Abstract: A composition which contains microparticles and does not undergo the long-term process of aggregation of the microparticles during storage of the composition. An imidazole compound having a specific structure is added to a composition containing microparticles having a volume average particle diameter of 3000 nm or less. The composition may contain a base material component. The base material component may be a heat-curable or photocurable base material component. The microparticles may be inorganic particles and/or organic particles.

Abstract: A silicon-containing resin composition with which it is possible to form a silica-based coating film in which generation of cracks is minimized, a method for forming a silica-based coating film using the silicon-containing resin composition, and a crack-free silica-based coating film formed using the silicon-containing resin composition. The silicon-containing resin composition includes a silicon-containing resin and a solvent, in which one or more of siloxane resins and polysilanes is used as the silicon-containing resin, and the solvent contains a cycloalkyl acetate having a specific structure.

Abstract: A method of pattern formation. The method is capable of inhibiting a post-development residue from remaining on a support equipped with an electrode, and a method of producing a polysilane-polysiloxane resin precursor that is suitable for use in the method of pattern formation. The method of pattern formation includes forming a film of a silicon-containing composition on the support equipped with an electrode forming a film of a resin composition on the film of a silicon-containing composition, and forming the film of a resin composition into a pattern.

Abstract: A resin composition including a silicon-containing resin component and a solvent, the silicon-containing resin component including at least one of (I) and (II) mentioned below, the solvent including at least one of a terpene compound having at least one of a hydroxy group and an acetoxy group, and a cyclic skeleton-containing acetate compound (excluding the terpene compound): (I) a polysilane-polysiloxane resin having a polysilane structure and a polysiloxane structure, and (II) a mixture of a resin having a polysilane structure and a resin having a polysiloxane structure.

Abstract: A composition containing a novel vinyl-group-containing compound. This composition contains a vinyl-group-containing compound represented by general formula (1). In the formula: W1 and W2 represent a group represented by general formula (2) (where a ring (Z) is an aromatic hydrocarbon ring, X is a single bond or —S—, R1 is a single bond or a C1-4 alkylene group, R2 is a specific substituent group such as a monovalent hydrocarbon, and m is an integer equal to 0 or higher), a group represented by general formula (4) (where the ring (Z), X, R1, R2, and m are as previously stated), a hydroxyl group, or a (meth)acryloyloxy group; rings (Y1, Y2) are aromatic hydrocarbon rings; R represents a single bond or a specific divalent group; R3a and R3b represent a cyano group, a halogen atom, or a monovalent hydrocarbon group; and n1 and n2 are integers of 0-4.

Abstract: A novel vinyl-group-containing fluorene compound and a method for producing the same, a polymerizable monomer and cross-linking agent including this compound, a leaving-group-containing fluorene compound, a monovinyl-group-containing fluorene compound, and methods for producing the same. This vinyl-group-containing fluorene compound is represented by formula (1). In the formula, W1 and W2 represent a group represented by formula (2), a group represented by formula (4), a hydroxyl group, or a (meth)acryloyloxy group, R3a and R3b represent a cyano group, a halogen atom, or a monovalent hydrocarbon, and n1 and n2 are integers of 0-4. In formulas (2) and (4), a ring (Z) is an aromatic hydrocarbon ring, X is a single bond or a group represented by —S—, R1 is a single bond or a C1-4 alkylene group, R2 is a specific substituent group such as a monovalent hydrocarbon, and m is an integer of 0 or greater.

Abstract: A novel vinyl-group-containing fluorene compound and a method for producing the same, a polymerizable monomer and cross-linking agent including the compound, a leaving-group-containing fluorene compound, a monovinyl-group-containing fluorene compound, and methods for producing the same. The vinyl-group-containing fluorene compound is represented by formula (1) in which W1 and W2 represent a group represented by formula (2), a group represented by formula (4), a hydroxyl group, or a (meth)acryloyloxy group, R3a and R3b represent a cyano group, a halogen atom, or a monovalent hydrocarbon, and n1 and n2 are integers of 0-4. In formulas (2) and (4), (Z) is an aromatic hydrocarbon ring, X is a single bond or a group represented by —S—, R1 is a single bond or a C1-4 alkylene group, R2 is a substituent such as a monovalent hydrocarbon, and m is an integer of 0 or more).

Abstract: A method for producing a polybenzoxazole resin, in which even when a polybenzoxazole precursor is heat treated at a low temperature, a polybenzoxazole resin that is excellent in mechanical properties, such as tensile elongation, and in chemical resistance, is suppressed in terms of coloration, and is high in transparency can be produced. A polybenzoxazole resin is formed by heating a polybenzoxazole precursor which is obtained by allowing an aromatic diaminediol and a diformyl compound or a dicarboxylic acid dihalide, to react with each other in a solvent containing an amide compound or a urea compound each having a specified structure, at 120° C. to 350° C.

Abstract: A developing solution for a polyimide precursor containing N,N,N?,N?-tetramethylurea and a lower alcohol having 1 to 5 carbon atoms. The developing solution increases a development margin and results in little or no decrease of the film thickness of a polyimide-based resin film. A development processing method of a photosensitive polyimide resin composition including developing a photosensitive polyimide precursor resin composition, at least a part of which is exposed, with the developing solution; and a pattern formation method including forming a coating film or molding including a photosensitive polyimide precursor resin composition, selectively exposing the coating film or molding, and developing the exposed coating film or molding by the development processing method.

Abstract: A curable composition that can be cured at low temperature in a short time regardless of the type of epoxy compound that is mixed therewith, and has a long pot life; an adhesive comprising said curable composition; a method for producing a fiber-reinforced composite material that uses the curable composition; and a fiber-reinforced composite material containing a matrix comprising the curable composition. A curing agent mixture composition that can be cured at low temperature and in a short time, and provides the curable composition with a long pot life. An epoxy compound (A) and an imidazole compound (B) are blended in with the curable composition. In addition, the imidazole compound (B) and at least one type of crosslinking agent (C) are blended in with the curing agent mixture composition.

Abstract: A novel sulfonium salt having high sensitivity with respect to active energy rays, a photoacid generator including the sulfonium salt, and a photosensitive composition containing the photoacid generator. The sulfonium salt is represented by formula (a1). In the formula, R1 and R2 each independently represent the group that is represented by formula (a2) or an alkyl group that may be substituted by a halogen atom, R1 and R2 are bonded to each other and may form a ring with the sulfur atom within the formula, R3 is the group represented by formula (a3) or the group represented by formula (a4), A1 represents S or the like, X? represents a monovalent anion, and R1 and R2 are not both an alkyl group which may be substituted with a halogen atom.

Abstract: A transparent body production method that includes subjecting the compound represented by formula (1) to heating at a temperature equal to or greater than the melting point of said compound. In formula (1), each of W1 and W2 is the group represented by formula (2) in which the ring Z is an aromatic hydrocarbon ring, X is a single bond or —S—, R1 is a single bond or an alkylene group having 1-4 carbon atoms, R2 is a specific substituent, and m is an integer of 0 or higher, the group represented by formula (4) is —OH— or a (meth)acryloyloxy group, each of the rings Y1 and Y2 is an aromatic hydrocarbon ring, R is a single bond or a specific divalent group, each of R3a and R3b is —CN, a halogen group, or a monovalent hydrocarbon group, and each of n1 and n2 is an integer of 0-4.

Abstract: A novel imidazole compound that yields a surface treatment liquid that is very effective at suppressing migration and oxidation of a wiring surface; a metal surface treatment liquid that contains the imidazole compound; a metal surface treatment method that uses the metal surface treatment liquid; and a laminate production method that uses the surface treatment liquid. A metal is surface-treated using the surface treatment liquid which includes a saturated fatty acid or a saturated fatty acid ester of a specific structure, in which a prescribed position is substituted by an aromatic group of a prescribed structure and an imidazolyl group that may have a substituent group.

Abstract: A curable composition obtained by blending a polymerizable compound (A) having predetermined types of polymerizable functional groups, a reactive compound (B) having predetermined types of reactive functional groups, a compound (C) which is an imidazolyl group-containing compound having a predetermined structure, and a compound (D) which is an oxime compound or an oxime ester compound having a predetermined structure.

Abstract: An energy-sensitive resin composition that provides a highly transparent polybenzoxazole resin with suppressed coloring, which has excellent chemical resistance and excellent mechanical characteristics such as tensile elongation, even in cases where a polybenzoxazole precursor is thermally treated at low temperatures; a method for producing a polybenzoxazole film or polybenzoxazole molded body using the energy-sensitive resin composition; and a pattern forming method using the energy-sensitive resin composition. The energy-sensitive resin composition contains a polybenzoxazole precursor that is obtained by reacting an aromatic diaminediol with a diformyl compound or a dicarboxylic acid dihalide; a solvent; and a compound that is decomposed by the action of light and/or heat to generate a base and/or an acid.

Abstract: A positive photosensitive resin composition containing a polyimide resin that allows patterns to be satisfactorily formed by photolithography, and provides patterns with excellent heat resistance, and a method for forming polyimide resin patterns using the positive photosensitive resin composition. A patterned polyimide resin film formed by the method for forming polyimide resin patterns. To the photosensitive resin composition are added a polyimide resin, and a compound in which an imidazole compound having a specific structure is generated by the action of light.

Abstract: The present invention provides an energy-sensitive resin composition, a method of manufacturing a polyimide film or a polyimide molded product in which said composition is used, and a method of forming a pattern in which said composition is used. The composition supplies a polyimide resin exhibiting exceptional thermal resistance and low permittivity even by a heat treatment at a low temperature. The composition contains polyamic acid obtained by reacting tetracarboxylic dianhydride and diamine, a solvent, and a compound (A) decomposing by the action of light and/or heat and generating a base and/or an acid. The method of manufacturing a polyimide film or a polyimide molded product includes forming a coating film or molded product comprising the composition and decomposing the compound (A) in the film or product through exposure or heating. The method of forming a pattern sequentially includes forming, selectively exposing, developing and heating the film or product.

Abstract: A polyimide resin produced by heating a polyamic acid resulting from the reaction of a tetracarboxylic acid dianhydride component and a diamine component in N,N,N?,N?-tetramethylurea.

Abstract: A composition containing a novel vinyl-group-containing compound. This composition contains a vinyl-group-containing compound represented by general formula (1). In the formula: W1 and W2 represent a group represented by general formula (2) (where a ring (Z) is an aromatic hydrocarbon ring, X is a single bond or —S—, R1 is a single bond or a C1-4 alkylene group, R2 is a specific substituent group such as a monovalent hydrocarbon, and m is an integer equal to 0 or higher), a group represented by general formula (4) (where the ring (Z), X, R1, R2, and m are as previously stated), a hydroxyl group, or a (meth)acryloyloxy group; rings (Y1, Y2) are aromatic hydrocarbon rings; R represents a single bond or a specific divalent group; R3a and R3b represent a cyano group, a halogen atom, or a monovalent hydrocarbon group; and n1 and n2 are integers of 0-4.

Abstract: A compound containing a structural unit derived from a novel vinyl ether compound. This compound contains a structural unit represented by formula (1), in which the rings (Z1, Z2, Y1, Y2) are aromatic hydrocarbon rings; X1 and X2 represent a single bond or —S—; R represents a single bond or a specific divalent group; R1a and R1b represent a single bond or a C1-4 alkylene group; R2a and R2b represent a specific substituent group such as a monovalent hydrocarbon group; R3a and R3b represent a cyano group, a halogen atom, or a monovalent hydrocarbon; m1 and m2 are integers of 0 or greater; n1 and n2 are integers of 0-4; V1 is a group represented by formulas (a1)-(a3); and V2 is a group represented by formulas (a1)-(a4). In formulas (a1)-(a4), * represents a bonding hand, while ** and *** represent a bonding hand with an oxygen atom.