Abstract: A semiconductor memory device and a memory system including the same are provided. The semiconductor memory device may include a first memory cell array block generating first data, a second memory cell array block generating second data, and first and second error detection code generators. The first error detection code generator may generate a first error detection code and may combine a portion of bits of the first error detection code with a portion of bits of a second error detection code to generate a first final error detection signal. The second error detection code generator may generate the second error detection code and may combine the remaining bits other than the portion of bits of the second error detection code with the remaining bits other than the portion of bits of the first error detection code to generate a second final error detection signal.

Abstract: A memory system selectively sets signaling modes based on stack position information. The memory system includes a memory module having at least one semiconductor memory device and a memory controller configured to set a signaling mode based on stack position information of each of the semiconductor memory devices. A signaling between the memory controller and each of the semiconductor memory devices is performed in a differential signaling mode, and a signaling among the semiconductor memory devices is performed in a single-ended signaling mode. Accordingly, the memory system has reduced power consumption.

Abstract: A stacked memory apparatus operating with a compound read buffer is disclosed. The stacked memory apparatus includes an interface device having a main buffer and a plurality of memory devices each having a device read buffer. Systems incorporating one or more stacked memory apparatuses and related method of performing a read operation are also disclosed.

Abstract: A multi-chip memory device includes a transfer memory chip communicating input/output signals, a stacked plurality of memory chips each including a memory array having a designated bank, and a signal path extending upward from the transfer memory chip through the stack of memory chips to communicate input/output signals, wherein each bank of each memory chip in the stacked plurality of memory chips is commonly addressed to provide read data during a read operation and receive write data during a write operation, and vertically aligned within the stacked plurality of memory chips.

Abstract: A semiconductor memory device and a memory system including the same are provided. The semiconductor memory device may include a first memory cell array block generating first data, a second memory cell array block generating second data, and first and second error detection code generators. The first error detection code generator may generate a first error detection code and may combine a portion of bits of the first error detection code with a portion of bits of a second error detection code to generate a first final error detection signal. The second error detection code generator may generate the second error detection code and may combine the remaining bits other than the portion of bits of the second error detection code with the remaining bits other than the portion of bits of the first error detection code to generate a second final error detection signal.

Abstract: A refresh method for a semiconductor memory device having more than one bank group is provided. The refresh method may include applying an all-refresh command to one the bank groups, determining if one of the bank groups includes a bank undergoing a refresh operation when the all-refresh command is received, and performing an all-refresh operation based on the determination.

Abstract: A multi-chip memory device includes a transfer memory chip communicating input/output signals, a stacked plurality of memory chips each including a memory array having a designated bank, and a signal path extending upward from the transfer memory chip through the stack of memory chips to communicate input/output signals, wherein each bank of each memory chip in the stacked plurality of memory chips is commonly addressed to provide read data during a read operation and receive write data during a write operation, and vertically aligned within the stacked plurality of memory chips.

Abstract: A semiconductor device includes a memory cell array comprising a plurality of banks and a page size controller. The page size controller decodes a part of a bank selection address or a power supply voltage and a remaining part of the bank selection address to enable one of the plurality of banks or enable two of the plurality of banks to set a page size of the semiconductor device.

Abstract: Provided is a multi-chip package memory device. The multi-chip package memory device may include a transmission memory chip and a plurality of memory chips that are stacked on the transmission memory chip. The transmission memory chip may include a temporary storage unit, and may transmit a received command or received data to a corresponding memory chip, or to an external element. Each of the memory chips may include a memory core, and may delay the received command according to the properties of the memory chips and then may output delay commands. The transmission memory chip may store the received data in different portions of the temporary storage unit when the delay commands are respectively received.

Abstract: A semiconductor memory device, having a test mode and a normal mode, includes a frequency multiplier and a test command sequence generator. The frequency multiplier receives a test clock signal in the test mode and generates multiple internal test clock signals, each of which has a frequency equal to a frequency of an operation clock signal in the normal mode. The test clock signal has a frequency lower than the frequency of the operation clock signal. The test command sequence generator generates at least one command signal in response to the internal test clock signals in the test mode. The at least one command signal corresponds to at least one operation timing parameter of the semiconductor memory device that is to be measured. The frequency multiplier may include a Phase Locked Loop (PLL) or a Delay Locked Loop (DLL).

Abstract: A semiconductor memory device having shared sense amplifiers is provided. The semiconductor memory device has a bit-line selector disposed closer to a memory cell array than a column decoder. When the column decoder outputs a bit-line indication signal corresponding to the number of bit lines, the bit-line selector selects a plurality of bit lines in response to the bit-line indication signal. Thus, it is possible to reduce the number of signals output from the column decoder.

Abstract: A memory device is adapted to be connected in a daisy chain with a memory controller and one or more other memory devices. The memory device includes at least one data input port and at least one data output port for communicating data along the daisy-chain between the memory devices and the memory controller. The memory device is adapted to selectively enable/disable at least one of the data input or data output ports in response to whether a command received from the memory controller is intended for the memory device, or for one of the other memory devices.

Abstract: The invention provides an improved memory system that addresses signal degradation due to transmission line effects. The improved memory system includes a first buffer, at least one first memory device coupled to the first buffer, and a plurality of signal traces. The first buffer and memory device are mounted on a motherboard. Likewise, the plurality of signal traces is routed on the motherboard. Doing so eliminates stub loads that cause signal reflection that, in turn, result in signal degradation.

Abstract: Example embodiments relate to a memory system and a method of controlling power thereof. The memory system may include a memory device and a memory controller. The memory device may be configured to be set to a specific power characteristic mode in response to a mode register set command so as to provide a power characteristic information corresponding to the specific power characteristic mode. The memory controller may be configured to provide the mode register set command to the memory device, configured to read the power characteristic information corresponding to the specific power characteristic mode from the memory device, configured to generate a power control information based on the power characteristic information, configured generate a command in response to the power control information, and provide the command to the memory device according to the power control information.

Abstract: A three dimensional memory module and system are formed with at least one slave chip stacked over a master chip. Through semiconductor vias (TSVs) are formed through at least one of the master and slave chips. The master chip includes a memory core for increased capacity of the memory module/system. In addition, capacity organizations of the three dimensional memory module/system resulting in efficient wiring is disclosed for forming multiple memory banks, multiple bank groups, and/or multiple ranks of the three dimensional memory module/system.

Abstract: A stacked memory apparatus operating with a compound read buffer is disclosed. The stacked memory apparatus includes an interface device having a main buffer and a plurality of memory devices each having a device read buffer. Systems incorporating one or more stacked memory apparatuses and related method of performing a read operation are also disclosed.

Abstract: Provided is a memory system for seamless switching. The memory system includes first through mth chips, where m is a natural number, connected in the form of a daisy chain and configured to transmit at least one of signals and data, a (k?1)th chip of the first through mth chips, where k is a natural number and 2?k?m, configured to output a (k?1)th detection signal corresponding to a phase difference between (k?1)th test data of the (k?1)th chip and kth test data of a kth chip of the first through mth chips, and the kth chip including a clock phase control unit configured to control a phase of a received clock signal and to output the phase-controlled clock signal as a kth clock signal, where the clock phase control unit of the kth chip outputs the kth clock signal in response to the (k?1)th detection signal.

Abstract: A delay locked loop (DLL) circuit for a synchronous semiconductor memory device which can control a delay time of a feedback loop within the DLL circuit according to the magnitude of an external load, and a method of generating information about a load connected to a data pin of a synchronous semiconductor memory device are provided.

Abstract: A multi-chip package memory includes an interface chip generating at least one reference signal defined in relation to a reference process variation, and a stacked plurality of memory chips electrically connected to the interface chip via a vertical connection path and receiving the reference clock signal via the vertical connection path, wherein each one of the stacked plurality of memory chips is characterized by a process variation and actively compensates for said process variation in relation to the reference signal.

Abstract: A semiconductor memory device includes a controller, a plurality of substrates, and a plurality of stacked memories that are spaced apart and sequence on each of the substrates. Each of the stacked memories includes an interface chip that is connected to the respective substrate and a plurality of memory chips that are stacked on the interface chip. The controller is configured to control the stacked memories. The interface chips are configured to forward a command signal from the controller through each interface chip in the sequence of stacked memories that is intervening between the controller and a selected stacked memory to which the command signal is directed.