Patents by Inventor Hui Yu

Hui Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11986814
    Abstract: A method for synthesizing and application embedded alkaline earth metal oxide solid alkali includes: firstly, synthesizing an alkaline earth metal organic skeleton with single or multiple alkaline earth metals (Mg, Ca and Sr) as central metal elements; and then controlling the heating process to carry out high-temperature pyrolysis in a non-oxidizing atmosphere, so that the alkaline earth metal oxide are embedded in the nano carbon sheet to obtain a solid alkali catalyst. Finally, the catalyst is used to catalyze the transesterification of palm oil and methanol to produce biodiesel. The active site of the solid alkali obtained by the method is anchored on the nano-like carbon sheet, so that the active site is directly exposed on the surface of the catalyst, the catalytic activity is improved, the loss of the active site is inhibited, and the stability of the solid alkali catalyst is enhanced.
    Type: Grant
    Filed: June 7, 2022
    Date of Patent: May 21, 2024
    Assignees: SHANDONG JIANZHU UNIVERSITY, SHANDONG UNIVERSITY
    Inventors: Hui Li, Xiaoling Ma, Yongbo Wang, Ping Cui, Guoning Li, Min Guo, Shoujun Zhou, Wanpeng Lu, Mingzhi Yu
  • Patent number: 11989966
    Abstract: A method for forming semiconductor devices includes providing a substrate with a conductive pad formed thereon; forming a transparent structure over the substrate, wherein the transparent structure includes a plurality of collimating pillars adjacent to the conductive pad; forming a light-shielding structure over the plurality of collimating pillars and the conductive pad; performing a cutting process to remove one or more materials directly above the conductive pad, while leaving remaining material to cover the conductive pad, wherein the material includes a portion of the light-shielding structure; and performing an etching process to remove the remaining material to expose the conductive pad.
    Type: Grant
    Filed: October 8, 2021
    Date of Patent: May 21, 2024
    Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
    Inventors: Hsin-Hui Lee, Han-Liang Tseng, Jiunn-Liang Yu, Kwang-Ming Lin, Yin Chen, Si-Twan Chen, Hsueh-Jung Lin, Wen-Chih Lu, Chih-Hsien Chen
  • Publication number: 20240159380
    Abstract: Some embodiments of the present disclosure provide a Light Emitting Diode(LED) lamp cap, the LED lamp cap includes a metal casing and an adjusting part, the adjusting part includes an adjusting member disposed on the upper part of the metal casing and a connecting part disposed in the metal casing, the adjusting member is connected with a switch through the connecting part, and the connecting part is configured for rotating by rotating the adjusting member so as to change a gear of the switch to adjust color temperature or brightness or timing or sensing of an LED light source.
    Type: Application
    Filed: January 10, 2023
    Publication date: May 16, 2024
    Inventors: Yang LI, Huanliang WANG, Tingyu LIANG, Hui GE, Bin YU
  • Publication number: 20240162166
    Abstract: A package includes a package component, a device die over and bonded to the package component, a metal cap having a top portion over the device die, and a thermal interface material between and contacting the device die and the metal cap. The thermal interface material includes a first portion directly over an inner portion of the device die, and a second portion extending directly over a corner region of the device die. The first portion has a first thickness. The second portion has a second thickness greater than the first thickness.
    Type: Application
    Filed: January 25, 2024
    Publication date: May 16, 2024
    Inventors: Sung-Hui Huang, Da-Cyuan Yu, Kuan-Yu Huang, Pai Yuan Li, Hsiang-Fan Lee
  • Patent number: 11981098
    Abstract: A method of coating an edge surface of an optical lens is provided. The method includes providing an optical lens comprising a first optical surface and an opposing second optical surface, wherein the first and the second optical surfaces are connected by an edge surface, disposing at least one temporary protective material on at least a portion of a perimeter portion of one or both of the first and the second optical surfaces abutting the edge surface, disposing at least one coating material on the edge surface of the optical lens to obtain at least one edge coating, and removing any excess coating material disposed on the at least one temporary protective material. An optical lens having at least one temporary protective material disposed on only at least a portion of a perimeter portion of one or both of the first and the second optical surfaces abutting the edge surface is also provided.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: May 14, 2024
    Assignee: Essilor International
    Inventors: Mabeline Tan, Hui Yu, Ker Chin Ang, David Herfort
  • Patent number: 11983479
    Abstract: A method of fabricating an integrated circuit includes placing a first set of conductive feature patterns on a first level, placing a second set of conductive feature patterns on a second level, placing a first set of via patterns between the second set of conductive feature patterns and the first set of conductive feature patterns, placing a third set of conductive feature patterns on a third level different from the first level and the second level, placing a second set of via patterns between the third set of conductive feature patterns and the second set of conductive feature patterns, and manufacturing the integrated circuit based on at least one of the above patterns of the integrated circuit.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jung-Chan Yang, Ting-Wei Chiang, Jerry Chang-Jui Kao, Hui-Zhong Zhuang, Lee-Chung Lu, Li-Chun Tien, Meng-Hung Shen, Shang-Chih Hsieh, Chi-Yu Lu
  • Patent number: 11984444
    Abstract: A semiconductor device and method of manufacturing the same are provided. The semiconductor device includes a first active region extending along a first direction. The semiconductor device also includes a second active region extending along the first direction. The semiconductor device further includes a first gate extending along a second direction perpendicular to the first direction. The first gate has a first segment disposed between the first active region and the second active region. In addition, the semiconductor device includes a first electrical conductor extending along the second direction and across the first active region and the second active region, wherein the first segment of the first gate and the first electrical conductor are partially overlapped to form a first capacitor.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chung-Hui Chen, Wan-Te Chen, Tzu Ching Chang, Tsung-Hsin Yu
  • Patent number: 11980785
    Abstract: A foam production method includes mixing liquid nitrogen with a foaming material to produce foam. A gas is produced in situ from liquid nitrogen. As the ratio of the volume of the gas produced by gasification of liquid nitrogen to the volume of the liquid nitrogen is relatively high, when a large gas supply flow is needed to generate a large foam flow, a liquid nitrogen storage device of a small volume can be used instead of bulky air supply devices such as high-pressure gas cylinders, air compressors, air compressor sets and the like, reducing the volume of the air supply device. In addition, the liquid nitrogen used in foaming will release nitrogen gas after the foam blast, such that the nitrogen is also able to inhibit combustion on the surface of burning materials, accelerating the extinguishing of the fire.
    Type: Grant
    Filed: January 19, 2023
    Date of Patent: May 14, 2024
    Assignees: CHINA PETROLEUM & CHEMICAL CORPORATION, CHINA PETROLEUM & CHEMICAL CORPORATION QINGDAO RESEARCH INSTITUTE OF SAFETY ENGINEERING
    Inventors: Shanjun Mu, Chunming Jiang, Weihua Zhang, Quanzhen Liu, Xuqing Lang, Xiaodong Mu, Lin Wang, Jingfeng Wu, Longmei Tan, Zuzheng Shang, Rifeng Zhou, Jianxiang Li, Hui Yu
  • Publication number: 20240152246
    Abstract: A joystick includes a stick head, an actuating component, a substrate, a bearing base, a resilient recovering component, a first rotation component and a second rotation component. The actuating component has a first end and a second end opposite to each other. The first end is connected to the stick head, and an identification feature is disposed on the second end. The substrate has a detector used to detect the identification feature and determine motion of the stick head. The bearing base is disposed on the substrate. The resilient recovering component is disposed between the substrate and the bearing base. The first rotation component is movably disposed on the bearing base and rotatable in a first direction. The second rotation component is movably connected to the first rotation component and rotatable in a second direction different from the first direction, and connected to the actuating component in a rotatable manner.
    Type: Application
    Filed: January 16, 2024
    Publication date: May 9, 2024
    Applicant: PixArt Imaging Inc.
    Inventors: Hung-Yu Lai, Yong-Nong Huang, Hui-Hsuan Chen, Jia-Hong Huang
  • Patent number: 11979158
    Abstract: An integrated circuit (IC) device includes a master latch circuit having a first clock input and a data output, a slave latch circuit having a second clock input and a data input electrically coupled to the data output of the master latch circuit, and a clock circuit. The clock circuit is electrically coupled to the first clock input by a first electrical connection configured to have a first time delay between the clock circuit and the first clock input. The clock circuit is electrically coupled to the second clock input by a second electrical connection configured to have a second time delay between the clock circuit and the second clock input. The first time delay is longer than the second time delay.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: May 7, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Cheng-Yu Lin, Yung-Chen Chien, Jia-Hong Gao, Jerry Chang Jui Kao, Hui-Zhong Zhuang
  • Publication number: 20240141123
    Abstract: A manufacturing method of a modified polymer layer modified by hydroxyapatite is provided in the present disclosure, including following steps: (a) providing a polymer layer; (b) plasma-activating acrylic acid using an atmospheric cold plasma device to modify a surface of the polymer layer to obtain an acrylic-modified polymer layer; (c) immersing the acrylic-modified polymer layer in a first solution containing a calcium ion to obtain a calcium-containing modified layer; and (d) immersing the calcium-containing modified layer in a second solution containing phosphate salt to obtain a modified polymer layer modified by hydroxyapatite.
    Type: Application
    Filed: June 9, 2023
    Publication date: May 2, 2024
    Inventors: Wei-Yu CHEN, Jui-Sheng LEE, Hui-Ju HSU
  • Publication number: 20240145559
    Abstract: A transistor structure includes a substrate, a source electrode, a drain electrode, a protective layer and a gate electrode. The source electrode and the drain electrode are provided on the substrate. The protective layer is provided on the substrate. The protective layer is provided between the source electrode and the drain electrode. The protective layer includes a SiNx layer and a SiOx layer. The SiOx layer is provided on the substrate, the SiNx layer is provided on the SiOx layer, and a through hole of the protective layer is formed to extend through the SiNx layer and the SiOx layer. The gate electrode is provided in the through hole, and the gate electrode is separated from at least part of the SiOx layer so as to form an air gap therebetween.
    Type: Application
    Filed: December 21, 2022
    Publication date: May 2, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chang-Yan HSIEH, Po-Tsung TU, Jui-Chin CHEN, Hui-Yu CHEN, Po-Chun YEH
  • Publication number: 20240146100
    Abstract: The present application relates to a battery box, the battery box comprising: a charging and energy storage unit for charging and storing electrical energy using an input voltage supplied to the battery box; a power failure detection unit for detecting a power failure of the input voltage; and a power output switching unit for switching an output based on a detection result of the power failure detection unit, wherein the power output switching unit is configured to output a voltage from the charging and energy storage unit when the power failure detection unit detects a power failure, and is configured not to output the voltage when the power failure detection unit does not detect the power failure. The present application also relates to an air conditioning system and a control method for the air conditioning system.
    Type: Application
    Filed: October 31, 2023
    Publication date: May 2, 2024
    Inventors: Xiaojun Guo, Zehang Yu, Hui Zhai, Jian Ni
  • Publication number: 20240137484
    Abstract: Provided in the embodiments of the present disclosure are a display panel, a display apparatus and a driving method therefor, and an image rendering method.
    Type: Application
    Filed: August 27, 2021
    Publication date: April 25, 2024
    Inventors: Tieshi WANG, Kuanjun PENG, Xue DONG, Chunmiao ZHOU, Tao HONG, Hui ZHANG, Xin DUAN, Minglei CHU, Xiaochuan CHEN, Guangcai YUAN, Jing YU
  • Patent number: 11963969
    Abstract: Provided is a pharmaceutical composition including gastrodin and a use thereof for the prevention or the treatment of amyotrophic lateral sclerosis. The pharmaceutical composition is effective in reducing neuronal axon degeneration and neurofibromin accumulation, improving symptoms of amyotrophic lateral sclerosis and extending life of patients of amyotrophic lateral sclerosis.
    Type: Grant
    Filed: September 16, 2022
    Date of Patent: April 23, 2024
    Assignee: BUDDHIST TZU CHI MEDICAL FOUNDATION
    Inventors: Chia-Yu Chang, Shinn-Zong Lin, Hsiao-Chien Ting, Hui-I Yang, Horng-Jyh Harn, Hong-Lin Su, Ching-Ann Liu, Yu-Shuan Chen, Tzyy-Wen Chiou, Tsung-Jung Ho
  • Patent number: 11964358
    Abstract: A method includes placing a polisher head on platen, the polisher head including a set of first magnets, and controlling a set of second magnets to rotate the polisher head on the platen, wherein controlling the set of second magnets includes reversing the polarity of at least one second magnet of the set of second magnets to produce a magnetic force on at least one first magnet of the set of first magnets, wherein the set of second magnets are external to the polisher head.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shang-Yu Wang, Chun-Hao Kung, Ching-Hsiang Tsai, Kei-Wei Chen, Hui-Chi Huang
  • Patent number: 11967644
    Abstract: A semiconductor device can include: a substrate having a first doping type; a first well region located in the substrate and having a second doping type, where the first well region is located at opposite sides of a first region of the substrate; a source region and a drain region located in the first region, where the source region has the second doping type, and the drain region has the second doping type; and a buried layer having the second doping type located in the substrate and below the first region, where the buried layer is in contact with the first well region, where the first region is surrounded by the buried layer and the first well region, and the first doping type is opposite to the second doping type.
    Type: Grant
    Filed: January 11, 2023
    Date of Patent: April 23, 2024
    Assignee: Silergy Semiconductor Technology (Hangzhou) LTD
    Inventors: Meng Wang, Yicheng Du, Hui Yu
  • Publication number: 20240128219
    Abstract: A semiconductor die including mechanical-stress-resistant bump structures is provided. The semiconductor die includes dielectric material layers embedding metal interconnect structures, a connection pad-and-via structure, and a bump structure including a bump via portion and a bonding bump portion. The entirety of a bottom surface of the bump via portion is located within an area of a horizontal top surface of a pad portion of the connection pad-and-via structure.
    Type: Application
    Filed: December 6, 2023
    Publication date: April 18, 2024
    Inventors: Hui-Min Huang, Wei-Hung Lin, Kai Jun Zhan, Chang-Jung Hsueh, Wan-Yu Chiang, Ming-Da Cheng
  • Publication number: 20240130246
    Abstract: A method for fabricating a semiconductor device includes the steps of first forming a first inter-metal dielectric (IMD) layer on a substrate and a metal interconnection in the first IMD layer, forming a magnetic tunneling junction (MTJ) and a top electrode on the metal interconnection, forming a spacer adjacent to the MTJ and the top electrode, forming a second IMD layer around the spacer, forming a cap layer on the top electrode, the spacer, and the second IMD layer, and then patterning the cap layer to form a protective cap on the top electrode and the spacer.
    Type: Application
    Filed: December 25, 2023
    Publication date: April 18, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Po-Kai Hsu, Ju-Chun Fan, Ching-Hua Hsu, Yi-Yu Lin, Hung-Yueh Chen
  • Patent number: 11961637
    Abstract: This disclosure relates to a stretchable composite electrode and a fabricating method thereof, and particularly relates to a stretchable composite electrode including a silver nanowire layer and a flexible polymer film and a fabricating method thereof.
    Type: Grant
    Filed: December 7, 2022
    Date of Patent: April 16, 2024
    Assignee: TPK ADVANCED SOLUTIONS INC.
    Inventors: Wei Sheng Chen, Ching Mao Huang, Jia Hui Zhou, Huan Ran Yu, Shu Xiong Wang, Chin Hui Lee