Abstract: Structures and methods for programmable array type logic and/or memory with p-channel devices and asymmetrical low tunnel barrier intergate insulators are provided. The programmable array type logic and/or memory devices include p-channel non-volatile memory which has a first source/drain region and a second source/drain region separated by a p-type channel region in an n-type substrate. A floating gate opposing the p-type channel region and is separated therefrom by a gate oxide. A control gate opposes the floating gate. The control gate is separated from the floating gate by an asymmetrical low tunnel barrier intergate insulator. The asymmetrical low tunnel barrier intergate insulator includes a metal-oxide insulator selected from the group consisting of Al2O3, Ta2O5, TiO2, ZrO2, Nb2O5, SrBi2Ta2O3, SrTiO3, PbTiO3, and PbZrO3. The floating gate includes a polysilicon floating gate having a metal layer formed thereon in contact with the low tunnel barrier intergate insulator.

Abstract: A multi-chip electronic package comprised of a plurality of integrated circuit chips secured together in a stack formation. The chip stack is hermetically sealed in an enclosure. The enclosure comprises a pressurized, thermally conductive fluid, which is utilized for cooling the enclosed chip stack. A process and structure is proposed that allows for densely-packed, multi-chip electronic packages to be manufactured with improved heat dissipation efficiency, thus improving the performance and reliability of the multi-chip electronic package.

Abstract: Manufacturable processes and the resultant structures utilize metal hydride as an internal source of hydrogen to enhance heat removal within semiconductor packages that employ low dielectric constant materials. The use of a metal hydride heated by internal or external sources facilitates pressurizing hydrogen gas or hydrogen-helium gas mixtures within a hermetically-sealed package. The configuration of the metal hydride can include, where needed to generate the pressure required in larger packages, a relatively large area of metal hydride material on at least one or a plurality of hydrogen generation-dedicated chips. Alternatively, the configuration can include at least one or a plurality of relatively small “islands” of metal hydride material on each of at least one or a plurality of integrated circuit-bearing chips.

Abstract: A full wafer probe card, a method for making the probe card and a full wafer testing system. The probe card includes test probes comprising cantilever elements configured and arranged with probe tips in a pattern corresponding to an array of bond pads of semiconductor dice residing on a device wafer. The probe card is desirably fabricated of the same material, such as silicon, as the device wafer to be tested. The cantilever elements may be fabricated from the material of the probe card substrate using known silicon micro-machining techniques including isotropic and anisotropic etching. Additionally, conductive feedthroughs or vias are formed through the probe card to electrically connect the probe tips with conductive pads on an opposing side of the substrate which interface with test contacts of external test circuitry. The conductive feedthroughs may be formed as coaxial structures, which help to minimize stray capacitance and inductance.

Abstract: An embodiment of the present invention includes a disposable print head for ejecting controlled amounts of liquid (e.g., solder) at a high rate onto the surface (e.g., an integrated circuit) in close proximity to the ejecting source. The embodiment involves the use of a controlled burst of gas that is developed by rapidly heating a metallic hydride film with a laser to disassociate the hydrogen therefrom. The pressure created by the burst of a hydrogen gas is used to eject an amount of a liquid (e.g., a solder) from an appropriate conduit that is fed liquid from a reservoir. The surfaces in the print head that contact the liquid are coated to assist in priming the print head for a subsequent ejection event.

Abstract: Methods for forming multiple dielectric layers at low temperatures include forming a number of metallic layers on a substrate and oxidizing the metallic layers to different dielectric oxides. Oxidation is performed one layer at a time, or all layers together. Dielectric layers thus formed have multiple different oxides in layers, reducing defects, providing high capacitance, and low leakage currents.

Abstract: An embodiment of the present invention includes a disposable print head for ejecting controlled amounts of liquid (e.g., solder) at a high rate onto the surface (e.g., an integrated circuit) in close proximity to the ejecting source. The embodiment involves the use of a controlled burst of gas that is developed by rapidly heating a metallic hydride film with a laser to disassociate the hydrogen therefrom. The pressure created by the burst of hydrogen gas is used to eject an amount of a liquid (e.g., a solder) from an appropriate conduit that is fed liquid from a reservoir. The surfaces in the print head that contact the liquid are coated to assist in priming the print head for a subsequent ejection event.

Abstract: A microelectronic device package and method for manufacture. In one embodiment, the device package can include a microelectronic substrate having first and second device features, a conductive link that includes a conductive material extending between the first and second device features, and an external cover attached to the substrate and at least partially enclosing the first and second device features and the conductive link. The external cover can have a composition substantially identical to the composition of the conductive links and the external cover can be formed simultaneously with formation of the conductive link to reduce the number of process steps required to form the microelectronic device package. A sacrificial material can temporarily support the conductive link during manufacture and can subsequently be removed to suspend at least a portion of the conductive link between two points.

Abstract: An embodiment of the present invention includes a disposable print head for ejecting controlled amounts of liquid (e.g., solder) at a high rate onto the surface (e.g., an integrated circuit) in close proximity to the ejecting source. The embodiment involves the use of a controlled burst of gas that is developed by rapidly heating a metallic hydride film with a laser to disassociate the hydrogen therefrom. The pressure created by the burst of a hydrogen gas is used to eject an amount of a liquid (e.g., a solder) from an appropriate conduit that is fed liquid from a reservoir. The surfaces in the print head that contact the liquid are coated to assist in priming the print head for a subsequent ejection event.

Abstract: A typical integrated circuit includes millions of microscopic transistors, resistors, and other components interconnected to define a circuit, for example a memory circuit. Occasionally, one or more of the components are defective and fabricators selectively replace them by activating spare, or redundant, components included within the circuit. One way of activating a redundant component is to rupture an antifuse that effectively connects the redundant component into the circuit. Unfortunately, conventional antifuses have high and/or unstable electrical resistances which compromise circuit performance and discourage their use. Accordingly, the inventors devised an exemplary antifuse structure that includes three normally disconnected conductive elements and a programming mechanism for selectively moving one of the elements to electrically connect the other two.

Abstract: A microelectronic device package and method for manufacture. In one embodiment, the device package can include a microelectronic substrate having first and second device features, a conductive link that includes a conductive material extending between the first and second device features, and an external cover or enclosure disposed around at least a portion of the substrate and the conductive link. The package can be filled with a liquid or a pressurized gas to transfer heat away from the conductive link. In one embodiment, the enclosure can have a composition substantially identical to the composition of the conductive links and the enclosure can be formed simultaneously with formation of the conductive link to reduce the number of process steps required to form the microelectronic device package. A sacrificial material can temporarily support the conductive link during manufacture and can subsequently be removed to suspend at least a portion of the conductive link between two points.

Abstract: A typical integrated circuit includes millions of microscopic transistors, resistors, and other components interconnected to define a circuit, for example a memory circuit. Occasionally, one or more of the components are defective and fabricators selectively replace them by activating spare, or redundant, components included within the circuit. One way of activating a redundant component is to rupture an antifuse that effectively connects the redundant component into the circuit. Unfortunately, conventional antifuses have high and/or unstable electrical resistances which compromise circuit performance and discourage their use. Accordingly, the inventors devised an exemplary antifuse structure that includes three normally disconnected conductive elements and a programning mechanism for selectively moving one of the elements to electrically connect the other two.

Abstract: Improved processes for generating a structure having beveled edges are presented. In a preferred embodiment, two photoresist layers are successively deposited on top of the target material, e.g., a metallization film. The intermediate photoresist layer is developed beyond the lithographically delineated boundaries of the top photoresist layer, forming deep recesses. These recesses remain unchanged during the subsequent etching step, resulting in pre-defined edge profiles in the target material.

Abstract: A thermal drop-on-demand ink jet print head in which conductor electrodes are formed on opposed surfaces of a print head substrate and extend to the edge of the substrate. An array of heater elements is formed on the edge of the substrate in electrical contact with the conductor electrodes. A nozzle plate is mounted with a nozzle aligned with each heater element, and a manifold is positioned to provide ink to the space between the nozzle plate and the edge of the substrate so that a drop of ink can be ejected from the nozzle each time the associated heater element is energized with a data pulse applied to a selected one of the conductor electrodes.

Abstract: An array of resistive heater elements, each of which is connected in an electrical circuit between a common electrode and one of the control electrodes. Each of the resistive heater elements comprises a plurality of portions arranged so that a small elongated opening in provided at the middle of the heater element where no resistive material is present. Each of the resistive heater elements, when energized, has a bubble formed at each of the plurality of portions. All of the bubbles coalesce to form a single pillow-shaped bubble which causes a drop of ink to be ejected from the associated nozzle. During collapse of the bubble, the bubble collapses inwardly so that cavitational shock impacts the heater element at the opening and little or no damage to the resistive heater is produced.

Abstract: A thermal drop-on-demand ink jet print head in which thermal cross-talk problems are eliminated by providing heat shield members in the space between each of the heater elements. The heat shield members comprise metal fingers attached to either the common heater electrode or one of the control electrodes. The heat shield members enhance flow of heat into the substrate to thereby minimize thermal cross-talk among adjacent channels.

Abstract: A thermal drop-on-demand ink jet print head in which a heat delay means is provided covering a predetermined part of the resistive element. Upon connection of an electrical signal to energize the resistive element, nucleation occurs at an uncovered location on the resistive element and formation of the bubble proceeds in a direction toward the covered part of the resistive element to thereby utilize the inertial effect of the controlled bubble motion to eject a drop of ink in a more energy-efficient manner.

Abstract: A thermal drop-on-demand ink jet print head in which an array of heating means is provided on one surface of a substrate member. A common electrode provides electrical contact to the heating means, and an array of data electrodes provides electrical contact to individual ones of the heating means. An array of feed through conductors is provided which pass through to the opposite surface of the substrate member to provide electrical contact between one of the data electrodes and one of an array of conductors leading to spaced solder pads on the opposite surface of the substrate member. A nozzle plate is mounted adjacent to the substrate member with a nozzle adjacent to each of the heating means so that, upon connection of an electrical signal to one of the solder pads, the corresponding heating means is energized and a drop of ink is ejected from the adjacent nozzle.

Abstract: A system for cooling integrated circuit chips and particularly those involving very large scale integrated circuits; the system provides for closely associating the heat-sink or heat exchange element with the integrated circuit chip by having the heat-sink, in the form of a "cooling chip", in intimate contact with the back surface of an integrated circuit chip (in a "flip chip" configuration, the front, or circuit-implemented, surface, makes contact with a ceramic carrier or module); the cooling chip is provided with a plurality of spaced parallel grooves which extend along the one side or surface opposite the surface that is in bearing contact with the integrated circuit chip, whereby liquid coolant flows through the grooves so as to remove heat from the integrated circuit chip; further included in the system is a specially configured bellows for conducting the liquid coolant from a source to the heat-sink, and for removing the liquid coolant; a coolant distribution means, in the form of at least one glass p

Abstract: A hermetically encapsulated magnetic record member is produced by applying a liquid mixture containing one or more organometallic compounds, an organic solvent system and magnetic particles to a thermally stable substrate, preferably of silicon. The applied mixture is then heated to melt the glass in the organometallic compound so that upon cooling of the glass, the magnetic particles are encapsulated therein.