Abstract: An example security gate can include: an outer frame; an outer gate disposed within the outer frame, the outer gate defining a plane and having a plurality of outer gate vertical members, and the outer gate defining an inner gate opening; an inner gate disposed within the outer gate, the inner gate defining a plurality of inner gate vertical members, wherein the inner gate is configured to move vertically within the plane to control access through the inner gate opening, and wherein the plurality of inner gate vertical members are sized to telescope within the plurality of outer gate vertical members as the inner gate is moved; and a locking mechanism to lock the inner gate at a vertical position relative to the outer gate to define an accessible size of the inner gate opening.

Abstract: A wavelength conversion device includes a substrate, a reflection layer, a wavelength conversion layer, and a first optical layer. The wavelength conversion device has a central axis. The reflection layer is disposed on an upper surface of the substrate. The central axis is perpendicular to the upper surface. The wavelength conversion layer is disposed on the reflection layer and around the central axis, has a complete or partial annular shape, and includes a first region and two second regions. The first region is located between the second regions. The first optical layer is disposed on a surface of the wavelength conversion layer and corresponds to the first region. In an axial direction, an orthographic projection of the first optical layer on the upper surface is not overlapped with an orthographic projection of the second regions on the upper surface. The first optical layer includes first diffusing particles.

Abstract: The present application discloses a method for manufacturing a SONOS memory, including: providing a substrate, wherein a first transistor gate of the SONOS memory and a first layer used for forming a second transistor gate are formed on the substrate; forming a patterned second layer on the upper surface of the first layer, wherein the second layer exposes the first layer corresponding to the outer side of the second transistor gate; performing first etching on the first layer exposed by the second layer; removing the second layer; and performing second etching on the first layer to form the second transistor gate. The present application also discloses a SONOS memory. The present application can form a vertical structure outside a selective transistor and a storage transistor, thus forming a vertical side wall in the subsequent process, so as to improve the performance of the device.

Abstract: A method of monitoring a clock signal of a server is provided. The server includes a phase-locked loop (PLL), a baseboard management controller (BMC), and a light emitting unit. The method includes steps of: A) the server executing a time synchronization service to obtain a synchronization mode that the PLL is operating in, where the synchronization mode is one of a free-run mode, a locked mode, and a holdover mode; B) the server updating the synchronization mode to the BMC when executing the time synchronization service; and C) the BMC storing the synchronization mode and controlling the light emitting unit to display in one of a plurality of displaying manners that corresponds to the synchronization mode.

Abstract: The present disclosure provides a superhydrophobic and self-cleaning anticoagulant composite coating material and a preparation method and use thereof, and relates to the technical field of biomedical materials. In the coating material provided by the present disclosure, a titanium dioxide nanotube-based structure increases microscopic roughness of a surface of a titanium-based metal substrate, and a hydrophobic modification layer reduces surface energy of the material. The rough structure and the hydrophobic modification layer have a synergistic effect to construct a superhydrophobic surface, making the surface of the material have self-cleaning characteristics and low adhesion. Air can be retained on the surface of the material to form an air layer, thereby reducing the contact area between the material and bacteria and platelets in the blood, and inhibiting adhesion of the bacteria, platelets, and plasma proteins to the material.

Abstract: An electrical connector including an insulating body, a first metallic member, a second metallic member, a plurality of terminals, and a metallic shell is provided. The insulating body has a base portion, a thickened step portion, and a tongue portion. The thickened step portion is located at a root of the base portion. The first metallic member and the second metallic member are disposed on an upper surface and a lower surface of the insulating body. The metallic shell is disposed on an exterior of the insulating body to surround the first metallic member, the second metallic member, and the terminals, wherein the front flat contact portion of each of the terminals is exposed out of the tongue portion, and a portion of the first metallic member and a portion of the second metallic member are exposed out of the thickened step portion.

Abstract: A light-transmitting antenna includes a substrate, a first and a second conductive pattern. The first and the second conductive pattern is disposed on a first and a second surface of the substrate respectively. The first conductive pattern includes a first feeder unit, a first and a second radiation unit, a first and a second coupling unit and a first parasitic unit. The first feeder unit is connected to the second radiation unit. The first and the second radiation unit are located between the first and the second coupling unit. One side and the other side of the first parasitic unit is connected to the second coupling unit and adjacent to the first coupling unit respectively. The second conductive pattern includes a second feeder unit, a third coupling unit, a second parasitic unit, and a fourth coupling unit.

Abstract: A centrifugal heat dissipation fan of a portable electronic device. The centrifugal heat dissipation fan includes a hub, multiple metal blades, and at least one ring. The metal blades are disposed surrounding the hub. The metal blades include multiple radial dimensions, and the structure of the metal blade with a shorter radial dimension is a part of the structure of the metal blade with a longer radial dimension. The metal blades having different radial dimensions form at least two ring areas, and the distribution numbers of the metal blades in the at least two ring areas are different from each other. The ring surrounds the hub and connects the metal blades.

Abstract: This application relates to the field of communications technologies. A method includes: A first device receives first configuration information sent by a second device. The first configuration information includes at least one of information about a reference signal, frequency range information of a radio frequency signal, or bandwidth range information. The first device measures a first reference signal set, to obtain a first measured value. The first reference signal set includes at least two reference signals. The first device determines an expansion factor ? based on the first configuration information. The first device determines a second measured value based on the first measured value and the expansion factor ?.

Abstract: A method for reducing frequency interference, and a communication satellite system. The method includes configuring the communication satellite system, determining a first range of areas in which a spatial isolation angle between the LEO satellite and the GEO satellite does not satisfy a minimum spatial isolation angle within service areas of the movable spot beams, enabling the movable spot beams to not enter the areas, and when the movable spot beams of the transmitting and receiving user antennas of multiple adjacent LEO satellites provide services to a same area, calculating a spatial isolation angles between the movable spot beams of the transmitting and receiving user antennas of any two adjacent LEO satellites, and in response to the spatial isolation angle not satisfying the minimum spatial isolation angle, assigning different sub-frequencies to the movable spot beams that do not satisfy the minimum spatial isolation angle.

Abstract: A centrifugal heat dissipation fan including a housing and an impeller is provided. The housing has at least one inlet disposed along an axis and at least one first outlet and a second outlet located in different radial directions, wherein the first outlet and the second outlet are opposite to and separated from each other. The impeller is disposed in the housing along the axis. A heat dissipation system of an electronic device is also provided.

Abstract: A read circuit for an image sensor includes: a first analog-to-digital conversion unit configured to perform successive approximation high-bit analog-to-digital conversion on collected pixel data to obtain high-bit conversion data and residual pixel data; and a second analog-to-digital conversion unit electrically connected to the first analog-to-digital conversion unit and configured to perform single-slope low-bit analog-to-digital conversion on the residual pixel data to obtain low-bit conversion data, wherein a sum of a first conversion accuracy of the first analog-to-digital conversion unit and a second conversion accuracy of the second analog-to-digital conversion unit is equal to a preset conversion accuracy for the pixel data. In accordance with the read circuit, a high image conversion frame rate of the pixel data can be achieved with lower power consumption and less circuit area, and the conversion cycle of the pixel data is effectively shortened.

Abstract: The present disclosure provides a semiconductor package, including a first semiconductor structure, including an active region in a first substrate portion, wherein the active region includes at least one of a transistor, a diode, and a photodiode, a first bonding metallization over the first semiconductor structure, a first bonding dielectric over the first semiconductor structure, surrounding and directly contacting the first bonding metallization, a second semiconductor structure over a first portion of the first semiconductor structure, wherein the second semiconductor structure includes a conductive through silicon via, a second bonding dielectric at a back surface of the second semiconductor structure, a second bonding metallization surrounded by the second bonding dielectric and directly contacting the second bonding dielectric, and a conductive through via over a second portion of the first semiconductor structure different from the first portion.

Abstract: A method for fabricating a semiconductor device includes the steps of first forming a first inter-metal dielectric (IMD) layer on a substrate and a metal interconnection in the first IMD layer, forming a magnetic tunneling junction (MTJ) and a top electrode on the metal interconnection, forming a spacer adjacent to the MTJ and the top electrode, forming a second IMD layer around the spacer, forming a cap layer on the top electrode, the spacer, and the second IMD layer, and then patterning the cap layer to form a protective cap on the top electrode and the spacer.

Abstract: Disclosed herein are methods for treating ocular chemical burns in a subject that involves administering to the cornea of a subject in need thereof a composition comprising a pyroptosis inhibitor, such as disulfiram.

Abstract: The invention relates to aqueous polymer dispersions comprising polymerized units issued from the following monomers with related weight proportions based on 100 parts of weight of a)+b): a) 50 to 90% of a monoethylenically unsaturated non-ionic monomer, b) 10 to 50% of vinyl aromatic monomer or methyl methacrylate, c) 1 to 5% of a hydroxy-containing (meth)acrylate, d) 0.1 to 3% of acid monomer selected from d1) acid monomer selected from monocarboxylic or dicarboxylic acid monomers and d2) acid monomer selected from phosphorous-based or sulfur-based strong acid monomers or/and their salts, or from the mixtures of d1) and d2), e) 0.001 to 0.5% of chain transfer agent, and f) 0 to 1% one of internal crosslinker bearing at least two copolymerisable ethylenic unsaturations, the polymer having a Tg measured by DSC from ?30 to 0° C. and a gel content of 0 to 60%, formed during polymerization.

Abstract: A device includes a redistribution line, and a polymer region molded over the redistribution line. The polymer region includes a first flat top surface. A conductive region is disposed in the polymer region and electrically coupled to the redistribution line. The conductive region includes a second flat top surface not higher than the first flat top surface.

Abstract: In an embodiment, a device includes: a semiconductor device; and a redistribution structure including: a first dielectric layer; a first grounding feature on the first dielectric layer; a second grounding feature on the first dielectric layer; a first pair of transmission lines on the first dielectric layer, the first pair of transmission lines being laterally disposed between the first grounding feature and the second grounding feature, the first pair of transmission lines being electrically coupled to the semiconductor device; a second dielectric layer on the first grounding feature, the second grounding feature, and the first pair of transmission lines; and a third grounding feature extending laterally along and through the second dielectric layer, the third grounding feature being physically and electrically coupled to the first grounding feature and the second grounding feature, where the first pair of transmission lines extend continuously along a length of the third grounding feature.

Abstract: Apparatus and techniques for an integrated circuit (IC) package to automatically detect, through an input/out pin, external component parameters and parasitics. An example IC package generally includes a pin for coupling to a component external to the IC package, and at least one of a resistance detector, an inductance detector, or a capacitance detector coupled to the pin, and configured to detect at least one of a resistance, an inductance, or a capacitance, respectively, of a lumped parameter model for the component external to the IC package. The resistance detector, inductance detector, or capacitance detector may also be configured to detect parasitics associated with at least one of the component, the pin, or a connection between the component and the pin.

Abstract: An example digital microfluidic device can include a hydrophobic electrowetting surface including an array of electrodes. The individual electrodes can have a shape with three or more sides. The array of electrodes can include a parking electrode and an adjacent electrode that is adjacent to the parking electrode. A cover can be positioned over the electrowetting surface at a gap distance sufficient to accommodate a liquid droplet between the cover and the electrowetting surface. A plurality of droplet barriers can be positioned on three or more sides of the parking electrode. The droplet barriers can constrain movement of a liquid droplet from the parking electrode to the adjacent electrode.