Patents by Inventor Jack Wang

Jack Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060252571
    Abstract: A grip includes a sleeve sleeved onto the handle of a sports apparatus, a covering, which is formed of multiple sheet members of different materials and/or different colors longitudinally abutted against one another around the periphery of the sleeve and arranged in an apposition manner for the gripping of different parts of the hand, and sutures or adhesive to fasten the long sides of the sheet members to one another.
    Type: Application
    Filed: July 8, 2005
    Publication date: November 9, 2006
    Inventor: Jack Wang
  • Publication number: 20060234012
    Abstract: A cushion pad for shows includes a top plate, a bottom plate and a flexible mediate portion connected between the top plate and the bottom plate. The flexible mediate portion includes a plurality of straight plates perpendicularly connected to the top plate and the bottom plate, and a serrated plate is connected between the straight plates extending from the top plate and the bottom plate.
    Type: Application
    Filed: April 19, 2005
    Publication date: October 19, 2006
    Inventor: Jack Wang
  • Publication number: 20060188681
    Abstract: A grip belt includes a belt body, a protective film separatably covered on the belt body, and a sticker having a top surface and a bottom surface. The bottom surface of the sticker has a bonding area covered with an adhesive and bonded to a rear end of the protective film and a clean area suspended outside the protective film for pulling by a user to separate the protective film from the belt body.
    Type: Application
    Filed: May 17, 2005
    Publication date: August 24, 2006
    Applicant: HIGH CEDAR ENTERPRISE CO., LTD.
    Inventor: Jack Wang
  • Patent number: 7069737
    Abstract: A water-cooling heat dissipation system includes a heat sink mounted on a heat generating electronic device and a circulating loop connected to two ends of the heat sink. The circulating loop has a water pump attached at the inlet of the heat sink, a first cooling base attached at the outlet of the heat sink, and a second cooling base between the water pump and the heat sink. The second cooling base has a cryogenic chip to provide icy water to the heat sink, such that heat dissipation efficiency is greatly enhanced.
    Type: Grant
    Filed: April 20, 2004
    Date of Patent: July 4, 2006
    Assignees: Waffer Technology Corp.
    Inventors: Jack Wang, Cheng-Hua Cheng, Michael Lin, Charles Ma
  • Patent number: 7019979
    Abstract: A fastening structure provided by the present invention is used to fastening a heat dissipating device with a printed circuit board in which a plurality of holes is formed. The fastening structure has a back plate disposed underneath the printed circuit board and a plurality of fitting columns, wherein the back plate is perforated with a plurality of holes and each of the fitting columns has an elongate hollow tube and an insertion member projecting from a periphery of one end of the hollow tube. The hollow tube has a threaded internal sidewall and the insertion member has a shape conformal to the respective holes at which the fitting columns are fixed to the back plate.
    Type: Grant
    Filed: November 21, 2003
    Date of Patent: March 28, 2006
    Assignees: Waffer Technology Corp.
    Inventors: Jack Wang, Cheng-Hua Cheng, Michael Lin, Charles Ma
  • Patent number: 7008687
    Abstract: A protective strap for spirally winding around a handle includes a main body and a distinctive strap. The main body is an elongated strap member having two lateral edges, two end edges, a top side and a bottom side. The two lateral edges of the main body are respectively longer in length than the two end edges of the main body. The distinctive strap is disposed on the top side of the main body, having two lateral fringes and two end fringes shorter in length than the two lateral fringes. The distinctive strap is parallel to one of the lateral edges of the main body and has a width between the two lateral fringes thereof smaller than that between two lateral edges of the main body.
    Type: Grant
    Filed: September 12, 2003
    Date of Patent: March 7, 2006
    Inventor: Jack Wang
  • Publication number: 20060029776
    Abstract: A rubber-faced member includes a rubber layer on which a pressing pattern is formed, and a thermoplastic base layer bonded to the rubber layer. The rubber-faced member is made by firmly bonding the thermoplastic base layer to a bottom surface of the rubber layer and then directly or indirectly hot pressing the thermoplastic base layer to permanently deform the thermoplastic base layer such that a pressing pattern on the top surface of the rubber layer that is bonded to the thermoplastic base layer is formed corresponding to the deformed portion of the thermoplastic base layer.
    Type: Application
    Filed: August 5, 2004
    Publication date: February 9, 2006
    Inventor: Jack Wang
  • Publication number: 20060011329
    Abstract: A heat pipe heat sink with a holeless fin module is disclosed in the present invention. Because of the holeless arrangement the heat pipe heat sink is much more convenient for manufacturing. The heat generated by an electrical component can quickly be transferred into the heat pipe and uniformly distributed to each of the heat dissipating fins. The heat pipe heat sink includes a heat dissipating fin module, a heat conducting member, one or more heat pipes installed on the heat conducting member, and a heat conducting plate which is thermally connected to the heat conducting member and the electrical component. The end surface of the heat conducting member with the heat pipe installed thereon is convenient for application of an adhesive because the end surface and the pipe wall of the heat pipe are exposed outside of the heat dissipating fin module before any combination takes place.
    Type: Application
    Filed: July 16, 2004
    Publication date: January 19, 2006
    Inventors: Jack Wang, Michael Lin, Charles Ma, L.H. Lin
  • Publication number: 20060005944
    Abstract: A method for fabricating a thermoelectric heat dissipation device including the steps of providing a base plate, a thermoelectric semiconductive element connected to the base plate and a heat sink in form of plates or fins with one surface coated an electric insulation coating and patterned conductive lines, and adhering the heat sink to the thermoelectric semiconductive element. Accrodingly, the thermoelectric heat dissipation device is provided including the theremoelectric semiconductive element as a cryogenic chip and the heat sink. The cooling surface of the cryogenic chip is directly electrically connected to the heat sink which is in form of plates or fins, and the other surface of the cryogenic chip is adhered to the base plate. The base plate of the device is utilized to connect with the surface of an electronic component for heat transfer.
    Type: Application
    Filed: July 6, 2004
    Publication date: January 12, 2006
    Inventors: Jack Wang, Michael Lin, Charles Ma
  • Publication number: 20050281016
    Abstract: An internally disposed cooling device is provided. The cooling device includes a cooling member and a docket member. The cooling member includes a first cooling unit, a second unit and a cryogenic element. The cryogenic element has a cold surface that contacts the first cooling unit, and a hot surface that contacts the second cooling unit. Since the cold surface of the cryogenic element has a temperature much lower than that of the room temperature, the first cooling unit can thus produce cold and dry air to cool down the electronic apparatus. Meanwhile, the second cooling unit is employed to dissipate heat generated from the cryogenic element.
    Type: Application
    Filed: June 21, 2004
    Publication date: December 22, 2005
    Inventors: Jack Wang, Charles Ma, Michael Lin
  • Patent number: 6968889
    Abstract: A heat dissipating device includes a fastening structure and a heat sink. The heat sink has a thermal conductive base which has a top surface and two T-shape slots formed at two opposing ends of the top surface. The fastening structure has a pair of brackets. Each of the brackets has a planar plate and a T-shape arm to be inserted into the corresponding T-shape slot. The T-shape arms are hinged with one end of the planar plates, such that when the T-shape arms are inserted into the T-shape slots, the planar plates extend horizontally at a level lower than the top surface of the base. Each of the planar plates has a through hole through which the fastening structure can be mounted to a board by a fastener.
    Type: Grant
    Filed: November 21, 2003
    Date of Patent: November 29, 2005
    Assignees: Waffer Technology Corp.
    Inventors: Jack Wang, Cheng-Hua Cheng, Michael Lin, Charles Ma
  • Publication number: 20050254213
    Abstract: An air-conditioning heat dissipation system includes a heat dissipation device and an enclosure. The heat dissipation device has a top and a bottom heat sinks secured to each other and a cryogenic chip sandwiched between the top and bottom heat sinks. The enclosure has a box assembly and a planar assembly extending from one side of the box assembly. The box assembly is operative to receive the heat dissipation device therein, and the planar assembly includes a channel having one end in communication with the box assembly and the other end open to external.
    Type: Application
    Filed: May 12, 2004
    Publication date: November 17, 2005
    Inventors: Jack Wang, Cheng-Hua Cheng, Michael Lin, Charles Ma
  • Publication number: 20050230086
    Abstract: A water-cooling heat dissipation system includes a heat sink mounted on a heat generating electronic device and a circulating loop connected to two ends of the heat sink. The circulating loop has a water pump attached at the inlet of the heat sink, a first cooling base attached at the outlet of the heat sink, and a second cooling base between the water pump and the heat sink. The second cooling base has a cryogenic chip to provide icy water to the heat sink, such that heat dissipation efficiency is greatly enhanced.
    Type: Application
    Filed: April 20, 2004
    Publication date: October 20, 2005
    Inventors: Jack Wang, Cheng-Hua Cheng, Michael Lin, Charles Ma
  • Publication number: 20050177981
    Abstract: A handle sleeve includes a tube, which is made by an elongated piece rolled. The elongated piece has a first surface, a second surface and two bonding portions at two elongated sides thereof. The two bonding portions having the first surface are bonded together face to face to form a connecting portion. The tube has the first surface at an exterior thereof and has the second surface and the connecting portion at an interior thereof.
    Type: Application
    Filed: February 17, 2004
    Publication date: August 18, 2005
    Inventor: Jack Wang
  • Publication number: 20050123723
    Abstract: A grip strip is made by preparing a substrate sheet having a plurality of through holes through top and bottom sides thereof, and made from a first polymer, then dipping or coating the substrate sheet with a melt second polymer different from the first polymer such that the through holes of the substrate sheet are filled up and at least one of the top and bottom sides of the substrate sheet is covered by the second polymer, and then hardening the second polymer-covered substrate sheet.
    Type: Application
    Filed: December 3, 2003
    Publication date: June 9, 2005
    Inventor: Jack Wang
  • Publication number: 20050111190
    Abstract: A fastening structure provided by the present invention is used to fastening a heat dissipating device with a printed circuit board in which a plurality of holes is formed. The fastening structure has a back plate disposed underneath the printed circuit board and a plurality of fitting columns, wherein the back plate is perforated with a plurality of holes and each of the fitting columns has an elongate hollow tube and an insertion member projecting from a periphery of one end of the hollow tube. The hollow tube has a threaded internal sidewall and the insertion member has a shape conformal to the respective holes at which the fitting columns are fixed to the back plate.
    Type: Application
    Filed: November 21, 2003
    Publication date: May 26, 2005
    Inventors: Jack Wang, Cheng-Hua Cheng, Michael Lin, Charles Ma
  • Publication number: 20050111196
    Abstract: A fastening structure used for fastening a heat sink to a heat generating device formed on a board is disclosed. The heat sink has a plurality of vertically extending fins spaced by each other by a first gap, and the fastening structure has a pair of blocking members applied to two outermost fins of the heat sink. Each of the blocking members has a horizontal plate, a pair of arms extending from two opposing sides of the horizontal plate, a vertical plate extending perpendicularly from one end of the horizontal plate, a pair of wings extending from two opposing sides of the vertical plates, and a pair of resilient flaps extending from top edges of the wings. Each of the arms is terminated with a hook, and each of the block members further has a pair of loops formed on the board, such that by engaging the hooks with the loops, the fastening structure secures the heat sink to the heat generating device on the board.
    Type: Application
    Filed: November 21, 2003
    Publication date: May 26, 2005
    Inventors: Jack Wang, Cheng-Hua Cheng, Michael Lin, Charles Ma
  • Publication number: 20050109488
    Abstract: A heat dissipating device which has a fastening structure and a heat sink is disclosed. The heat sink has a thermal conductive base which has a top surface and two T-shape slots formed at two opposing ends of the top surface. The fastening structure has a pair of brackets. Each of the brackets has a planar plate and a T-shape arm to be inserted into the corresponding T-shape slot. The T-shape arms are hinged with one end of the planar plates, such that when the T-shape arms are inserted into the T-shape slots, the planar plates extend horizontally at a level lower than the top surface of the base. Each of the planar plates has a through hole through which the fastening structure can be mounted to a board by a fastener. Preferably, the heat sink further has a plurality of fins mounted to the top surface of the base. Each of the fins has a notch recessed from a bottom edge thereof.
    Type: Application
    Filed: November 21, 2003
    Publication date: May 26, 2005
    Inventors: Jack Wang, Cheng-Hua Cheng, Michael Lin, Charles Ma
  • Patent number: 6896840
    Abstract: The present invention provides a protective strap and the method of manufacturing the same. The method includes the steps of providing an elongated strap-like base layer; printing a predetermined drawing on a surface of the base layer, wherein the drawing is formed of a plurality of color bits having a color different from that of the base layer; heating and pressurizing the color bits of the base layer at the same time to enable the base layer to form a plurality of concavities on its surface, wherein each of the color bits is positioned in one of the concavities.
    Type: Grant
    Filed: May 7, 2003
    Date of Patent: May 24, 2005
    Inventor: Jack Wang
  • Patent number: 6882534
    Abstract: A fastening device for heat slug includes a frame, two projections and a heat slug. The frame defines an accommodating space therein. The projections are formed on the frame. The heat slug has a plurality of shoulders and is located in the accommodating space. The frame abuts against the shoulders of the heat slug. Thereby the fastening device of the invention is compatible with different types of CPU such as Pentium IV and K7 types.
    Type: Grant
    Filed: January 6, 2003
    Date of Patent: April 19, 2005
    Assignee: Waffer Tech. Co.
    Inventors: Jack Wang, Cheng-Hua Cheng, Michael Lin, Charles Ma