Abstract: A solution having a predetermined concentration is stably supplied to a use point, at which the amount of use of the solution changes, by only modifying currently-used equipment at a low cost and in a space-saving manner. In order to supply a solution containing a solute at a predetermined concentration from a preparation portion of the solution to a use point through a supply pipe, a retention portion that has no gas-liquid interface and at which the solution is retained is provided at an intermediate portion of the supply pipe. Even when the amount of use of the solution at the use point changes, the change is absorbed by the retention portion, whereby a solution having a predetermined concentration can be stably supplied to the use point.

Abstract: Adherence between a sealing material and a glass substrate is assured, thereby improving airtightness of a hermetic container. A manufacturing method of the hermetic container has: an assembling step of sealing a first glass substrate and a second glass substrate through a circumferential sealing material having plural straight line portions and plural coupling portions which connect the plural straight line portions so as to define an internal space between the first glass substrate and the second glass substrate; and a sealing step of maintaining the internal space to a negative pressure to an outside after the assembling step, applying such local force as to compress the coupling portions of the circumferential sealing material in a thickness direction of the sealing material, and heating and melting the sealing material by irradiating local heating light to the sealing material, to seal the first glass substrate and the second glass substrate.

Abstract: A solution having a predetermined concentration is stably supplied to a use point, at which the amount of use of the solution changes, by only modifying currently-used equipment at a low cost and in a space-saving manner. In order to supply a solution containing a solute at a predetermined concentration from a preparation portion of the solution to a use point through a supply pipe, a retention portion that has no gas-liquid interface and at which the solution is retained is provided at an intermediate portion of the supply pipe. Even when the amount of use of the solution at the use point changes, the change is absorbed by the retention portion, whereby a solution having a predetermined concentration can be stably supplied to the use point. Such a retention portion is advantageous in terms of space saving since the retention portion can be formed by using, for example, a long pipe portion or a large-diameter portion of a pipe having no gas-liquid interface.

Abstract: A method for manufacturing an electronic substrate structure comprising a substrate, a glass layer, and a conductive layer. This method may include the steps of arranging the glass layer on the substrate, arranging the conductive layer that includes a precious metal particle on the glass layer while directly contacting the glass layer, and heating the glass layer together with the conductive layer at a temperature that is lower than a softening point of the glass layer so that the particle is put into the glass layer. The particle has a diameter of not less than 1 ?m and not more than 10 ?m.

Abstract: A wiring board has a substrate having a groove on its surface, a first wiring placed in the groove, a plurality of bonding members located at mutually separated positions and each of which bonds the first wiring and the substrate. A gap is located between the first wiring and the surface of the groove.

Abstract: A manufacturing method of a highly-reliable hermetic container having both joining strength and airtightness is provided. Sealants of which a viscosity has a negative temperature coefficient and of which softening point is lower than that of each of first and second glass substrates are formed in a frame shape having a discontinuous portion on the first glass substrate, and the second glass substrate is disposed to face the first glass substrate so as to press the sealants formed thereon by contacting them. Local heating light is irradiated to form the discontinuous portion at a boundary between a region irradiated by the local heating light and a region not irradiated by the local heating light, and a portion adjacent to the discontinuous portion is heated and melted to close the discontinuous portion, whereby a continuous sealed portion between the first and second glass substrates is formed.

Abstract: Adherence between a sealing material and a glass substrate is assured, thereby improving airtightness of a hermetic container. A manufacturing method of the hermetic container has: an assembling step of sealing a first glass substrate and a second glass substrate through a circumferential sealing material having plural straight line portions and plural coupling portions which connect the plural straight line portions so as to define an internal space between the first glass substrate and the second glass substrate; and a sealing step of maintaining the internal space to a negative pressure to an outside after the assembling step, applying such local force as to compress the coupling portions of the circumferential sealing material in a thickness direction of the sealing material, and heating and melting the sealing material by irradiating local heating light to the sealing material, to seal the first glass substrate and the second glass substrate.

Abstract: An airtight container includes a first substrate and a second substrate facing the first substrate and joined thereto using joint members. The first substrate has a groove extending on a surface of the first substrate and a wiring provided along a direction of the extended groove. The wiring includes a section inside and along the groove and a section outside the groove and extending from the section inside the groove, and the first substrate includes joint members provided on and across the section of the wiring outside the groove. In addition, a frame is joined on the second substrate by second joint members and is interposed between the first substrate and the second substrate. The frame is joined to the first substrate by the first joint members.

Abstract: A method of manufacturing a wiring board comprising preparing a substrate having a groove and an adjacent area; the substrate being of a wiring board also comprising a first wiring having first and second portions provided in first and second areas, respectively, making a contact angle of the second area different from a contact angle of a third area which is another part of the adjacent area, surrounding the second area together with the groove; and applying conductive paste to at least the first and second areas.

Abstract: As a substrate having a fine line and capable of suppressing crack generation in the substrate and peeling of the fine line, the invention discloses a configuration in which plural recesses are arranged on the fine line, and particularly a configuration in which the interval of the plural recesses does not exceed 200 ?m. There is also disclosed a configuration in which the plural recesses are arranged along a direction crossing the longitudinal direction of the fine line.

Abstract: To provide an electron source including: a wiring board having: a substrate provided with a groove on its surface; a first conductive member which is arranged along the groove in the groove; and a second conductive member which is arranged above the first conductive member crossing the first conductive member; and an electron-emitting device which is arranged on the wiring board and is electrically connected to the first conductive member and the second conductive member; wherein a particle is arranged between the first conductive member and an inner wall of the groove.

Abstract: To realize airtight joining on wirings, even in a case of arranging the wirings within grooves formed on a substrate surface, the wirings include a section arranged inside the grooves and a section arranged outside the grooves so as to extend over both sections. The first substrate and the second substrate are jointed through a joint member provided on the wirings outside the grooves so as to intersect with the wirings outside the grooves.

Abstract: To provide an electron source including: a wiring board having: a substrate having a groove on its surface; a conductive wire containing a metal which is arranged along the groove in the groove; and a wiring which is arranged above the wire crossing the wire; and an electron-emitting device which is arranged on the wiring board and is electrically connected to the conductive wire and the wiring; wherein the wire has an oxide layer of the metal contained in the wire on its surface.

Abstract: A wiring board has a substrate having a groove on its surface, a first wiring placed in the groove, a plurality of bonding members located at mutually separated positions and each of which bonds the first wiring and the substrate. A gap is located between the first wiring and the surface of the groove.

Abstract: To provide a method for simply manufacturing a substrate provided with a flat surface shape. Specifically, a method for manufacturing a substrate according to the present invention includes the steps of preparing a structure including a glass layer and a precious metal particle having a diameter not less than 1 ?m and not more than 10 ?m disposed on the glass layer while contacting thereto; and putting the precious metal particle in the glass layer by heating the structure at a temperature which is lower than a softening point of the glass layer.

Abstract: In a method of manufacturing an electron-emitting device, an electroconductive film formed on a substrate is subjected to a clean processing to remove a foreign matter from the electroconductive film, and thereafter, energization is conducted on the electroconductive film, to form an electron-emitting region. Accordingly, there is provided an electron-emitting device which avoids a formation defect of the electron-emitting region due to the existence of the foreign matter and which has satisfactory characteristics without fluctuation.

Abstract: A method for forming patterned insulating elements on a substrate includes a plurality of exposure steps of exposing a photosensitive paste provided on the substrate through at least one mask having a predetermined pattern; a developing step of developing the exposed photosensitive paste to form a precursor pattern; and a firing step of firing the precursor pattern to form the patterned insulating elements. This method is applied to a method for forming an electron source and a method for forming an image display device including the electron source.

Abstract: A method for forming patterned insulating elements on a substrate includes a plurality of exposure steps of exposing a photosensitive paste provided on the substrate through at least one mask having a predetermined pattern; a developing step of developing the exposed photosensitive paste to form a precursor pattern; and a firing step of firing the precursor pattern to form the patterned insulating elements. This method is applied to a method for forming an electron source and a method for forming an image display device including the electron source.

Abstract: A method of manufacturing a wiring board comprising (A) a substrate having a groove and an adjacent area adjacent to the groove and (B) a first wiring having a first portion and a second portion extending from the first portion, the first portion being provided in a first area in the groove and the second portion being provided in a second area which is part of the adjacent area, the method comprising steps of: preparing a substrate having a groove; making a contact angle of the second area different from a contact angle of a third area which is another part of the adjacent area, surrounding the second area together with the groove; and applying conductive paste to at least an interior of the groove and part of the adjacent area.

Abstract: To provide an electron source including: a wiring board having: a substrate provided with a groove on its surface; a first conductive member which is arranged along the groove in the groove; and a second conductive member which is arranged above the first conductive member crossing the first conductive member; and an electron-emitting device which is arranged on the wiring board and is electrically connected to the first conductive member and the second conductive member; wherein a particle is arranged between the first conductive member and an inner wall of the groove.