Abstract: Ball grid assembly (BGA) bumping solder is formed on the back side of a laminate panel within a patterned temporary resist. Processes such as singulation and flip chip module assembly are conducted following BGA bumping with the temporary resist in place. The resist is removed from the back side of the singulated laminate panel prior to card assembly. Stand-off elements having relatively high melting points can be incorporated on the BGA side of the laminate panel to ensure a minimum assembly solder collapse height. Alignment assemblies are formed on the socket-facing side of an LGA module using elements having relatively high melting points and injected solder.

Abstract: Stacked strain gauge sensors with increased electrical resistance are provided. In one aspect, a method of forming a stacked strain gauge sensor includes: forming multiple sensor layers, wherein the sensor layers include strain gauge sensor wires on substrates; forming holes in the substrates; stacking the sensor layers, one on top of another, to form a stack with the holes aligned in one or more locations forming through holes in the stack; and forming interconnects in the holes in one or more other locations interconnecting the strain gauges sensor wires between adjacent sensor layers to form a stacked strain gauge sensor. A stacked strain gauge sensor and method of use thereof are also provided.

Abstract: Writing recognition using a wearable pressure sensing device includes receiving pressure measurement data from a pressure sensor disposed upon a body part of a user. The pressure measurement data is indicative of a change in pressure of the body part due to an interaction of the body part with a medium indicative of a writing gesture by the user. A start boundary and end boundary for each of a plurality of writing symbols is detected based upon the pressure measurement data. At least one feature of the pressure measurement data associated with the plurality of writing symbols is extracted. A symbol pattern is detected based upon the extracted features, and at least one letter is detected based upon the symbol pattern. A word is detected based upon the detected at least one letter.

Abstract: Embodiments of the present invention are directed to a method of stimulating a cornea. A non-limiting example of the method includes capturing a sound with a microphone. A non-limiting example of the method also includes transducing the sound to an electric signal by a microprocessor. A non-limiting example of the method also includes stimulating a piezo-electric element adjacent to a receptor of the cornea, wherein the piezo-electric element is positioned on an eye lens with an electric signal. A non-limiting example of the method also includes mechanically stimulating a receptor of the cornea with the stimulated piezo-electric element.

Abstract: Embodiments of the present invention are directed to a method of stimulating a cornea. A non-limiting example of the method includes capturing a sound with a microphone. A non-limiting example of the method also includes transducing the sound to an electric signal by a microprocessor. A non-limiting example of the method also includes stimulating a piezo-electric element adjacent to a receptor of the cornea, wherein the piezo-electric element is positioned on an eye lens with an electric signal. A non-limiting example of the method also includes mechanically stimulating a receptor of the cornea with the stimulated piezo-electric element.

Abstract: Embodiments of the present invention are directed to a method of stimulating a cornea. A non-limiting example of the method includes capturing a sound with a microphone. A non-limiting example of the method also includes transducing the sound to an electric signal by a microprocessor. A non-limiting example of the method also includes stimulating a piezo-electric element adjacent to a receptor of the cornea, wherein the piezo-electric element is positioned on an eye lens with an electric signal. A non-limiting example of the method also includes mechanically stimulating a receptor of the cornea with the stimulated piezo-electric element.

Abstract: Embodiments of the present invention are directed to a systems and methods for registration of pulse wave signal and determining arterial pressure. A non-limiting example of the system includes a strain gauge sensor. A non-limiting example of the method includes receiving, to a processor, a first pressure pulse signal from a first strain gauge sensor. The method also includes receiving, to the processor, a second pressure pulse signal from a second strain gauge sensor. The method also includes determining a pulse transit time between the first strain gauge sensor and the second strain gauge sensor based at least in part upon the first pressure pulse signal and the second pressure pulse signal. The method also includes determining an arterial pressure based at least in part upon the pulse transit time.

Abstract: Aspects include a method of manufacturing a flexible electronic structure that includes a metal or doped silicon substrate. Aspects include depositing an insulating layer on a silicon substrate. Aspects also include patterning a metal on a silicon substrate. Aspects also include selectively masking the structure to expose the metal and a portion of the silicon substrate. Aspects also include depositing a conductive layer including a conductive metal on the structure. Aspects also include plating the conductive material on the structure. Aspects also include spalling the structure.

Abstract: Ball grid assembly (BGA) bumping solder is formed on the back side of a laminate panel within a patterned temporary resist. Processes such as singulation and flip chip module assembly are conducted following BGA bumping with the temporary resist in place. The resist is removed from the back side of the singulated laminate panel prior to card assembly. Stand-off elements having relatively high melting points can be incorporated on the BGA side of the laminate panel to ensure a minimum assembly solder collapse height. Alignment assemblies are formed on the socket-facing side of an LGA module using elements having relatively high melting points and injected solder.

Abstract: Aspects include a method of manufacturing a flexible electronic structure that includes a metal or doped silicon substrate. Aspects include depositing an insulating layer on a silicon substrate. Aspects also include patterning a metal on a silicon substrate. Aspects also include selectively masking the structure to expose the metal and a portion of the silicon substrate. Aspects also include depositing a conductive layer including a conductive metal on the structure. Aspects also include plating the conductive material on the structure. Aspects also include spalling the structure.

Abstract: According to an embodiment of the present invention, a structure for a strain gauge device is provided. The structure comprises a layer of strain gauge material and one or more contact pads positioned directly on the layer of strain gauge material. The structure further comprises a multiplexer, measuring device, amplifier, analog to digital converter, microcontroller, and wireless adapter. According to the structure, the multiplexer selects a given contact pad pair of the one or more contact pad pairs, the measuring device measures signal generated by the layer of strain gauge material between the given contact pad pair, the amplifier amplifies the measured signal, the analog to digital converter converts the amplified analog signal to a digital signal, the microcontroller processes the digital signal, and the wireless adapter transmits the processed digital signal. In addition, the structure may further comprise a battery to provide energy to the structure.

Abstract: Aspects include a method of manufacturing a flexible electronic structure that includes a metal or doped silicon substrate. Aspects include depositing an adhesive layer on the top side of the structure. Aspects also include depositing a release layer and a glass layer on the top side of the structure. Aspects also include reducing a thickness of the silicon substrate on the bottom side of the structure.

Abstract: Apparatus, systems, and methods of manufacture of sensors facilitating monitoring of living entities. In one example, a system comprises a flexible substrate comprising an adhesive adapted to cause the flexible substrate to adhere to a defined surface. A silicon substrate or film can be disposed on the flexible substrate, wherein the silicon substrate or film is formed to include one or more nanogratings adapted to receive and reflect light based on strain on the defined surface.

Abstract: An on-chip strain gage for monitoring strain on an integrated circuit (IC) chip, the IC chip and method of monitoring and mitigating stress induced chip warpage. The strain gage sensor includes a strain sensor element in a single layer. The strain gage sensor quantifies and digitizes local strain which reflects local chip stress from chip warpage. During normal chip usage, the strain information may be used to alter chip operation.

Abstract: A method of forming a 3D package. The method may include joining an interposer to a laminate chip carrier with the solid state diffusion of a first plurality of solder bumps by applying a first selective non-uniform heat and first uniform pressure; joining a top chip to the interposer with the solid state diffusion of a second plurality of solder bumps by applying a second selective non-uniform heat and second uniform pressure; heating the 3D package, the first and second pluralities of solder bumps to a temperature greater than the reflow temperature of the first and second pluralities of solder bumps, where the second plurality of solder bumps achieves the reflow temperature before the first plurality of solder bumps, where the first and second selective non-uniform heats being less that the reflow temperature of the first and second pluralities of solder bumps, respectively.

Abstract: Arrays of objects on a substrate having void-free underfill as well as methods and systems of forming the same include forming a void-free layer of underfill material between a substrate and an array of multiple objects positioned on the substrate. The void-free layer of underfill material is cured to form a protective cured underfill layer that provides structural support to connections between the objects and the substrate.

Abstract: Ball grid assembly (BGA) bumping solder is formed on the back side of a laminate panel within a patterned temporary resist. Processes such as singulation and flip chip module assembly are conducted following BGA bumping with the temporary resist in place. The resist is removed from the back side of the singulated laminate panel prior to card assembly. Stand-off elements having relatively high melting points can be incorporated on the BGA side of the laminate panel to ensure a minimum assembly solder collapse height. Alignment assemblies are formed on the socket-facing side of an LGA module using elements having relatively high melting points and injected solder.

Abstract: Embodiments of the present invention are directed to a method of stimulating a cornea. A non-limiting example of the method includes capturing a sound with a microphone. A non-limiting example of the method also includes transducing the sound to an electric signal by a microprocessor. A non-limiting example of the method also includes stimulating a piezo-electric element adjacent to a receptor of the cornea, wherein the piezo-electric element is positioned on an eye lens with an electric signal. A non-limiting example of the method also includes mechanically stimulating a receptor of the cornea with the stimulated piezo-electric element.

Abstract: Embodiments of the present invention are directed to a method of stimulating a cornea. A non-limiting example of the method includes capturing a sound with a microphone. A non-limiting example of the method also includes transducing the sound to an electric signal by a microprocessor. A non-limiting example of the method also includes stimulating a piezo-electric element adjacent to a receptor of the cornea, wherein the piezo-electric element is positioned on an eye lens with an electric signal. A non-limiting example of the method also includes mechanically stimulating a receptor of the cornea with the stimulated piezo-electric element.

Abstract: Aspects include a method of manufacturing a flexible electronic structure that includes a metal or doped silicon substrate. Aspects include depositing an adhesive layer on the top side of the structure. Aspects also include depositing a release layer and a glass layer on the top side of the structure. Aspects also include reducing a thickness of the silicon substrate on the bottom side of the structure.