Abstract: The present disclosure is directed to a high throughput clip bonding tool or system which is flexible and easily adapts to different clip bond pitches or sizes. The clip bonding system may be an integrated system with various modules, including a clip singulation module, a feeder module, a transfer module and a clip attach module within a shared footprint. For example, an incoming clip source may be fed to the clip singulation module for clip singulation before the singulated clips are transferred by the feeder and transfer modules to a clip presentation area for clip alignment before pickup. A pickup tool of the clip attach module is configured to facilitate pickup and attachment of clips onto the semiconductor packages to be clip bonded. For example, the pickup head is programmable to facilitate clip bonding process of different applications which may require clips and packages with different sizes.

Abstract: A semiconductor tool and methods of forming semiconductor device assemblies. The semiconductor tool is a bond tip having a vacuum port and a plurality of purge ports with channels coupling the vacuum port with the purge ports. Air may be withdrawn through the vacuum to create a vacuum on the bottom of the bond tip to selectively couple a semiconductor device with the bond tip. The bond tip positions the semiconductor device on top of a stack of semiconductor devices to form a semiconductor device assembly. The assembly may be heated to reflow interconnects between the semiconductor device and the top device of the stack of semiconductor devices. Fluid provided through the purge ports may help to counter warpage of the semiconductor device to help form adequate interconnects between the devices. Fluid may also be provided through the vacuum port to counter the warpage.

Abstract: A connecting article includes a non-metallic body and a bonding layer. The non-metallic body includes a non-metal. The bonding layer is bonded to the non-metallic body. The bonding layer includes the non-metal, a first alloy, and a second alloy. The present disclosure further provides a method for manufacturing the connecting article, and a laser device.

Abstract: This invention relates to a cartridge assembly tray for conducting automated biochemical tests, such as immunoassay tests. The tray comprises a base member, a hinged frame and a locking mechanism. The base member includes a plurality of slots within the base member. Each of the plurality of slots is to receive a test cartridge. The hinged frame is coupled to the base member. The hinged frame is capable to rotate to an opened position or a closed position. The hinged frame includes a horizontal push bar configured to apply a downward force to test cartridges received in the plurality of slots when the hinged frame is in the closed position. The locking mechanism is to lock the hinged frame in the closed position when the hinged frame rotates to the closed position.

Abstract: The present invention is directed to methods for increasing sensitivities of immunoassays. The invention utilizes an acid elution condition that preferentially elute specifically bound immune complexes over non-specifically bound complexes from a solid phase, and designs immunoassay protocols that improve the ratio of specific binding to non-specific binding and thereby improving assay sensitivity. The protocol determines the signal of the labeled immunocomplexes eluted from a solid phase.

Abstract: Devices, methods, and media are described for runtime memory allocation to avoid defects. One embodiment includes assigning a plurality of memory blocks of a memory sub-system to a plurality of erase groups, such that each erase group of the plurality of erase groups comprises two or more memory blocks of the plurality of memory blocks. A bad block association is determined for each erase group of the plurality of erase groups. Prior to a memory condition being met, memory resources of the memory sub-system are allocated by erase group based on a first set of criteria which are based at least in part on the bad block association for each erase group in order to prioritize use of erase groups with fewer bad blocks.

Abstract: The present invention discloses a method for combining entry structures, by which similar entry structures can be automatically combined. By this method, the efficiency in both retrieving entries and acquiring knowledge is improved. In a technical solution, this method comprises: converting an entry structure into a text; combining, in the format of text and based on a cosine similarity between entries and a cosine similarity between entries and texts, a plurality of texts into one text; and converting the combined text back to the entry structure.

Abstract: Disclosed are a whole-cell tumor vaccine based on the principle of extracellular traps and a method of making the same, where a CpG ODN network similar to the extracellular trap in structure is formed on the tumor cell surface. The tumor cells are coated with a histone and CpG ODN to form the CpG ODN-coated tumor cells, which are inactivated to produce the whole-cell tumor vaccine. The vaccine of the invention, after injected to tumor model mice, can induce the occurrence of effective immune response to achieve the effective treatment for tumors.

Abstract: Disclosed are a bacteriologically-modified whole-cell tumor vaccine and a method of making the same. The method includes: lysing bacteria at logarithmic growth phase to obtain a bacterial lysate; mixing the bacterial lysate with an excessive amino compound solution to aminate the bacterial lysate in the presence of EDC; mixing the aminated bacterial lysate with the tumor cells for a certain period of time to produce bacteriologically-modified tumor cells; and inactivating the bacteriologically-modified tumor cells to produce the bacteriologically-modified whole-cell tumor vaccine. The bacteriologically-modified whole-cell tumor vaccine has been demonstrated to have desirable therapeutic effect in tumor model mice.

Abstract: The present invention is directed to methods for increasing sensitivities of immunoassays. The invention utilizes an acid elution condition that preferentially elute specifically bound immune complexes over non-specifically bound complexes from a solid phase, and designs immunoassay protocols that improve the ratio of specific binding to non-specific binding and thereby improving assay sensitivity. The protocol determines the signal of the labeled immunocomplexes eluted from a solid phase.

Abstract: A method for forming a semiconductor package is disclosed herein. The method includes forming a package substrate having a first major surface and a second major surface opposite to the first major surface. The package substrate includes a recess region below the first major surface defined with a die region and a non-die region surrounding the die region. A semiconductor die is disposed in the die region within the recess region. A dam structure is disposed within the recess region. The dam structure surrounds the semiconductor die and extends upwardly to a height below the first major surface of the package substrate. The method also includes dispensing a liquid encapsulant material into the recess region. The liquid encapsulant material is surrounded by the dam structure and extends upwardly to a height below the height of the dam structure. A package lid is attached to the package substrate.

Abstract: Various applications of interconnect substrates in power management systems are described.

Abstract: The present invention is directed to a luminescent immunoassay method for detecting an analyte in a liquid sample with high sensitivity. The invention provides a unique combination of (i) using a probe having a small sensing surface area for binding analyte molecules, (ii) using a high molecular weight branched polymer conjugated with multiple binding molecules and multiple luminescent labels, and (iii) cycling the probe having immunocomplex formed back to the reagent vessel and amplification vessel 1-10 times and repeating the reaction with the reagent and the amplification polymer, to improve the sensitivity of detection level. For each cycling, the luminescent signal is increased significantly over the noise. The present invention is also directed to an electrochemiluminescent detection system for measuring a chemiluminescent signal on a probe tip.

Abstract: D The present invention relates to ion pair catalysts (I) comprising the cationic bisguanidinium ligand (A) and diperoxomolybdate anion (B). The present invention also relates to ion pair catalysts (III) comprising the cationic bisguanidinium ligand (C) and peroxotungstate anion (D). It further relates to the use of the said catalysts in the manufacture of enantiomerically enriched sulfoxides.

Abstract: An improved method for forming a semiconductor package is disclosed herein. The method includes forming a multi-layer package substrate having a first major surface and a second major surface opposite to the first major surface. The package substrate comprises a recess region. A semiconductor die is attached to the die region within the recess region. A dam structure is formed within the recess region. The dam structure surrounds the semiconductor die and extends upward to a height below the first major surface of the package substrate. A liquid encapsulant material is dispensed into the recess region. The liquid encapsulant material is surrounded by the dam structure. The liquid encapsulant extends upwardly to a height below the height of the dam structure. A package lid is attached to the package substrate.

Abstract: Introduced here are rotors that can be placed inside of microplate wells that include liquid samples. Each rotor can be comprised of a ferromagnetic material. Accordingly, when a rotor is subjected to an external rotational magnetic field, the rotor spins and agitates the liquid sample inside the corresponding well. The spin speed may be adjusted by changing the rotation speed, direction, and/or orientation of the external rotational magnetic field. The rotor typically includes a central cavity within which a probe can be suspended during the biochemical test.

Abstract: A three-dimensional porous polyurethane scaffold for repairing central nerve injuries and a preparation method are disclosed. The scaffold includes three-dimensional porous polyurethane, wherein the compression modulus of the three-dimensional porous polyurethane is 0.001-10.0 MPa and the pore diameter is 10-200 ?m. The three-dimensional porous polyurethane scaffold has an efficient central nerve repair function without additionally inoculating functional cells or factors and can partially restore the original nerve function of tested animals, the preparation method is simple and it has a great prospect of application.

Abstract: A method for forming a semiconductor package is disclosed. The method includes providing a package substrate having top and bottom major package substrate surfaces, the top major package surface including a die attach region. A die having first and second major die surfaces is attached onto the die attach region. The second major die surface is attached to the die attach region. The first major die surface includes an die active region and a cover adhesive region surrounding the die active region. The method also includes applying a cover adhesive to the cover adhesive region on the first major die surface. A protective cover with first and second major cover surfaces and side surfaces is attached to the die using the cover adhesive. The second major cover surface contacts the cover adhesive. The protective cover covers the die active region. The protective cover includes a discontinuity on at least one of the side surfaces.

Abstract: An embodiment related to a method for forming a device is disclosed. The method includes providing a package substrate having a first die attach pad (DAP) and a first bond pad, forming a first conductive die-substrate bonding layer on the first DAP, and attaching a first major surface of a first die to the first DAP. The first die includes a first die contact pad on a second major surface of the first die. A first conductive clip-die bonding layer with spacers is formed on the first die contact pad of the first die. A first conductive clip-substrate bonding layer is formed on the first bond pad of the package substrate. The method also includes attaching a first clip bond to the first die and the first bond pad. The first clip bond includes a first horizontal planar portion attached to the first die over the first die contact pad and a second vertical portion attached to the first bond pad.