Abstract: A method of pattern formation. The method is capable of inhibiting a post-development residue from remaining on a support equipped with an electrode, and a method of producing a polysilane-polysiloxane resin precursor that is suitable for use in the method of pattern formation. The method of pattern formation includes forming a film of a silicon-containing composition on the support equipped with an electrode forming a film of a resin composition on the film of a silicon-containing composition, and forming the film of a resin composition into a pattern.

Abstract: An energy-sensitive resin composition with which it is possible, even if the precursor polymer is heat-treated at low temperatures, to produce a film or molded article comprising an imide ring-containing polymer having excellent heat resistance, tensile elongation and chemical resistance with a low dielectric constant, or a film or molded article comprising an oxazole ring-containing polymer having excellent heat resistance, tensile elongation and chemical resistance. A method of manufacturing the film or molded article; a method of forming a pattern using the energy-sensitive resin composition; and a permanent film having excellent heat resistance, tensile elongation and chemical resistance.

Abstract: A silicon-containing resin composition with which it is possible to form a silica-based coating film in which generation of cracks is minimized, a method for forming a silica-based coating film using the silicon-containing resin composition, and a crack-free silica-based coating film formed using the silicon-containing resin composition. The silicon-containing resin composition includes a silicon-containing resin and a solvent, in which one or more of siloxane resins and polysilanes is used as the silicon-containing resin, and the solvent contains a cycloalkyl acetate having a specific structure.

Abstract: A curable composition having satisfactory curability, capable of forming a cured product having satisfactory heat resistance and adhesion to a base material, a cured film made of a cured product of the curable composition, a display panel provided with the cured film, and a method for producing a cured product using the above-mentioned curable composition. The curable composition includes a curable compound and a thermal cationic polymerization initiator, the curable compound contains a cationic polymerizable compound containing, as a main skeleton, a fused ring in which three or more rings including an aromatic ring are fused, and the thermal cationic polymerization initiator contains a quaternary ammonium salt-type compound having a specific structure.

Abstract: A composition which contains microparticles and does not undergo the long-term process of aggregation of the microparticles during storage of the composition. An imidazole compound having a specific structure is added to a composition containing microparticles having a volume average particle diameter of 3000 nm or less. The composition may contain a base material component. The base material component may be a heat-curable or photocurable base material component. The microparticles may be inorganic particles and/or organic particles.

Abstract: A cationically polymerizable curable composition comprising a compound having a vinyloxy group bonded to an aromatic group which is easily cured upon light exposure and/or heating, a cured product of the curable composition, and a method of producing a cured product using the curable composition. In a cationically polymerizable curable composition that includes a compound having a vinyloxy group bonded to an aromatic group, a sulfonium salt having a specific structure is used as a curing agent. A cured product is produced by shaping the curable composition into a predetermined shape, and subjecting the shaped curable composition to light exposure and/or heating.

Abstract: A composition capable of stably providing a high-quality siliceous film even under relatively low-temperature heating conditions, and a method of using the composition for forming a siliceous film. The composition includes a polysilazane and an imidazole group-containing compound represented by Formula (B).

Abstract: An energy-sensitive resin composition with which it is possible, even if the precursor polymer is heat-treated at low temperatures, to produce a film or molded article comprising an imide ring-containing polymer having excellent heat resistance, tensile elongation and chemical resistance with a low dielectric constant, or a film or molded article comprising an oxazole ring-containing polymer having excellent heat resistance, tensile elongation and chemical resistance. A method of manufacturing the film or molded article; a method of forming a pattern using the energy-sensitive resin composition; and a permanent film having excellent heat resistance, tensile elongation and chemical resistance.

Abstract: A novel imidazole compound that yields a surface treatment liquid that is very effective at suppressing migration and oxidation of a wiring surface; a metal surface treatment liquid that contains the imidazole compound; a metal surface treatment method that uses the metal surface treatment liquid; and a laminate production method that uses the surface treatment liquid. A metal is surface-treated using the surface treatment liquid which includes a saturated fatty acid or a saturated fatty acid ester of a specific structure, in which a prescribed position is substituted by an aromatic group of a prescribed structure and an imidazolyl group that may have a substituent group.

Abstract: A transparent body production method that includes subjecting the compound represented by formula (1) to heating at a temperature equal to or greater than the melting point of said compound. In formula (1), each of W1 and W2 is the group represented by formula (2) in which the ring Z is an aromatic hydrocarbon ring, X is a single bond or —S—, R1 is a single bond or an alkylene group having 1-4 carbon atoms, R2 is a specific substituent, and m is an integer of 0 or higher, the group represented by formula (4) is —OH— or a (meth)acryloyloxy group, each of the rings Y1 and Y2 is an aromatic hydrocarbon ring, R is a single bond or a specific divalent group, each of R3a and R3b is —CN, a halogen group, or a monovalent hydrocarbon group, and each of n1 and n2 is an integer of 0-4.

Abstract: To provide a curable composition which can easily form an optical film with good fluorescence efficiency and includes quantum dots (B), a film made of a cured product of the curable composition, an optical film for a light-emitting display element made of the film, a light-emitting display element panel including the optical film, and a light-emitting display equipped with the light-emitting display element panel. A film is formed by curing a curable composition which includes an epoxy compound (A) having two or more epoxy groups and including a cyclic structure other than an oxirane ring, quantum dots (B), and an acid generator (C).

Abstract: A curable composition that can be cured at low temperature in a short time regardless of the type of epoxy compound that is mixed therewith, and has a long pot life; an adhesive comprising said curable composition; a method for producing a fiber-reinforced composite material that uses the curable composition; and a fiber-reinforced composite material containing a matrix comprising the curable composition. A curing agent mixture composition that can be cured at low temperature and in a short time, and provides the curable composition with a long pot life. An epoxy compound (A) and an imidazole compound (B) are blended in with the curable composition. In addition, the imidazole compound (B) and at least one type of crosslinking agent (C) are blended in with the curing agent mixture composition.

Abstract: A compound containing a structural unit derived from a novel vinyl ether compound. This compound contains a structural unit represented by formula (1), in which the rings (Z1, Z2, Y1, Y2) are aromatic hydrocarbon rings; X1 and X2 represent a single bond or —S—; R represents a single bond or a specific divalent group; R1a and R1b represent a single bond or a C1-4 alkylene group; R2a and R2b represent a specific substituent group such as a monovalent hydrocarbon group; R3a and R3b represent a cyano group, a halogen atom, or a monovalent hydrocarbon; m1 and m2 are integers of 0 or greater; n1 and n2 are integers of 0-4; V1 is a group represented by formulas (a1)-(a3); and V2 is a group represented by formulas (a1)-(a4). In formulas (a1)-(a4), * represents a bonding hand, while ** and *** represent a bonding hand with an oxygen atom.

Abstract: A method for producing a polyimide film includes: obtaining a polyamic acid solution having a viscosity of 5 to 150 cps by preparing a raw material mixture liquid containing a solvent, a tetracarboxylic dianhydride represented by a specific general formula, and an aromatic diamine represented by a specific general formula, and has a total content of the tetracarboxylic dianhydride and aromatic diamine of 15% by mass or less, and reacting the tetracarboxylic dianhydride and aromatic diamine with each other in the raw material mixture liquid forming a polyamic acid having a repeating unit represented by a specific general formula; obtaining a polyimide-forming mixture liquid by adding a compound represented by a specific general formula to the polyamic acid solution; and obtaining a polyimide film represented by a specific general formula by forming a film made of the polyimide-forming mixture liquid, followed by imidization of the polyamic acid in the film.

Abstract: A curable composition capable of forming a cured product having high refractive index and excellent bending resistance, a cured product of the curable composition, a cured film made of the cured product, a display panel provided with the cured film, and a method for producing a cured product using the above-mentioned curable composition. The curable composition includes a curable compound and a curing agent. The curable compound contains a curable compound including, as a main skeleton, a fused ring in which three or more rings including an aromatic ring are fused, followed by mixing a metal oxide in which a capping agent is covalently bonded to a surface thereof.

Abstract: A curable composition having satisfactory curability, capable of forming a cured product having satisfactory heat resistance and adhesion to a base material, a cured film made of a cured product of the curable composition, a display panel provided with the cured film, and a method for producing a cured product using the above-mentioned curable composition. The curable composition includes a curable compound and a thermal cationic polymerization initiator, the curable compound contains a cationic polymerizable compound containing, as a main skeleton, a fused ring in which three or more rings including an aromatic ring are fused, and the thermal cationic polymerization initiator contains a quaternary ammonium salt-type compound having a specific structure.

Abstract: A cationically polymerizable curable composition comprising a compound having a vinyloxy group bonded to an aromatic group which is easily cured upon light exposure and/or heating, a cured product of the curable composition, and a method of producing a cured product using the curable composition. In a cationically polymerizable curable composition that includes a compound having a vinyloxy group bonded to an aromatic group, a sulfonium salt having a specific structure is used as a curing agent. A cured product is produced by shaping the curable composition into a predetermined shape, and subjecting the shaped curable composition to light exposure and/or heating.

Abstract: A novel sulfonium salt having high sensitivity with respect to active energy rays, a photoacid generator including the sulfonium salt, and a photosensitive composition containing the photoacid generator. The sulfonium salt is represented by formula (a1). In the formula, R1 and R2 each independently represent the group that is represented by formula (a2) or an alkyl group that may be substituted by a halogen atom, R1 and R2 are bonded to each other and may form a ring with the sulfur atom within the formula, R3 is the group represented by formula (a3) or the group represented by formula (a4), A1 represents S or the like, X? represents a monovalent anion, and R1 and R2 are not both an alkyl group which may be substituted with a halogen atom.

Abstract: A polyimide precursor composition that exhibits excellent tensile strength and breaking elongation, and that provides a film containing an alicyclic polyimide resin; a method for producing a polyimide film using the polyimide precursor composition; and a permanent film that contains an alicyclic polyimide resin and that exhibits excellent tensile strength and breaking elongation. The polyimide precursor composition is a mixture of a resin precursor component which is a polyamic acid including an alicyclic backbone having a predetermined structure, a monomer component that includes an aromatic diamine compound having a predetermined structure or an alicyclic tetracarboxylic acid di-anhydride having a predetermined structure; an imidazole compound having a predetermined structure; and a solvent.

Abstract: A composition capable of stably providing a high-quality siliceous film even under relatively low-temperature heating conditions, and a method of using the composition for forming a siliceous film.