Patents by Inventor Hong Tan

Hong Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR COMBINING ENTRY STRUCTURES
    Publication number: 20200042541
    Abstract: The present invention discloses a method for combining entry structures, by which similar entry structures can be automatically combined. By this method, the efficiency in both retrieving entries and acquiring knowledge is improved. In a technical solution, this method comprises: converting an entry structure into a text; combining, in the format of text and based on a cosine similarity between entries and a cosine similarity between entries and texts, a plurality of texts into one text; and converting the combined text back to the entry structure.
    Type: Application
    Filed: October 12, 2019
    Publication date: February 6, 2020
    Inventors: Yechi MA, Hong TAN
  • POWER MANAGEMENT APPLICATION OF INTERCONNECT SUBSTRATES
    Publication number: 20190341344
    Abstract: Various applications of interconnect substrates in power management systems are described.
    Type: Application
    Filed: May 7, 2019
    Publication date: November 7, 2019
    Inventors: Mihalis Michael, Kwang Hong Tan, Ilija Jergovic, Chiteh Chiang, Anthony Stratakos
  • Learning apparatus in digital environment
    Patent number: 10445660
    Abstract: A learning apparatus in a digital environment is advantageous to interaction and communication among users who use a knowledge point structure for learning. The learning apparatus in the digital environment constructs a structurized knowledge library by editing knowledge points, tags of the knowledge points and a relationship among the knowledge points; then records a user's mastery degree for the knowledge points on the basis of the tags; and records knowledge learning information and social attribute information thereof for each user, so as to construct a general-class learning record, a single-class learning record and a general knowledge learning system of the user, which can also be used for the user to view the popularity of each tag in the knowledge library.
    Type: Grant
    Filed: February 5, 2016
    Date of Patent: October 15, 2019
    Inventors: Zhengfang Ma, Hong Tan
  • OPTICAL SENSOR OF BIO-MOLECULES USING INTERFEROMETER
    Publication number: 20190302016
    Abstract: The present invention is directed to an assembly for use in detecting an analyte in a sample based on thin-film spectral interference. The assembly includes a light source to emit light signals; a light detector to detect light signals; a coupler to optically couple the light source and the light detector to a waveguide tip; a monolithic substrate having a coupling side and a sensing side; and a lens between the waveguide tip and the monolithic substrate. The lens relays optical signals between the waveguide tip and the monolithic substrate.
    Type: Application
    Filed: April 10, 2019
    Publication date: October 3, 2019
    Inventor: Hong TAN
  • PROBES FOR BIOCHEMICAL TESTS
    Publication number: 20190285658
    Abstract: This invention relates to an apparatus for conducting immunoassay test. The apparatus includes a groove unit having a groove along a vertical direction configured to hold a rod-shaped portion of a probe along the vertical direction, and a push pin configured to move along a horizontal direction, the push pin being capable of residing at a first position and a second position. A tip of the push pin is capable of pressing the rod-shaped portion of the probe against the groove when the push pin resides at the first position. The distance between the tip of the push pin and the groove is larger than a diameter of the rod-shaped portion of the probe when the push pin resides at the second position.
    Type: Application
    Filed: May 23, 2019
    Publication date: September 19, 2019
    Inventors: Hong TAN, Ming XIA, Yushan TAN, Jun CHEN, Erhua CAO, Genqian LI, Robert F. ZUK
  • Detection system for high sensitivity fluorescent assays
    Patent number: 10379116
    Abstract: This invention relates to a detection system for measuring a fluorescent signal in a fluorescent assay. The system comprises a probe having a small sensing surface bound with a fluorescent label, and a light source and a detector both mounted at the proximal side of the sensing surface of the substrate. The invention also relates to a method for detecting an analyte in a liquid sample using a probe tip having a small surface area (?5 mm) and a high molecular weight polymer (?1 MD) having multiple binding molecules and multiple fluorescent labels. The binding reaction is accelerated by flowing the reaction solutions laterally and moving the probe tip up and down in the reaction vessels. The invention furthers relates to a fluorescent labeling composition comprising a cross-linked FICOLL® molecule having a plurality of binding molecules and a plurality of fluorescent labels.
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: August 13, 2019
    Assignee: Access Medical Systems, LTD.
    Inventors: Hong Tan, Robert F. Zuk, Yushan Tan, Erhua Cao, Min Xia, Jun Chen
  • TCB Bond Tip Design to Mitigate Top Die Warpage and Solder Stretching Issue
    Publication number: 20190244852
    Abstract: A semiconductor tool and methods of forming semiconductor device assemblies. The semiconductor tool is a bond tip having a vacuum port and a plurality of purge ports with channels coupling the vacuum port with the purge ports. Air may be withdrawn through the vacuum to create a vacuum on the bottom of the bond tip to selectively couple a semiconductor device with the bond tip. The bond tip positions the semiconductor device on top of a stack of semiconductor devices to form a semiconductor device assembly. The assembly may be heated to reflow interconnects between the semiconductor device and the top device of the stack of semiconductor devices. Fluid provided through the purge ports may help to counter warpage of the semiconductor device to help form adequate interconnects between the devices. Fluid may also be provided through the vacuum port to counter the warpage.
    Type: Application
    Filed: April 15, 2019
    Publication date: August 8, 2019
    Inventor: Yet Hong TAN
  • Semiconductor packages and methods of packaging semiconductor devices
    Patent number: 10354934
    Abstract: Semiconductor packages and methods for forming a semiconductor package are disclosed. The method includes providing a wafer having first and second major surfaces. The wafer is prepared with a plurality of dies and a plurality of external electrical contacts disposed on the first major surface of the wafer. The method includes processing the wafer. Processing the wafer includes separating the wafer into a plurality of individual dies. An individual die includes first and second major surfaces and first and second sidewalls, and the external electrical contacts are formed on the first major surface of the die. An encapsulant material is formed. The encapsulant material covers at least a portion of the first and second sidewalls of the die.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: July 16, 2019
    Assignee: UTAC HEADQUARTERS PTE. LTD.
    Inventors: Nathapong Suthiwongsunthorn, Antonio Jr. Bambalan Dimaano, Rui Huang, Hua Hong Tan, Kriangsak Sae Le, Beng Yeung Ho, Nelson Agbisit De Vera, Roel Adeva Robles, Wedanni Linsangan Micla
  • Systems for immunoassay tests
    Patent number: 10345319
    Abstract: This invention relates to an apparatus for conducting immunoassay test. The apparatus includes a groove unit having a groove along a vertical direction configured to hold a rod-shaped portion of a probe along the vertical direction, and a push pin configured to move along a horizontal direction, the push pin being capable of residing at a first position and a second position. A tip of the push pin is capable of pressing the rod-shaped portion of the probe against the groove when the push pin resides at the first position. The distance between the tip of the push pin and the groove is larger than a diameter of the rod-shaped portion of the probe when the push pin resides at the second position.
    Type: Grant
    Filed: October 16, 2017
    Date of Patent: July 9, 2019
    Assignee: Access Medical Systems, Ltd.
    Inventors: Hong Tan, Ming Xia, Yushan Tan, Jun Chen, Erhua Cao, Genqian Li, Robert F. Zuk
  • Power management application of interconnect substrates
    Patent number: 10332827
    Abstract: Various applications of interconnect substrates in power management systems are described.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: June 25, 2019
    Assignee: Volterra Semiconductor Corporation
    Inventors: Mihalis Michael, Kwang Hong Tan, Ilija Jergovic, Chiteh Chiang, Anthony J. Stratakos
  • TCB BOND TIP DESIGN TO MITIGATE TOP DIE WARPAGE AND SOLDER STRETCHING ISSUE
    Publication number: 20190172744
    Abstract: A semiconductor tool and methods of forming semiconductor device assemblies. The semiconductor tool is a bond tip having a vacuum port and a plurality of purge ports with channels coupling the vacuum port with the purge ports. Air may be withdrawn through the vacuum to create a vacuum on the bottom of the bond tip to selectively couple a semiconductor device with the bond tip. The bond tip positions the semiconductor device on top of a stack of semiconductor devices to form a semiconductor device assembly. The assembly may be heated to reflow interconnects between the semiconductor device and the top device of the stack of semiconductor devices. Fluid provided through the purge ports may help to counter warpage of the semiconductor device to help form adequate interconnects between the devices. Fluid may also be provided through the vacuum port to counter the warpage.
    Type: Application
    Filed: December 4, 2017
    Publication date: June 6, 2019
    Inventor: Yet Hong Tan
  • TCB bond tip design to mitigate top die warpage and solder stretching issue
    Patent number: 10312126
    Abstract: A semiconductor tool and methods of forming semiconductor device assemblies. The semiconductor tool is a bond tip having a vacuum port and a plurality of purge ports with channels coupling the vacuum port with the purge ports. Air may be withdrawn through the vacuum to create a vacuum on the bottom of the bond tip to selectively couple a semiconductor device with the bond tip. The bond tip positions the semiconductor device on top of a stack of semiconductor devices to form a semiconductor device assembly. The assembly may be heated to reflow interconnects between the semiconductor device and the top device of the stack of semiconductor devices. Fluid provided through the purge ports may help to counter warpage of the semiconductor device to help form adequate interconnects between the devices. Fluid may also be provided through the vacuum port to counter the warpage.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: June 4, 2019
    Assignee: MICRON TECHNOLOGY, INC.
    Inventor: Yet Hong Tan
  • CARTRIDGE ASSEMBLY TRAY FOR IMMUNOASSAY TESTS
    Publication number: 20190113532
    Abstract: This invention relates to a cartridge assembly tray for conducting automated biochemical tests, such as immunoassay tests. The tray comprises a base member, a hinged frame and a locking mechanism. The base member includes a plurality of slots within the base member. Each of the plurality of slots is to receive a test cartridge. The hinged frame is coupled to the base member. The hinged frame is capable to rotate to an opened position or a closed position. The hinged frame includes a horizontal push bar configured to apply a downward force to test cartridges received in the plurality of slots when the hinged frame is in the closed position. The locking mechanism is to lock the hinged frame in the closed position when the hinged frame rotates to the closed position.
    Type: Application
    Filed: December 12, 2018
    Publication date: April 18, 2019
    Inventors: Hong TAN, Yongli Ren, Ming Xia, Genqian Li
  • ION PAIR CATALYSIS OF TUNGSTATE AND MOLYBDATE
    Publication number: 20190105646
    Abstract: The present invention relates to ion pair catalysts (I) comprising the cationic bisguanidinium ligand (A) and diperoxomolybdate anion (B). The present invention also relates to ion pair catalysts (III) comprising the cationic bisguanidinium ligand (C) and peroxotungstate anion (D). It further relates to the use of the said catalysts in the manufacture of enantiomerically enriched sulfoxides.
    Type: Application
    Filed: March 22, 2017
    Publication date: April 11, 2019
    Inventors: Choon-Hong TAN, Xinyi YE, Lili ZONG
  • Parking pay station video display cap
    Patent number: D852454
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: June 25, 2019
    Assignee: IPS GROUP INC.
    Inventors: David William King, Alexander Schwarz, David Andrew Jones, Choor Hong Tan
  • Parking pay station video display cap
    Patent number: D853079
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: July 2, 2019
    Assignee: IPS GROUP INC.
    Inventors: David William King, Alexander Schwarz, David Andrew Jones, Choor Hong Tan
  • Parking pay station video display cap
    Patent number: D853678
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: July 9, 2019
    Assignee: IPS GROUP INC.
    Inventors: David William King, Alexander Schwarz, David Andrew Jones, Choor Hong Tan
  • Parking pay station video display cap
    Patent number: D853679
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: July 9, 2019
    Assignee: IPS GROUP INC.
    Inventors: David William King, Alexander Schwarz, David Andrew Jones, Choor Hong Tan
  • Parking pay station video display cap
    Patent number: D865315
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: October 29, 2019
    Assignee: IPS GROUP INC.
    Inventors: David William King, Alexander Schwarz, David Andrew Jones, Choor Hong Tan
  • Parking pay station video display cap
    Patent number: D872600
    Type: Grant
    Filed: May 4, 2017
    Date of Patent: January 14, 2020
    Assignee: IPS GROUP INC.
    Inventors: David William King, Alexander Schwarz, David Andrew Jones, Choor Hong Tan