Patents by Inventor Hua Chen

Hua Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11947745
    Abstract: A handwriting data processing method is applied to a pen display having wireless communication function and a data processing device. The handwriting data processing method includes the steps of: the data processing device obtaining a handwriting data from the pen display in a wireless communication manner; the data processing device generating a compressed screen image and transmitting the data of the compressed screen image and the handwriting data, which is not compressed, to the pen display in the wireless communication manner; the pen display uncompressing the data of the compressed screen image and overlapping the uncompressed screen image and the handwriting data to form a complete screen image and displaying the complete screen image. By the handwriting processing method, the machine time of the processor of the pen display is effectively lowered, significantly reducing the delay phenomenon of the displayed handwriting.
    Type: Grant
    Filed: February 16, 2023
    Date of Patent: April 2, 2024
    Assignee: USI ELECTRONICS (SHENZHEN) CO., LTD.
    Inventors: Chih-Hsiang Chen, Chi-Hua Shih, Huang-Chu Liu, Jan-Yi Hsiao
  • Publication number: 20240100849
    Abstract: A fluid-ejection die cartridge includes a cartridge body. The fluid-ejection die cartridge includes a fluid-ejection die fluidically attached to the cartridge body. The fluid-ejection die is to eject fluid. The fluid-ejection die cartridge includes a stamped nanoceramic layer on an exposed fluid-ejection nozzle plate of the fluid-ejection die attached to the cartridge body.
    Type: Application
    Filed: April 14, 2020
    Publication date: March 28, 2024
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael G Groh, Bo Song
  • Publication number: 20240105549
    Abstract: The systems and cold plate pedestal and assembly described decrease mechanical stresses in integrated circuits, while also providing efficient thermal coupling between heat producing components and a cold plate. A cold plate assembly includes a cold plate with a pedestal portion a groove formed in a surface of the pedestal portion. The cold plate assembly also includes a thermal pad layer formed in the groove and a phase change material (PCM) layer formed on the surface of the pedestal portion and a surface of the thermal pad layer formed in the groove.
    Type: Application
    Filed: February 15, 2023
    Publication date: March 28, 2024
    Inventors: Yongguo CHEN, Kai CAO, Hua YANG, Vic Hong CHIA, Paul TON
  • Publication number: 20240105642
    Abstract: A method of manufacturing a package structure at least includes the following steps. An encapsulant laterally is formed to encapsulate the die and the plurality of through vias. A plurality of first connectors are formed to electrically connect to first surfaces of the plurality of through vias. A warpage control material is formed over the die, wherein the warpage control material is disposed to cover an entire surface of the die. A protection material is formed over the encapsulant and around the plurality of first connectors and the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 28, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Jan Pei, Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Jen-Jui Yu, Cheng-Shiuan Wong
  • Publication number: 20240106235
    Abstract: A high anti-interference microsystem based on System In Package (SIP) for a power grid is provided. The high anti-interference microsystem comprises a ceramic cavity, a ceramic substrate, a magnetic cover plate, a digital signal processing circuit, an analog signal conditioning circuit and a shield, wherein the ceramic cavity supports the ceramic substrate, the magnetic cover plate is in sealed contact with the ceramic cavity, and the ceramic substrate is arranged in a cavity formed by the ceramic cavity and the magnetic cover plate; a sealed shell of the microsystem based on SIP is composed of the magnetic cover plate and the ceramic cavity; the digital signal processing circuit and the analog signal conditioning circuit are arranged on the ceramic substrate and respectively process received signals to be processed; the shield covers an outer side of the sealed shell and is used for shielding external magnetic field interference.
    Type: Application
    Filed: August 2, 2023
    Publication date: March 28, 2024
    Applicant: Electric Power Research Institute of State Grid Zhejiang Electric Power Co., LTD
    Inventors: Xianjun SHAO, Xiaoxin CHEN, Yiming ZHENG, Chen LI, Jianjun WANG, Ping QIAN, Hua XU, Shaoan WANG, Shaohe WANG, Haibao MU, Huibin TAO, Lin ZHAO, Wenzhe ZHENG, Dun QIAN
  • Publication number: 20240102980
    Abstract: Gas detection devices comprise a dehydration unit a concentration unit, and a temperature control unit for controlling a temperature. The gas detection device includes a sampling mode in which sample gas flows into and out of the dehydration unit through a first port and a second port, respectively, wherein the volatile organic compounds in the sample gas are concentrated in the concentration unit. The temperature control unit may be configured such that the temperature of the sample gas after flowing out from the dehydration unit and before flowing into the concentration unit is not greater than a first preset temperature. Generation of condensed substances in the sample gas can be effectively avoided in a simple manner after the sample gas flows into the concentration unit, thereby further preventing ice blockage. Methods for detecting volatile organic compounds in a sample gas are also disclosed.
    Type: Application
    Filed: September 22, 2023
    Publication date: March 28, 2024
    Applicant: Thermo Fisher (Shanghai) Instrument Co., Ltd.
    Inventors: Te Yu HUNG, Chien Kuo CHANG, Colin ZOU, Rong Hua CHEN, Jun FANG
  • Patent number: 11942464
    Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng, Kuei-Wei Huang, Ching-Hua Hsieh, Chung-Shi Liu, Chen-Hua Yu
  • Patent number: 11941065
    Abstract: Systems and methods are described for generating record clusters. The methods comprise receiving a plurality of records from data sources and providing at least a subset of the records to a scoring model that determines scores for various pairings of the records, a score for a given pair of the records representing a probability that the given pair of records contain data elements about the same entity. The method further comprises generating a graph data structure that includes a plurality of nodes, individual nodes representing a different record from the records. The method also comprises assigning a different unique identifier to individual clusters of the final clusters and responding to a request for data regarding a given entity by providing aggregated data elements from those records of the records associated with a cluster of the final clusters having an identifier that represents the given entity.
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: March 26, 2024
    Assignee: Experian Information Solutions, Inc.
    Inventors: Hua Li, Sophie Liu, Yi He, Zhixuan Wang, Chi Zhang, Kevin Chen, Shanji Xiong, Christer Dichiara, Mason Carpenter, Mark Hirn, Julian Yarkony
  • Patent number: 11938974
    Abstract: A series-parallel monorail hoist based on an oil-electric hybrid power and a controlling method thereof. The monorail hoist includes a cabin, a hydraulic driving system, a lifting beam, a gear track driving and energy storage system, and a speed adaptive control system connected in series with each other and travelling on a track. The monorail hoist is capable of implementing an independent drive by an electric motor or a diesel engine in an endurance mode, a hybrid drive of the electric motor and the diesel engine in a transportation mode, and a hybrid drive of the diesel engine and a flywheel energy storage system in a climbing mode, according to different operating conditions that include conditions of an upslope, a downslope and a load. Power requirements for the monorail hoist under various operating conditions are satisfied, and the excess energy is recovered during the process of travelling.
    Type: Grant
    Filed: September 30, 2022
    Date of Patent: March 26, 2024
    Assignees: CHINA UNIVERSITY OF MINING AND TECHNOLOGY, XUZHOU LIREN MONORAIL TRANSPORTATION EQUIPMENT CO., LTD.
    Inventors: Zhencai Zhu, Hao Lu, Yuxing Peng, Gongbo Zhou, Yu Tang, Hua Chen, Zaigang Xu, Mingzhong Wang, Mai Du, Fuping Zheng
  • Publication number: 20240095141
    Abstract: A method and an apparatus for displaying an information flow on a terminal device, an electronic device, a computer-readable storage medium, and a computer program product are provided. An implementation is: in response to detecting an activation operation on an application for displaying the information flow, reproducing, on the terminal device, a first page displayed on the terminal device when the application is last switched to running in the background or closed; and in response to determining that a time interval between the activation operation and the application being last switched to running in the background or closed does not exceed a first threshold, displaying a second page as a continuation of a content entry displayed in the first page, where the second page includes at least one first content entry cached in the terminal device before the activation operation but not displayed in the first page.
    Type: Application
    Filed: March 21, 2022
    Publication date: March 21, 2024
    Inventors: Yifan ZHANG, Yuqi WANG, Linfei CHU, Jing NING, Kunjie SUN, Yuhang ZHENG, Naifei SONG, Shujuan ZHANG, Lin LIU, Xunzhuo JU, Zhengwei CHEN, Wei ZHANG, Hua ZHANG, Congjun ZHOU, Tingkang WU, Tengfei LV, Hanmeng LIU, Lei WANG
  • Publication number: 20240097258
    Abstract: A battery box and a battery pack are provided. The battery box includes a bottom plate and a side wall. The side wall and the bottom plate enclose a space for accommodating a battery and/or an electrical component. The battery box further includes a lifting column integrally formed with the side wall and a fixed sealing block sleeved on the lifting column. The bottom plate is located between the side wall and the fixed sealing block. The side wall is fixedly connected to the bottom plate through the fixed sealing block. A first sealing member for sealing a gap between the fixed sealing block and the bottom plate is arranged between the fixed sealing block and the bottom plate. The fixed sealing block is sealingly connected to the lifting column.
    Type: Application
    Filed: March 7, 2023
    Publication date: March 21, 2024
    Applicant: CALB Group Co., Ltd.
    Inventors: Zhaoyang Jin, Shuaifeng Wang, Xulong Yang, Hua Chen, Xinwei Jiang
  • Publication number: 20240090709
    Abstract: A massage chair for bathing includes a chair seat, a seat back, and a massage device. The massage device is positioned on at least one of the chair seat and the seat back, where the seat back and the chair seat are connected using a locking unit.
    Type: Application
    Filed: September 14, 2023
    Publication date: March 21, 2024
    Applicant: Kohler (China) Investment Co., Ltd.
    Inventors: Hua ZHANG, Feixiang CHEN, Yanchao SHEN, Xinyao LIU, Jianqing ZHANG
  • Publication number: 20240092415
    Abstract: An HOD device, comprising: a framework; covering material, covering the frame work; at least one conductive region, provided on or in the covering material; wherein the conductive region is coupled to a capacitance detection circuit or a predetermined voltage level. The HOD device can be a vehicle control device such as a steering wheel. The conductive region comprises conductive wires which can be threads of the covering material. By this way, the arrangements of the conductive wires can be changed corresponding to the size or the shape of the frame work or any other requirements. Also, the interference caused by unstable factors can be improved since the conductive wires can be coupled to a ground source of the vehicle to provide a short capacitance sensing path.
    Type: Application
    Filed: September 21, 2022
    Publication date: March 21, 2024
    Applicant: PixArt Imaging Inc.
    Inventors: Chin-Hua Hu, Ching-Shun Chen, Yu-Han Chen, Yu-Sheng Lin
  • Publication number: 20240093031
    Abstract: A silicone composition comprising (A) an electrically conductive filler, (B) a polydiorganosiloxane polymer, (C) a polyorganohydrogensiloxane, (D) a hydrosilylation reaction catalyst, (E) a polymer additive, and optionally (F) a hydrosilylation reaction inhibitor has a low complex viscosity upon admixing and upon cure provides a high electrical conductivity and good electrical conductivity retention after heat aging.
    Type: Application
    Filed: December 23, 2020
    Publication date: March 21, 2024
    Inventors: Wenjie CHEN, Yifan XU, Hua REN, Fengyi SU, Joseph Ronald SOOTSMAN
  • Publication number: 20240098833
    Abstract: A method for mobility enhancement in wireless communication systems is provided. The method is performed by a User Equipment (UE) configured with a first Small Data Transmission (SDT) configuration by a first cell. The method includes receiving a Radio Resource Control (RRC) release message including a suspend configuration from the first cell; transitioning to an RRC INACTIVE state in response to receiving the RRC release message; receiving, in the RRC INACTIVE state, a System Information Block Type 1 (SIB1) including a second SDT configuration from a second cell; camping on the second cell in response to receiving the SIB1 from the second cell; and while the UE is camping on the second cell, refraining from using the first SDT configuration to initiate an SDT procedure associated with the second cell in a case that the UE does not support performing the SDT procedure associated with the second cell.
    Type: Application
    Filed: September 14, 2023
    Publication date: March 21, 2024
    Inventors: YUNG-LAN TSENG, YEN-HUA LI, HAI-HAN WANG, HUNG-CHEN CHEN
  • Publication number: 20240094429
    Abstract: A ranging workflow to interpret the ultradeep harmonic anisotropic attenuation (UHAA) measurements and estimate the distance and orientation of the existing cased well from the well being drilled is presented herein. The ranging workflow applies to scenarios in which the wells are near parallel to each other and performs reasonably well in boreholes which are more or less perpendicular to the formation layers. The ranging workflow generally includes deploying a deep directional resistivity (DDR) tool into a new wellbore; collecting UHAA data via the DDR tool; determining resistivity values based at least in part on the UHAA data; and determining a distance of the DDR tool from a casing of an existing wellbore proximate the new wellbore based at least in part on the resistivity values and a UHAA response table for the DDR tool.
    Type: Application
    Filed: September 18, 2023
    Publication date: March 21, 2024
    Inventors: Yong-Hua Chen, Saad Omar, Michael Thiel, Lin Liang
  • Patent number: 11935802
    Abstract: A package and a method of forming the same are provided. The package includes: a die stack bonded to a carrier, the die stack including a first integrated circuit die, the first integrated circuit die being a farthest integrated circuit die of the die stack from the carrier, a front side of the first integrated circuit die facing the carrier; a die structure bonded to the die stack, the die structure including a second integrated circuit die, a backside of the first integrated circuit die being in physical contact with a backside of the second integrated circuit die, the backside of the first integrated circuit die being opposite the front side of the first integrated circuit die; a heat dissipation structure bonded to the die structure adjacent the die stack; and an encapsulant extending along sidewalls of the die stack and sidewalls of the heat dissipation structure.
    Type: Grant
    Filed: June 24, 2022
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsien-Wei Chen, Ming-Fa Chen, Chen-Hua Yu
  • Patent number: 11935826
    Abstract: A method includes depositing a first passivation layer over a conductive feature, wherein the first passivation layer has a first dielectric constant, forming a capacitor over the first passivation layer, and depositing a second passivation layer over the capacitor, wherein the second passivation layer has a second dielectric constant greater than the first dielectric constant. The method further includes forming a redistribution line over and electrically connecting to the capacitor, depositing a third passivation layer over the redistribution line, and forming an Under-Bump-Metallurgy (UBM) penetrating through the third passivation layer to electrically connect to the redistribution line.
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chia-Ming Huang, Ming-Da Cheng, Songbor Lee, Jung-You Chen, Ching-Hua Kuan, Tzy-Kuang Lee
  • Patent number: 11935950
    Abstract: A device includes a first buried layer over a substrate, a second buried layer over the first buried layer, a first well over the first buried layer and the second buried layer, a first high voltage well, a second high voltage well and a third high voltage well extending through the first well, wherein the second high voltage well is between the first high voltage well and the third high voltage well, a first drain/source region in the first high voltage well, a first gate electrode over the first well, a second drain/source region in the second high voltage well and a first isolation region in the second high voltage well, and between the second drain/source region and the first gate electrode, wherein a bottom of the first isolation region is lower than a bottom of the second drain/source region.
    Type: Grant
    Filed: August 23, 2021
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Po-Yu Chen, Wan-Hua Huang, Jing-Ying Chen, Kuo-Ming Wu
  • Publication number: 20240088124
    Abstract: A semiconductor structure, comprising a redistribution layer (RDL) including a dielectric layer and a conductive trace within the dielectric layer; a first conductive member disposed over the RDL and electrically connected with the conductive trace; a second conductive member disposed over the RDL and electrically connected with the conductive trace; a first die disposed over the RDL; a second die disposed over the first die, the first conductive member and the second conductive member; and a connector disposed between the second die and the second conductive member to electrically connect the second die with the conductive trace, wherein the first conductive member is electrically isolated from the second die.
    Type: Application
    Filed: November 24, 2023
    Publication date: March 14, 2024
    Inventors: HSIANG-TAI LU, SHUO-MAO CHEN, MILL-JER WANG, FENG-CHENG HSU, CHAO-HSIANG YANG, SHIN-PUU JENG, CHENG-YI HONG, CHIH-HSIEN LIN, DAI-JANG CHEN, CHEN-HUA LIN