apparatus includes a mounting unit arranged to mount an annular member, having an annular shape, to a work substrate including a first substrate and a second substrate bonded to each other so that the annular member surrounds the first substrate. The apparatus further includes a holding unit arranged to hold the work substrate having the annular member mounted thereto. The apparatus further includes a first fluid supply unit arranged to supply a first fluid to the second substrate of the work substrate held by the holding unit.

Abstract: A semiconductor manufacturing apparatus includes a mounting unit arranged to mount an annular member, having an annular shape, to a work substrate including a first substrate and a second substrate bonded to each other so that the annular member surrounds the first substrate. The apparatus further includes a holding unit arranged to hold the work substrate having the annular member mounted thereto. The apparatus further includes a first fluid supply unit arranged to supply a first fluid to the second substrate of the work substrate held by the holding unit.

Abstract: In one embodiment, a method of manufacturing a semiconductor device includes forming a first semiconductor layer including impurity atoms with a first density, on a first substrate, forming a second semiconductor layer including impurity atoms with a second density higher than the first density, on the first semiconductor layer, and forming a porous layer resulting from porosification of at least a portion of the second semiconductor layer. The method further includes forming a first film including a device, on the porous layer, providing a second substrate provided with a second film including a device, and bonding the first and second substrates to sandwich the first and second films. The method further includes separating the first and second substrates from each other such that a first portion of the porous layer remains on the first substrate and a second portion of the porous layer remains on the second substrate.

Abstract: A manufacturing method of a semiconductor device according to an embodiment comprises, bonding a first semiconductor substrate and a second semiconductor substrate to form a stack, filling a first fill material having a first viscosity in a gap located between an outer peripheral portion of the first semiconductor substrate and an outer peripheral portion of the second semiconductor substrate, filling a second fill material having a second viscosity higher than the first viscosity in the gap so as to be adjacent to the first fill material after filling the first fill material in the gap and thinning the second semiconductor.

Abstract: The present invention provides a method for producing an optical film excellent in anti-fouling properties and scratch resistance as well as anti-reflection properties. The method includes the steps of: (1) applying a lower layer resin and an upper layer resin; (2) forming a resin layer having the uneven structure on a surface thereof by pressing a mold against the lower layer resin and the upper layer resin from the upper layer resin side in the state where the applied lower layer resin and upper layer resin are stacked; and (3) curing the resin layer, the lower layer resin containing at least one kind of first monomer that contains no fluorine atoms, the upper layer resin containing a fluorine-containing monomer and at least one kind of second monomer that contains no fluorine atoms, at least one of the first monomer and the second monomer containing a compatible monomer that is compatible with the fluorine-containing monomer and being dissolved in the lower layer resin and the upper layer resin.