Abstract: A method for controlling a traffic light, a method and apparatus for navigating an unmanned vehicle and a method and apparatus for training a model are provided. An implementation comprises: generating a reinforced traffic light state parameter according to vehicle state representation information of an unmanned vehicle currently contained in a preset area of a target traffic light and a current traffic light state parameter of the target traffic light; and generating a traffic light control action according to the reinforced traffic light state parameter; where the reinforced traffic light state parameter is used to cause an unmanned vehicle navigation end to generate a reinforced vehicle state parameter according to a reinforced traffic light state and a current vehicle state parameter of a target unmanned vehicle, and generate an unmanned vehicle navigation action according to the reinforced vehicle state parameter.

Abstract: A high-throughput 3D printing system for preparing multi-component, small sized samples, includes a raw material supply module, providing a various kinds of metal powders for printing small sized samples; the first mixer module, mixing the metal powders obtained from the raw material supply module to generate the first blended metal powders; the second mixer module, mixing the first mixed metal powders, in order to generate the second blended metal powders for printing small sized samples; the first printing module, printing the secondary blended metal powder into a small-sized sample; a control module, controlling other functional modules of the high-throughput 3D printing system for generating small-size samples.

Abstract: The present invention relates to a groundwater circulation well system with pressure-adjustable hydrodynamic cavitation, including a circulation well body, a sucked and injected water circulation assembly and a hydrodynamic cavitator. The sucked and injected water circulation assembly is based on a water suction and injection pump. The hydrodynamic cavitator is provided, inside a vortex chamber, with a vortex water inlet column capable of changing a water passing aperture. The hydrodynamic cavitator is capable of changing a bubbling pressure and a breaking pressure of hydrodynamic cavitation bubbles in the vortex water inlet column. The hydrodynamic cavitator generates vortices in the circulation well body to accelerate uniform mixing of a remediation agent and the groundwater. Energy from collapsing and bursting of the hydrodynamic cavitation bubbles activates the remediation agent such that contaminants in the groundwater are efficiently degraded.

Abstract: A package structure and a method of forming the same are provided. The package structure includes a die, an encapsulant and a RDL structure, the encapsulant encapsulate sidewalls of the die. The RDL structure is disposed on the die and the encapsulant. The RDL structure includes a first dielectric structure and a first redistribution layer. The first dielectric structure includes a first dielectric material layer and a second dielectric material layer on the first dielectric material layer. The first redistribution layer is embedded in the first dielectric structure and electrically connected to the die, the redistribution layer comprises a first seed layer and a first conductive layer disposed on the first seed layer. A topmost surface of the first seed layer and a topmost surface of the first conductive layer are substantially level with a top surface of the second dielectric material layer.

Abstract: A package includes a package component, a device die over and bonded to the package component, a metal cap having a top portion over the device die, and a thermal interface material between and contacting the device die and the metal cap. The thermal interface material includes a first portion directly over an inner portion of the device die, and a second portion extending directly over a corner region of the device die. The first portion has a first thickness. The second portion has a second thickness greater than the first thickness.

Abstract: A magnetoresistive random access memory (MRAM) structure, including a substrate and multiple MRAM cells on the substrate, wherein the MRAM cells are arranged in a memory region adjacent to a logic region. An ultra low-k (ULK) layer covers the MRAM cells, wherein the surface portion of ultra low-k layer is doped with fluorine, and dents are formed on the surface of ultra low-k layer at the boundaries between the memory region and the logic region.

Abstract: A heat exchanger includes a fin set formed by a plurality of fins stacked together and a refrigerant pipe set passing through the fin set. The fin set includes a connection member, and a first fin member and a second fin member connected to each other via the connection member. An included angle between the first fin member and the second fin member is larger than zero. The first fin member and the second fin member are arranged at two sides, respectively, of a notch of the fin set. The notch is located at an air input side and/or an air output side of the connection member.

Abstract: A method for deep learning video microscopy-based antimicrobial susceptibility testing of a bacterial strain in a sample by acquiring image sequences of individual bacterial cells of the bacterial strain in a subject sample before, during, and after exposure to each antibiotic at different concentrations. The image sequences are compressed into static images while preserving essential phenotypic features. Data representing the static images are input into a pre-trained deep learning (DL) model which generates output data; and antimicrobial susceptibility for the bacterial strain is determined from the output data.

Abstract: A structure including a first semiconductor die and a second semiconductor die is provided. The first semiconductor die includes a first bonding structure. The first bonding structure includes a first dielectric layer and first conductors embedded in the first dielectric layer. The second semiconductor die includes a second bonding structure. The second bonding structure includes a second dielectric layer and second conductors embedded in the second dielectric layer. The first dielectric layer is in contact with the second dielectric layer, and the first conductors are in contact with the second conductors. Thermal conductivity of the first dielectric layer and the second dielectric layer is greater than thermal conductivity of silicon dioxide.

Abstract: A method for making a IC is provided, including: identifying, in a schematic, first and second edge elements, which edge elements including devices whose layout patterns are configured to conform to a first layout grid; identifying all the elements between the first and second edge elements, at least one of the identified elements including a device whose layout pattern is configured to conform to a second layout grid that is finer than the first layout grid; and calculating a spatial quantity of a combined layout pattern of the identified elements between the first and second edge elements to determine whether the combined layout pattern conforms to the first layout grid.

Abstract: A dimming assembly includes a first prism having a first surface and a second surface opposite to each other, and a second prism disposed on a side where the second surface of the first prism is located. The first surface includes first dimming portions, each of which includes two first side surfaces. Edges of the two first side surfaces away from the second surface intersect at a first intersection line. A surface of the second prism proximate to the second surface includes second dimming portions, each of which includes two second side surfaces. Edges of the two second side surfaces proximate to the second surface intersect at a second intersection line. A distance between orthographic projections of two adjacent first intersection lines on the second surface is less than a distance between orthographic projections of two adjacent second intersection lines on the second surface.

Abstract: A low numerical aperture fiber output diode laser module, which having several independent diode lasers, and collimated and converged the light beam, for the coupling the light to the core optical fiber with a core diameter of 105 um and a numerical aperture of 0.12. Compared with general products with a numerical aperture of 0.22, the light output angle is reduced to 55%, and use a general blue laser diode for verification. Use an optical software for facilitating the design and optimization of the parameters of the optical lens module.

Abstract: Among other things, the present disclosure provides oligonucleotides and compositions thereof. In some embodiments, provided oligonucleotides and compositions are useful for adenosine modification. In some embodiments, the present disclosure provides methods for treating various conditions, disorders or diseases that can benefit from adenosine modification.

Abstract: A display module is provided. The display module includes a main display panel, an auxiliary display panel and a backlight module which are laminated sequentially, at least one temperature sensing circuit in the auxiliary display panel, and a control circuit coupled to the at least one temperature sensing circuit. The temperature sensing circuit is configured to generate, based on temperature of the auxiliary display panel, a temperature signal related to the temperature, and the control circuit is configured to adjust a display parameter of the main display panel based on the temperature signal.

Abstract: Provided is a traffic sign recognition method based on a lightweight neural network, which including: a lightweight neural network model is constructed for training and pruning to obtain a lightweight neural network model; the lightweight neural network model comprises a convolution feature extraction part and a classifier part; the convolution feature extraction part includes one layer of conventional 3×3 convolution and 16 layers of separable asymmetric convolution. The classifier part includes three layers of separable full connection modules.

Abstract: A heating system for compressed parts capable of controlling process atmosphere and pressure includes an accommodating body, a heating device, an atmosphere controlling device, and a processing pressure adjusting device. The heating device is disposed inside or outside of the accommodating body to heat a component to be heated, so as to remove an impurity within the component to be heated. The atmosphere controlling device transports a reaction gas, such as hydrogen, oxygen, water vapor, or plasma, into a cavity for reacting with the impurity within the component to be heated. A phase transition or a chemical reaction can be carried out, such that the impurity is gasified, oxidized, carbonized, or disintegrated. The processing pressure adjusting device uses an inert gas (e.g., a nitrogen gas or an argon gas) to control the processing pressure in the cavity to be from 800 Torr to 10?2 Torr.

Abstract: In a flip chip package, lines, an identification line and a dummy line are provided on a first surface of a light-transmissive carrier, and a supportive layer is disposed on a second surface of the light-transmissive carrier. Bumps and an identification bump of a chip are bonded to the lines and the identification line, respectively. Shadows of the dummy line, the identification line and the identification bump which are projected on the second surface are visible from an opening of the supportive layer. The shadows can be inspected through the opening so as to know whether the bumps are bonded to the lines correctly.