Abstract: The disclosure relates to an initialization circuit for initializing memory cells of a memory array including a common bit line. Individual memory cells are coupled to the common bit line of the memory array via at least one pass element of the individual memory cells. The initialization circuit is operable for receiving a set of partition addresses specifying the partitions, i.e. the memory cells to be initialized. The initialization circuit is operable for successively initializing one cell of the partitions to be initialized and iteratively initializing the remaining memory cells of the partitions to be initialized. A number of memory cells initialized simultaneously in one iteration increases from one iteration to another iteration. Initializing a certain memory cell comprises activating the pass element of the cell so that the memory cell is connected to the bit line. Further aspects relate to methods for initializing memory cells and semiconductor circuits.

Abstract: An integrated circuit includes at least one first area including logic circuitry. The logic circuitry includes library blocks selected from a logic circuit library. A first one of the library blocks is provided with at least two symmetry mirror edges perpendicular to a height of the library blocks. Two adjacent ones of the library blocks are joined at a common symmetry mirror edge.

Abstract: The disclosure relates to an initialization circuit for initializing memory cells of a memory array. The individual memory cells are coupled to a common bit line of the memory array via at least one pass element of the individual memory cells. Each individual memory cell comprises a charge-based storage element including a capacitance. The initialization circuit activates the pass elements of a plurality of the memory cells to be initialized such that the capacitances of the plurality of memory cells are connected simultaneously to the common bit line. Further, aspects of the disclosure relate to a method for initializing memory cells and a semiconductor circuit.

Abstract: The disclosure relates to an initialization circuit for initializing memory cells of a memory array. The individual memory cells are coupled to a common bit line of the memory array via at least one pass element of the individual memory cells. Each individual memory cell comprises a charge-based storage element including a capacitance. The initialization circuit activates the pass elements of a plurality of the memory cells to be initialized such that the capacitances of the plurality of memory cells are connected simultaneously to the common bit line. Further, aspects of the disclosure relate to a method for initializing memory cells and a semiconductor circuit.

Abstract: The disclosure relates to an initialization circuit for initializing memory cells of a memory array including a common bit line. Individual memory cells are coupled to the common bit line of the memory array via at least one pass element of the individual memory cells. The initialization circuit is operable for receiving a set of partition addresses specifying the partitions, i.e. the memory cells to be initialized. The initialization circuit is operable for successively initializing one cell of the partitions to be initialized and iteratively initializing the remaining memory cells of the partitions to be initialized. A number of memory cells initialized simultaneously in one iteration increases from one iteration to another iteration. Initializing a certain memory cell comprises activating the pass element of the cell so that the memory cell is connected to the bit line. Further aspects relate to methods for initializing memory cells and semiconductor circuits.

Abstract: Various aspects of the present invention disclose a test device that includes a retaining element retaining one or more nuclear radiation sources for performing a nuclear radiation stress test of data storage structures of integrated circuits on a wafer in a wafer prober. The retaining element includes one or more apertures for applying nuclear radiation from the one or more nuclear radiation sources to the data storage structures. The retaining element is configured for controlling the nuclear radiation applied via the one or more apertures. The controlling includes a varying of relative positions of the one or more nuclear radiation sources and the one or more apertures. Additional aspects of the present invention disclose a testing method, computer program product, and computer system for performing the nuclear radiation stress test. In an example aspect, embodiments of the present invention disclose a test device for a wafer prober.

Abstract: An embodiment may include an integrated circuit. The integrated circuit may include a plurality of vertical transistor structures arranged in a two-dimensional grid pattern including a longitudinal set of grid-lines, a transversal set of grid-lines, and nodes at each intersection of the longitudinal set of grid-lines and the transversal set of grid-lines. Each vertical transistor structure is arranged substantially perpendicular to the plurality of layers of the integrated circuit and aligned with each node of the two-dimensional grid pattern.

Abstract: An embodiment may include a method of forming a microelectronic device. The method may include forming a pair of transistors stacked vertically and connected in series, each of the pair of transistors are of the same type. The method may include forming a memory element including a first inverter containing a first inverter transistor and an access transistor. The first inverter transistor is connected to a power supply rail. The access transistor is connected to a bitline. The first inverter transistor is a first transistor of the pair of vertically stacked transistors and the access transistor is a second transistor of the pair of vertically stacked transistors. The pair of transistors are arranged substantially perpendicular to the plurality of layers.

Abstract: An integrated circuit includes at least one first area including logic circuitry. The logic circuitry includes library blocks selected from a logic circuit library. A first one of the library blocks is provided with at least two symmetry mirror edges perpendicular to a height of the library blocks. Two adjacent ones of the library blocks are joined at a common symmetry mirror edge.

Abstract: Various aspects of the present invention disclose a test device that includes a retaining element retaining one or more nuclear radiation sources for performing a nuclear radiation stress test of data storage structures of integrated circuits on a wafer in a wafer prober. The retaining element includes one or more apertures for applying nuclear radiation from the one or more nuclear radiation sources to the data storage structures. The retaining element is configured for controlling the nuclear radiation applied via the one or more apertures. The controlling includes a varying of relative positions of the one or more nuclear radiation sources and the one or more apertures. Additional aspects of the present invention disclose a testing method, computer program product, and computer system for performing the nuclear radiation stress test. In an example aspect, embodiments of the present invention disclose a test device for a wafer prober.

Abstract: Embodiments of memory block erasure are described herein. An aspect includes determining an initial word line set consisting of a single word line. Another aspect includes activating the single word line such that a first memory cell that is connected to the single word line is erased by the activation. Another aspect includes determining a first word line set consisting of the single word line and one additional word line, and wherein the one additional word line corresponds to a second memory cell have a maximum distance from the first memory cell along a bit line that includes the first memory cell and the second memory cell. Another aspect includes activating the first word line set, such that a respective memory cell that is connected to each of the first word line set is erased by the activation.

Abstract: An embodiment may include a method of forming an integrated circuit. The method may include forming a first pair of transistors stacked vertically above a semiconductor substrate arranged substantially perpendicular to the plurality of layers. Each of the first pair of vertically stacked transistors are of the same type and are connected in series. The method may include forming a second pair of transistors connected in parallel and arranged substantially perpendicular to the plurality of layers. The second pair of transistors are a different type than the first pair of vertically stacked transistors. The method may include forming a power supply rail within the semiconductor substrate and arranged at one end of the first pair of vertically stacked transistors.

Abstract: An embodiment may include a microelectronic device. The microelectronic device may include a first pair of transistors stacked vertically and connected in series. Each of the first pair of transistors are of the same type. The microelectronic device may include a second pair of transistors connected in parallel. The second pair of transistors being a different type than the first pair of transistors. The first pair of transistors and the second pair of transistors are arranged substantially perpendicular to the plurality of layers.

Abstract: An embodiment may include a method of forming an integrated circuit. The method may include forming a first pair of transistors stacked vertically above a semiconductor substrate arranged substantially perpendicular to the plurality of layers. Each of the first pair of vertically stacked transistors are of the same type and are connected in series. The method may include forming a second pair of transistors connected in parallel and arranged substantially perpendicular to the plurality of layers. The second pair of transistors are a different type than the first pair of vertically stacked transistors. The method may include forming a power supply rail within the semiconductor substrate and arranged at one end of the first pair of vertically stacked transistors.

Abstract: An embodiment may include a method of forming a microelectronic device. The method may include forming a pair of transistors stacked vertically and connected in series, each of the pair of transistors are of the same type. The method may include forming a memory element including a first inverter containing a first inverter transistor and an access transistor. The first inverter transistor is connected to a power supply rail. The access transistor is connected to a bitline. The first inverter transistor is a first transistor of the pair of vertically stacked transistors and the access transistor is a second transistor of the pair of vertically stacked transistors. The pair of transistors are arranged substantially perpendicular to the plurality of layers.

Abstract: An embodiment may include an integrated circuit. The integrated circuit may include a plurality of vertical transistor structures arranged in a two-dimensional grid pattern including a longitudinal set of grid-lines, a transversal set of grid-lines, and nodes at each intersection of the longitudinal set of grid-lines and the transversal set of grid-lines. Each vertical transistor structure is arranged substantially perpendicular to the plurality of layers of the integrated circuit and aligned with each node of the two-dimensional grid pattern.

Abstract: An embodiment may include a microelectronic device. The microelectronic device may include a first pair of transistors stacked vertically and connected in series. Each of the first pair of transistors are of the same type. The microelectronic device may include a second pair of transistors connected in parallel. The second pair of transistors being a different type than the first pair of transistors. The first pair of transistors and the second pair of transistors are arranged substantially perpendicular to the plurality of layers.

Abstract: Embodiments of memory block erasure are described herein. An aspect includes determining an initial word line set consisting of a single word line. Another aspect includes activating the single word line such that a first memory cell that is connected to the single word line is erased by the activation. Another aspect includes determining a first word line set consisting of the single word line and one additional word line, and wherein the one additional word line corresponds to a second memory cell have a maximum distance from the first memory cell along a bit line that includes the first memory cell and the second memory cell. Another aspect includes activating the first word line set, such that a respective memory cell that is connected to each of the first word line set is erased by the activation.

Abstract: Generating design data for manufacturing a logic array of a semiconductor circuit from specification data describing the logic array. The specification is transformed into structured specification data including objects corresponding to circuit cells of a first type and logic specification data specifying the logic circuitry to be included in the logic array, and into structure data including placing and routing information concerning the circuit cells of the first type. A determination is made of circuit cells of a second type from the logic specification data. The circuit cells of the first type are pre-placed and routed based on the structure data. The circuit cells of second type are automatically placed and routed.

Abstract: Embodiments of memory block erasure are described herein. An aspect includes determining a first word line set consisting of a first plurality of word lines. Another aspect includes activating the first plurality of word lines, such that a respective memory cell that is connected to each of the first plurality of word lines is erased by the activation of the first plurality of word lines. Another aspect includes determining a second word line set, wherein the second word line set consists of the first word line set and a second plurality of word lines. Another aspect includes simultaneously activating the first plurality of word lines and the second plurality of word lines, such that a respective memory cell that is connected to each of the second plurality of word lines is erased by the activation of the first plurality of word lines and the second plurality of word lines.