Abstract: Disclosed is an Fe-based electroplated steel sheet including: a Si-containing cold-rolled steel sheet containing Si in an amount of 0.1 mass % or more and 3.0 mass % or less; and an Fe-based electroplating layer formed on at least one surface of the Si-containing cold-rolled steel sheet with a coating weight per surface of 5.0 g/m2 or more, in which in an intensity profile measured by glow discharge optical emission spectrometry, a peak of emission intensity at wavelengths indicating Si is detected within a range from a surface of the Fe-based electroplating layer to more than 0.2 ?m in a thickness direction and not more than a thickness of the Fe-based electroplating layer, and an average value of C concentration in a region ranging from 10 ?m to 20 ?m in the thickness direction from the surface of the Fe-based electroplating layer is 0.10 mass % or less.

Abstract: A micromixer includes: a first channel plate where a first channel and a plurality of first branch channels are each formed by a non-through groove in a front surface, and a first confluence channel is formed by a non-through groove in a rear surface, and includes a first communication channel that communicates the first branch channels with the first confluence channel; a first lid plate that covers the front surface; a second channel plate where a second confluence channel is formed by a non-through groove in the front surface, and a second channel and a plurality of second branch each formed by a non-through groove in the rear surface, and includes a second communication channel that communicates the second branch channels with the second confluence channel; and a second lid plate that covers the rear surface of the second channel plate.

Abstract: Provided is a heat storage unit having a simple configuration, capable of being attached to various objects, and capable of efficiently performing heat exchange. The heat storage unit has at least one inorganic fiber member configured by binding or entangling flexible inorganic fibers and having a desired shape; and a heat storage material in contact with the inorganic fibers.

Abstract: The invention of the present application provides a self-heating sheet-like material for moisture absorption and desorption which includes at least a self-heating layer and an adsorption layer in a laminate thereof, in which the self-heating layer and the adsorption layer are connected in a state in which heat conduction is enabled; a moisture absorption and desorption body formed of this material; and a moisture absorption and desorption device.

Abstract: The present invention provides a temperature control unit capable of efficiently controlling a temperature of a specific object with reduced risk of failure of electronic components due to leakage of a temperature control medium. The temperature control unit (1), which controls a temperature of a specific object, contains a temperature control medium, and a metal fiber sheet (50) that is formed with a space serving as a channel of the temperature control medium. The latent heat of evaporation of the temperature control medium is within the range of from 70 to 200 kJ/kg when the temperature control medium changes the state from a liquid state to a gaseous state. The volume expansion rate of the temperature control medium is at most 250 times when the temperature control medium changes the state from a liquid state to a gaseous state under atmospheric pressure.

Abstract: Provided is a seal material having high rigidity without deformation or breakage, excellent corrosion resistance to fluid, and low solubility when used under high sealing force, and to provide a flow cell, a detector, and an analyzer in which there is no fluid leakage, contamination of the seal material components is prevented, and the replacement frequency is low. Provided are a seal material for an analyzer, including a resin and at least one layer of fiber sheet embedded in the resin, wherein the at least one layer of fiber sheet is embedded between and in substantially parallel to two seal surfaces: a first seal surface, which is one resin surface of the seal material; and a second seal surface, which is the other resin surface substantially parallel to the former one, and a flow cell, a detector, and an analyzer using the seal material.

Abstract: The present invention provides a cushion member and a stage member provided with the cushion member, the cushion member including a non-woven fabric formed by binding or entangling metal fibers, wherein when the cushion member is compressed, the cushion member undergoes compressive deformation and the following compressive deformation ratio is 5% to 80%: Compressive deformation ratio=(T0?T1)/T0×100, T0: film thickness of cushion member before application of load, and T1: film thickness of cushion member after application and release of load.

Abstract: An object of the present invention to provide a resistor element which can be mounted at a higher density and can cope with a wide range of resistance values, the present invention provides a resistor element including a resistor which mainly contains metal fibers, electrodes which are formed at an end portion of the resistor, and an insulating layer which is in contact with the resistor and the electrodes.

Abstract: The present invention provides a cushion member and a stage member provided with the cushion member, the cushion member including a non-woven fabric formed by binding or entangling metal fibers, wherein when the cushion member is compressed, the cushion member undergoes compressive deformation and the following compressive deformation ratio is 5% to 80%: Compressive deformation ratio=(T0?T1)/T0×100, T0: film thickness of cushion member before application of load, and T1: film thickness of cushion member after application and release of load.

Abstract: An object of the present invention to provide a resistor element which can be mounted at a higher density and can cope with a wide range of resistance values, the present invention provides a resistor element including a resistor which mainly contains metal fibers, electrodes which are formed at an end portion of the resistor, and an insulating layer which is in contact with the resistor and the electrodes.

Abstract: The invention of the present application provides a self-heating sheet-like material for moisture absorption and desorption which includes at least a self-heating layer and an adsorption layer in a laminate thereof, in which the self-heating layer and the adsorption layer are connected in a state in which heat conduction is enabled; a moisture absorption and desorption body formed of this material; and a moisture absorption and desorption device.

Abstract: Provided is a copper fiber nonwoven fabric having a bonding portion between copper fibers, and in the relationship between compressive stress and strain, is provided with a first region exhibiting plastic deformation and a second region exhibiting elastic deformation in which compressive stress is higher than the first region. Alternatively, the copper fiber nonwoven fabric has a bonding portion between copper fibers, and in the relationship between compressive stress and strain, has a region exhibiting elastic deformation, wherein the region exhibiting elastic deformation has an elastic deformation region before an inflection portion a, the inflection portion a, and an elastic deformation region after the inflection portion a.

Abstract: Disclosed is a substrate treating apparatus including the following units: a supplying unit which supplies a process liquid including a sublimable substance in a melt state on a pattern-formed surface of a substrate W; a solidifying unit which solidifies the process liquid on the pattern-formed surface to produce a solidified body; and a sublimating unit which sublimates the solidified body to remove the solidified body from the pattern-formed surface. In this apparatus, the sublimable substance includes a fluorinated carbon compound.

Abstract: A semiconductor device having a voltage resistant structure in a first aspect of the present invention is provided, comprising a semiconductor substrate, a semiconductor layer on the semiconductor substrate, a front surface electrode above the semiconductor layer, a rear surface electrode below the semiconductor substrate, an extension section provided to a side surface of the semiconductor substrate, and a resistance section electrically connected to the front surface electrode and the rear surface electrode. The extension section may have a lower permittivity than the semiconductor substrate. The resistance section may be provided to at least one of the upper surface and the side surface of the extension section.

Abstract: According to one embodiment, a reticle chuck cleaner for cleaning a reticle chuck of an EUV exposure apparatus includes a substrate having a shape to be carried to the reticle chuck of the EUV exposure apparatus, and an adhesive formed on one of the main surfaces of the substrate.

Abstract: A semiconductor device having a voltage resistant structure in a first aspect of the present invention is provided, comprising a semiconductor substrate, a semiconductor layer on the semiconductor substrate, a front surface electrode above the semiconductor layer, a rear surface electrode below the semiconductor substrate, an extension section provided to a side surface of the semiconductor substrate, and a resistance section electrically connected to the front surface electrode and the rear surface electrode. The extension section may have a lower permittivity than the semiconductor substrate. The resistance section may be provided to at least one of the upper surface and the side surface of the extension section.

Abstract: A semiconductor device having a voltage resistant structure in a first aspect of the present invention is provided, comprising a semiconductor substrate, a semiconductor layer on the semiconductor substrate, a front surface electrode above the semiconductor layer, a rear surface electrode below the semiconductor substrate, an extension section provided to a side surface of the semiconductor substrate, and a resistance section electrically connected to the front surface electrode and the rear surface electrode. The extension section may have a lower permittivity than the semiconductor substrate. The resistance section may be provided to at least one of the upper surface and the side surface of the extension section.

Abstract: A semiconductor device having a voltage resistant structure in a first aspect of the present invention is provided, comprising a semiconductor substrate, a semiconductor layer on the semiconductor substrate, a front surface electrode above the semiconductor layer, a rear surface electrode below the semiconductor substrate, an extension section provided to a side surface of the semiconductor substrate, and a resistance section electrically connected to the front surface electrode and the rear surface electrode. The extension section may have a lower permittivity than the semiconductor substrate. The resistance section may be provided to at least one of the upper surface and the side surface of the extension section.

Abstract: According to one embodiment, a reticle chuck cleaner for cleaning a reticle chuck of an EUV exposure apparatus includes a substrate having a shape to be carried to the reticle chuck of the EUV exposure apparatus, and an adhesive formed on one of the main surfaces of the substrate.

Abstract: A semiconductor device that improves the heat cycle resistance and power cycle resistance of a power module. An electrode member in which copper posts are formed in a plurality of perforations cut in a support made of a ceramic material is soldered onto a side of an IGBT where an emitter electrode is formed. By soldering the copper posts onto the electrode, heat generated in the IGBT is transferred to the electrode member and is radiated. In addition, even if a material of which the IGBT is made and copper differ in thermal expansivity, stress on a soldered interface is reduced and distortion is reduced. This suppresses the appearance of a crack. As a result, the heat cycle resistance and power cycle resistance of a power module can be improved.