Abstract: An internal power supply potential generation circuit includes an overcharge prevention circuit connected to an internal power supply node. The overcharge prevention circuit includes a circuit outputting a signal to be determined that is determined by an internal power supply potential, a differential amplification circuit amplifying a difference in potential between the signal to be determined and a reference potential for output to a node as a signal indicating that current should be drawn, and a current draw circuit drawing current from the internal power supply node in response to the signal indicating that current should be drawn. Thus the semiconductor integrated circuit device of interest can provide a steady internal power supply potential.

Abstract: A programming circuit includes an LT fuse read circuit programming a defective address during a wafer-processing, an electrical fuse circuit electrically programming a defective address, an electrical fuse circuit storing therein whether the electrical fuse circuit is used, a select circuit receiving data programmed by the LT fuse and that programmed by the electrical fuse for switch and output, an electrical fuse circuit designating a switching of the select circuit, and a repair decision circuit comparing an output received from the select circuit and an input address received from the address buffer.

Abstract: First and second memory banks are provided with M memory blocks each having first and second memory regions, M representing an even number of no less than two, and (M+1) sense amplifier bands arranged on opposite sides of each memory block, and have first and second select lines arranged therefor to select the first and second memory regions, respectively, the first select line being connected to an odd-numbered sense amplifier band of the first memory bank and an even-numbered sense amplifier band of the second memory bank, the second select line being connected to an even-numbered sense amplifier band of the first memory bank and an odd-numbered sense amplifier band of the second memory bank.

Abstract: A data transfer circuit including four data lines is provided. In the data transfer circuit, a first driver pulls one of two data lines equalized to an “H” level by a first equalizer to an “L” level for transmitting first data. A second driver pulls one of two data lines equalized to an “L” level by a second equalizer to an “H” level for transmitting second data. A selector connects the two data line pulled to an “H” level to the first driver and the first equalizer and the two data lines pulled to an “L” level to the second driver and the second equalizer. Therefore, equalizing operation can be performed at a high speed and with reduced power consumption.

Abstract: In a DRAM, a data transfer circuit includes a control circuit which selects a data transfer line to be discharged from high to low and a data transfer line to be precharged from low to high for the subsequent data transfer period and turn on an n channel MOS transistor between the selected two data transfer lines for a predetermined period. A positive charge of a data transfer line can be effectively used to reduce current consumption.

Abstract: A read amplifier circuit includes an equalize start circuit. Based on a preamp enable signal PAE and an equalize signal IOEQ, the equalize start circuit generates an equalize start signal EQ for starting equalization at the timing when the preamp enable signal PAE is activated. Simultaneously with activation of a preamplifier by the preamp enable signal PAE, a pair of read lines GIOR and /GIOR is cut off from the preamplifier, and a P channel MOS transistor starts equalization of the pair of read lines GIOR and /GIOR. In this way, it is possible to start equalization of the paired read lines at the same time that the output signal is supplied to the preamplifier.

Abstract: A read data line pair is arranged for every four memory cell columns. Column selection in data reading is carried out by four sub read source lines. A write data line pair is arranged for every eight memory cell columns. Column selection in a data write operation is carried out by eight sub write activation lines. By differentiating the number between the read data line pairs and the write data line pairs and the corresponding memory cell columns, the wiring pitch of the data lines can be alleviated to suppress parasitic capacitance while avoiding significant increase of the signal lines to execute column selection.

Abstract: In a three-state circuit issuing a shared gate signal, after an N-channel MOS transistor charges a node issuing an output signal OUT to external power supply potential exvdd, the N-channel MOS transistor is turned off, and a P-channel MOS transistor is turned on to charge the node to boosted potential VPP. Thereby, a power consumed at boosted potential VPP can be reduced, and sizes of transistors of a VPP generating circuit can be reduced-. Thereby, a semiconductor memory device having a small chip size can be achieved.

Abstract: A first power supply voltage is supplied to a power supply node of a sense amplifier. A bit line driver outputs a column select signal composed of a second power supply voltage to the gate terminals of N channel MOS transistors of a GIO line gate circuit. When input/output data is [1], a third power supply voltage lower than the first power supply voltage is supplied onto a global data line. In this case, with a threshold voltage of N channel MOS transistors used, a relation is established: second power supply voltage≦third power supply voltage+threshold voltage. As a result, a leakage current can be reduced in a semiconductor memory device driven by plural power supply voltages with respective different voltage levels.

Abstract: The present invention provides a non-aqueous electrolyte secondary cell including: a lithium-nickel composite oxide as a cathode active material and a material having a specific surface in the range from 0.05 m2/g to 2 m2/g as an anode active material. When A is assumed to be the weight of the lithium-nickel composite oxide and B is assumed to be the weight of the cathode active material other than the lithium-nickel composite oxide, the mixture ratio R expressed A/(A+B) is in the range from 0.2 to 1. This combination of the cathode active material and the anode active material enables to obtain an improved anti-over discharge characteristic even when an anode current collector contains Cu.

Abstract: The antifuse is brought into an electrically conducted state by setting the voltage Vpgm to a high voltage after activating the signal SA and setting the node N1 once to an L-level. By inversion of the latch, the voltage of the node N1 will be the power source voltage Vcc to bring the transistor into a non-conducted state, whereby the electric current flowing through the antifuse is cut off. A semiconductor device can be provided which includes an antifuse program circuit capable of cutting the electric current off after blowing, so as to prevent decrease in the blowing voltage.

Abstract: Provided is a power supply-to-power supply capacitance cell including a first capacitor connected between a sub power supply line and a sub ground line, a second capacitor connected between a main power supply line and the sub ground line, and a third capacitor connected between the sub power supply line and a main ground line. Thus, a voltage drop of the sub power supply line can be reduced in current consumption of an internal circuit, so that an operation of the internal circuit is stabilized and the operating speed thereof is improved.

Abstract: A synchronous semiconductor memory device in a test mode of operation receives an external clock signal and is controlled by an internal clock adjustment circuit producing an internal clock signal of high frequency to provide write and read operations. A clock cycle converter circuit included in the internal clock adjustment circuit included in the internal clock adjustment circuit produces the internal clock signal by performing a hierarchical exclusive-OR operation on a specific pair of two of eight clock signals successively delayed in phase with respect to the external clock signal.

Abstract: The antifuse is brought into an electrically conducted state by setting the voltage Vpgm to a high voltage after activating the signal SA and setting the node N1 once to an L-level. By inversion of the latch, the voltage of the node N1 will be the power source voltage Vcc to bring the transistor into a non-conducted state, whereby the electric current flowing through the antifuse is cut off. A semiconductor device can be provided which includes an antifuse program circuit capable of cutting the electric current off after blowing, so as to prevent decrease in the blowing voltage.

Abstract: A synchronous semiconductor memory device in a test mode of operation receives an external clock signal and is controlled by an internal clock adjustment circuit producing an internal clock signal of high frequency to provide write and read operations. A clock cycle converter circuit included in the internal clock adjustment circuit included in the internal clock adjustment circuit produces the internal clock signal by performing a hierarchical exclusive-OR operation on a specific pair of two of eight clock signals successively delayed in phase with respect to the external clock signal.

Abstract: A read data line pair is arranged for every four memory cell columns. Column selection in data reading is carried out by four sub read source lines. A write data line pair is arranged for every eight memory cell columns. Column selection in a data write operation is carried out by eight sub write activation lines. By differentiating the number between the read data line pairs and the write data line pairs and the corresponding memory cell columns, the wiring pitch of the data lines can be alleviated to suppress parasitic capacitance while avoiding significant increase of the signal lines to execute column selection.

Abstract: Disclosed is a non-aqueous electrolyte secondary battery having an excellent preservation characteristic at a high temperature and charging/discharging cycle characteristic.

Abstract: A read gate of a DRAM core cell includes first and second N channel MOS transistors having gates connected to a pair of bit lines through first and second nodes, respectively, and third and fourth MOS transistors having gates both of which receive a column selecting signal, with gate oxide films of the third and the fourth N channel MOS transistors being formed to be thinner than gate oxide films of the first and the second N channel MOS transistors. It is accordingly possible to lower an amplitude voltage of the column selecting signal, thereby enabling reduction of electric current consumption and speed-up of an operating rate of the DRAM core cell.

Abstract: Provided is a power supply-to-power supply capacitance cell including a first capacitor connected between a sub power supply line and a sub ground line, a second capacitor connected between a main power supply line and the sub ground line, and a third capacitor connected between the sub power supply line and a main ground line. Thus, a voltage drop of the sub power supply line can be reduced in current consumption of an internal circuit, so that an operation of the internal circuit is stabilized and the operating speed thereof is improved.

Abstract: First and second memory cell arrays have their respective sides with first and second center circuit bands adjacent thereto, respectively, and provided therein with their respective address latch circuits, row predecode circuits and row decoders. The first and second memory cell arrays share a sense amplifier band having a side with a center cross circuit band adjacent thereto and provided therein with a column decode circuit and a sense amplifier control circuit controlling activating a sense amplifier. As such the number of signal lines between the second center circuit band and the center cross circuit band can be reduced to alleviate thick density of signal lines. Thus there can be provided a DRAM core with readily changeable memory capacity.