Abstract: A deposition mask group includes a first deposition mask having two or more first through holes arranged along two different directions, a second deposition mask having two or more second through holes arranged along two different directions and a third deposition mask having two or more third through holes. The first through hole and the second through hole or the third through hole partly overlap when the first deposition mask, the second deposition mask and the third deposition mask are overlapped.

Abstract: A metal plate used for manufacturing a deposition mask has a thickness of equal to or less than 30 ?m. An average cross-sectional area of the crystals grains on a cross section of the metal plate is from 0.5 ?m2 to 50 ?m2. The average cross-sectional area of crystal grains is calculated by analyzing measurement results obtained by an EBSD method, the measuring results being analyzed by an area method under conditions where a portion with a difference in crystal orientation of 5 degrees or more is recognized as a crystal grain boundary.

Abstract: A method for manufacturing a metal plate, the metal plate including a first surface and a second surface positioned on the opposite side of the first surface, may include a step of rolling a base metal having an iron alloy containing nickel to produce the metal plate. The metal plate may include particles containing as a main component an element other than iron and nickel. In a sample including the first surface and the second surface of the metal plate, the following conditions (1) and (2) regarding the particles may be satisfied: (1) The number of the particles having an equivalent circle diameter of 1 ?m or more is 50 or more and 3000 or less per 1 mm3 in the sample, and (2) The number of the particles having an equivalent circle diameter of 3 ?m or more is 50 or less per 1 mm3 in the sample.

Abstract: A substrate processing device includes a transfer chamber configured to transfer a substrate under an atmospheric atmosphere and a plurality of processing units each including at least one processing chamber for processing the substrate under a vacuum atmosphere and at least one load-lock chamber connected to the processing chamber to switch an inner atmosphere thereof between the atmospheric atmosphere and the vacuum atmosphere. The transfer chamber includes a connection unit configured to connect the transfer chamber and the load-lock chamber such that each of the processing units is detachably attached. The connection unit includes an opening that allows the transfer chamber to communicate with the load-lock chamber, and an opening/closing mechanism configured to open and close the opening portion.

Abstract: A method for manufacturing a metal plate, the metal plate including a first surface and a second surface positioned on the opposite side of the first surface, may include a step of rolling a base metal having an iron alloy containing nickel to produce the metal plate. The metal plate may include particles containing as a main component an element other than iron and nickel. In a sample including the first surface and the second surface of the metal plate, the following conditions (1) and (2) regarding the particles may be satisfied: (1) The number of the particles having an equivalent circle diameter of 1 ?m or more is 50 or more and 3000 or less per 1 mm3 in the sample, and (2) The number of the particles having an equivalent circle diameter of 3 ?m or more is 50 or less per 1 mm3 in the sample.

Abstract: A substrate processing apparatus includes a transfer device, having a first pick configured to hold the substrate, configured to transfer a substrate; a detecting device configured to detect a position of the substrate; a susceptor configured to place the substrate thereon; an elevating device configured to move the substrate up and down; and a control device. The control device comprises an adjuster configured to perform a teaching processing; a detector configured to deliver the substrate from the first pick to the susceptor and from the susceptor to the first pick, and configured to detect a first position of the substrate, which is delivered from the susceptor to the first pick, by the detecting device; and a corrector configured to correct the position of the first pick based on a deviation amount between the first position of the substrate and a reference position.

Abstract: An image forming apparatus includes an image carrier that carries an image to be transferred onto a recording medium, a charging member in contact with the image carrier, the charging member that charges the image carrier, an erase unit that erases charge on the image carrier, a current detector that detects a current flowing to the charging member; a forming unit that forms a charged region on a surface of the image carrier, and forms an erased region on the surface of the image carrier using the erase unit, and a state acquisition unit that acquires a deterioration state of the charging member based on (i) a first current flowing in response to applying a voltage from the charging member to the erased region and (ii) a second current flowing in response to applying a voltage from the charging member to the charged region.

Abstract: An image forming apparatus includes an image carrier that carries an image to be transferred onto a recording medium, a charging member in contact with the image carrier, the charging member that charges the image carrier, an erase unit that erases charge on the image carrier; a current detector that detects a current flowing to the charging member; a forming unit that forms a charged region on a surface of the image carrier, and forms an erased region on the surface of the image carrier using the erase unit, and a state acquisition unit that acquires a deterioration state of the charging member based on (i) a first current flowing in response to applying a voltage from the charging member to the erased region and (ii) a second current flowing in response to applying a voltage from the charging member to the charged region.

Abstract: A charging device includes: a charging member that is rotatable and has a peripheral surface to be in contact with a charging target and to which a voltage is to be applied for charging the charging target; a removing member that includes a core and a removing material spirally wound one to less than two times around the core and rotates and comes into contact with the charging member to remove an unnecessary material from the peripheral surface of the charging member; and a detecting unit that detects a current flowing between the charging member and the removing member.

Abstract: A power supply adapter according to one aspect of the present disclosure includes a power cord, a power-source attachment portion, a working-machine attachment portion, a temperature detector, and an overheat determiner. The temperature detector is configured to detect temperature of the power cord and to output a detection signal indicating the temperature detected. The overheat determiner is configured to determine that the power cord is in an overheated state based on the detection signal from the temperature detector and to output an overheat determination result indicating that the power cord is in the overheated state.

Abstract: A charging device includes: a charging member that is rotatable and has a peripheral surface to be in contact with a charging target and to which a voltage is to be applied for charging the charging target; a removing member that includes a core and a removing material spirally wound one to less than two times around the core and rotates and comes into contact with the charging member to remove an unnecessary material from the peripheral surface of the charging member; and a detecting unit that detects a current flowing between the charging member and the removing member.

Abstract: A power supply adapter according to one aspect of the present disclosure includes a power cord, a power-source attachment portion, a working-machine attachment portion, a temperature detector, and an overheat determiner. The temperature detector is configured to detect temperature of the power cord and to output a detection signal indicating the temperature detected. The overheat determiner is configured to determine that the power cord is in an overheated state based on the detection signal from the temperature detector and to output an overheat determination result indicating that the power cord is in the overheated state.

Abstract: An image forming apparatus includes a transfer section, a guide section, and a plate material. The transfer section transfers an image to a recording material. The guide section guides the recording material toward the transfer section. The plate material is provided on the guide section, and is more easily elastically deformable than the guide section. The plate material guides the recording material, which is transported to the plate material, along a plate surface of the plate material. The plate material is thinner on a downstream side in a transport direction than on an upstream side.

Abstract: A metal plate used for manufacturing a deposition mask has a thickness of equal to or less than 30 ?m. An average cross-sectional area of the crystals grains on a cross section of the metal plate is from 0.5 ?m2 to 50 ?m2. The average cross-sectional area of crystal grains is calculated by analyzing measurement results obtained by an EBSD method, the measuring results being analyzed by an area method under conditions where a portion with a difference in crystal orientation of 5 degrees or more is recognized as a crystal grain boundary.

Abstract: A substrate processing apparatus includes a transfer device, having a first pick configured to hold the substrate, configured to transfer a substrate; a detecting device configured to detect a position of the substrate; a susceptor configured to place the substrate thereon; an elevating device configured to move the substrate up and down; and a control device. The control device comprises an adjuster configured to perform a teaching processing; a detector configured to deliver the substrate from the first pick to the susceptor and from the susceptor to the first pick, and configured to detect a first position of the substrate, which is delivered from the susceptor to the first pick, by the detecting device; and a corrector configured to correct the position of the first pick based on a deviation amount between the first position of the substrate and a reference position.

Abstract: A recording medium post-processing device includes a binding unit and a hole forming unit. The binding unit performs a binding process on a recording medium bundle. The hole forming unit performs a hole forming process in a region of recording media that constitute the recording medium bundle including a part of a binding region in which the binding process is performed.

Abstract: A metal plate includes a surface including a longitudinal direction of the metal plate and a width direction orthogonal to the longitudinal direction. A surface reflectance by regular reflection of a light is 8% or more and 25% or less. The surface reflectance is measured when the light is incident on the surface at an angle of 45°±0.2°. The light is in at least one plane orthogonal to the surface.

Abstract: A metal plate used for manufacturing a deposition mask has a thickness of equal to or less than 30 ?m. An average cross-sectional area of the crystals grains on a cross section of the metal plate is from 0.5 ?m2 to 50 ?m2. The average cross-sectional area of crystal grains is calculated by analyzing measurement results obtained by an EBSD method, the measuring results being analyzed by an area method under conditions where a portion with a difference in crystal orientation of 5 degrees or more is recognized as a crystal grain boundary.

Abstract: The metal plate includes a plurality of pits located on the surface of the metal plate. The manufacturing method for a metal plate for use in manufacturing of a deposition mask includes an inspection step of determining a quality of the metal plate based on a sum of volumes of a plurality of pits located at a portion of the surface of the metal plate.

Abstract: A power supply adapter according to one aspect of the present disclosure includes a power cord, a power-source attachment portion, a working-machine attachment portion, a temperature detector, and an overheat determiner. The temperature detector is configured to detect temperature of the power cord and to output a detection signal indicating the temperature detected. The overheat determiner is configured to determine that the power cord is in an overheated state based on the detection signal from the temperature detector and to output an overheat determination result indicating that the power cord is in the overheated state.