Abstract: A slew-rate adjusting apparatus for use in a semiconductor memory device includes: a slew-rate modulation signal generator for generating a slew-rate modulation signal according to the number of control codes having a first logic level among a plurality of control codes, which are programmable at an exterior; and a pre-driver for adjusting a slew rate of a data signal by changing the number of switching elements turned on in response to the slew-rate modulation signal.

Abstract: Semiconductor device and data outputting method of the same includes an on die thermal sensor (ODTS) configured to output temperature information by detecting an internal temperature of the semiconductor device and an output driver configured to control a slew rate depending on the temperature information and output data.

Abstract: A semiconductor memory device includes a clock synchronizing unit for receiving a first power voltage through a first power voltage terminal, and an additional power voltage providing unit for additionally providing a second power voltage to the first power voltage terminal for a predetermined period after leaving a power down mode.

Abstract: A voltage level of a boosted voltage is prevented from being targeted at voltage level that is too low, thereby improving a write recovery time (tWR) characteristic in a memory in a semiconductor memory device. The boosted voltage level detector includes: a voltage divider for dividing a boosted voltage and outputting a divided voltage; and a comparison unit for comparing a reference voltage corresponding to a voltage level of a target voltage with the divided voltage and outputting a level detecting signal, wherein the voltage divider includes: a first voltage drop element connected between a boosted voltage terminal and an output terminal of the voltage divider, having a negative temperature coefficient; and a second voltage drop element connected between the output terminal of the voltage divider and a ground voltage terminal, having a positive temperature coefficient.

Abstract: Provided is a test mode control circuit capable of preventing an MRS (mode register set) from changing in a test mode exit after a test mode entry. In the test mode control circuit, an MRS controller logically combines an MRS signal, a bank address, an MRS address, and a test mode control signal to output a latch control signal. A test mode control unit detects a test mode entry and a test mode exit to selectively activate one of a test mode set signal and a test mode exit signal, and outputs the test mode control signal having different voltage levels according to an activation state of the test mode set signal or the test mode exit signal. An address latch latches an input address when the MRS signal is activated, and outputs the latched input address as the MRS address when the latch control signal is activated.

Abstract: A bitline precharge voltage generator can generate multiple bitline precharge voltages when bitlines are precharged, thereby providing a stable operation regardless of a core voltage used as a high data voltage of a memory cell. In the bitline precharge voltage generator, a core voltage level detecting unit detects a core voltage level, activates a first enable signal when the core voltage level is lower than a specific voltage level, and activates a second enable signal when the core voltage level is higher than the specific voltage level. A bitline precharge voltage generating unit generates a bitline precharge voltage corresponding to half of the core voltage level when the first enable signal is activated. A bitline precharge voltage clamping unit generates a clamped bitline precharge voltage having a constant voltage level when the second enable signal is activated, regardless of the core voltage level.

Abstract: An output driving device includes a pull-up driver for pull-up driving an output node in response to a pull-up control signal; a pull-down driver for pull-down driving the output node in response to a pull-down control signal; and a first n-type metal oxide semiconductor (NMOS) transistor for pull-up driving the output node in response to a pre-pull-up control signal.

Abstract: Provided is a test mode control circuit capable of preventing an MRS (mode register set) from changing in a test mode exit after a test mode entry. In the test mode control circuit, an MRS controller logically combines an MRS signal, a bank address, an MRS address, and a test mode control signal to output a latch control signal. A test mode control unit detects a test mode entry and a test mode exit to selectively activate one of a test mode set signal and a test mode exit signal, and outputs the test mode control signal having different voltage levels according to an activation state of the test mode set signal or the test mode exit signal. An address latch latches an input address when the MRS signal is activated, and outputs the latched input address as the MRS address when the latch control signal is activated.

Abstract: A ZQ calibration circuit performs a ZQ calibration additionally in an initial operation of a semiconductor memory device. The ZQ calibration controller of the ZQ calibration circuit includes a first signal generator, a second signal generator, and a control unit. The first signal generator generates a pre-calibration signal during an initialization of the semiconductor memory device. The second signal generator generates ZQ calibration signals in response to a ZQ calibration command. The control unit outputs signals to control a ZQ calibration in response to the pre-calibration signal and the ZQ calibration signals.

Abstract: A semiconductor memory device performs a reset operation at a wafer state by using a signal input through an address pin in a test mode. The semiconductor memory device includes a buffer for transferring a reset command in response to a reset-active signal and a test reset signal, a test-reset entry signal generation unit for generating an internal test-reset entry signal in response to the test reset signal, and a rest signal driving unit for driving an active signal of an output signal of the buffer and the internal test-reset entry signal as an internal reset signal for a reset mode entry.

Abstract: A test circuit in a memory device includes a first compression unit configured to compress data of a plurality of cells to transmit first compressed data to a plurality of input/output lines, and a second compression unit configured to compress the first compressed data on the plurality of input/output line to output second compressed data to at least one output pin, wherein the second compression unit operates in a low compressing mode and a high compressing mode in response to a data compression selecting signal.

Abstract: There is provided a circuit and a method for generating a power up signal. The circuit for generating a power up signal, includes an external power voltage divider for dividing a magnitude of an external power voltage so as to output the divided voltage, an external power voltage detector for activating a detection signal when the output voltage of the external power voltage divider reaches a preset level, and a power up signal generator for outputting a power up signal according to the detection signal and a first internal power voltage. Herein, the power up signal is generated when the internal power voltage as well as the external power voltage reaches a sufficient level so that a power up signal skew may be reduced to stabilize its operation and enhance reliability of a device.

Abstract: A semiconductor memory device performs a refresh operation stably even while a temperature continuously changes at near a specific temperature. The semiconductor memory device includes an on die thermal sensor (ODTS) and a control signal generator. The on die thermal sensor (ODTS) outputs a thermal code corresponding to a temperature of the semiconductor memory device. The control signal generator generates a self refresh control signal in response to the thermal code, wherein a state of the self refresh control signal does not change when the temperature variation is less than a predetermined value.

Abstract: A slew-rate adjusting apparatus for use in a semiconductor memory device includes: a slew-rate modulation signal generator for generating a slew-rate modulation signal according to the number of control codes having a first logic level among a plurality of control codes, which are programmable at an exterior; and a pre-driver for adjusting a slew rate of a data signal by changing the number of switching elements turned on in response to the slew-rate modulation signal.

Abstract: A internal voltage generator in a semiconductor memory device has a first and second internal voltage generators. The first internal voltage generator outputs a first signal having a first voltage level to internal circuits of the memory device during an active mode of the memory device operation. The second internal voltage generator outputs a second signal having a second voltage level to the internal circuits of the memory device; however, the second signal is interrupted in absence of a predetermined level of a power control signal during the active mode of the memory device operation. The internal voltage control unit monitors the operational signals generated by the memory device and outputs the predetermined level of the power control signal during a plurality of active sections of the active mode of the memory device operation requiring power.

Abstract: A semiconductor memory device includes: a temperature information output unit for measuring an internal temperature of the semiconductor memory device, and generating a plurality of flag signals, each voltage level of which varies according to the measured internal temperature; a self-refresh oscillation unit for providing a self-refresh period corresponding to the measured internal temperature in response to the plurality of flag signals; and a temperature information control unit for determining a measuring period of the temperature information output unit in response to a temperature sensing enable signal and the plurality of flag signals.

Abstract: An impedance matching circuit performs a ZQ calibration for a test on a wafer process of a semiconductor memory device. The impedance matching circuit of the semiconductor memory device includes a first pull-down resistance unit, a first pull-up resistance unit, a second pull-up resistance unit and a second pull-down resistance unit. The first pull-down resistance unit supplies a ground voltage to a first node in response to a calibration test signal. The first pull-up resistance unit calibrates its resistance to that of the first pull-down resistance unit to thereby generate a pull-up calibration code. The second pull-up resistance unit supplies a supply voltage to a second node in response to the pull-up calibration code. The second pull-down resistance unit calibrates its resistance to that of the second pull-up resistance unit to thereby generate a pull-down calibration code.

Abstract: A voltage generator reduces a stand by current in a stand by or a self-refresh mode and shortens a response time in an active mode by selectively driving a control transistor of a final driver. A core voltage control unit provides a power voltage. Pull-up and pull-down driving signals are generated based on the power voltage. An output driver generates an internal voltage according to the pull-up and pull-down driving signals. An active control unit controls drivability of the core voltage control unit in response to bank active signals.

Abstract: An on die thermal sensor (ODTS) for use in a semiconductor memory device includes: a temperature information code generation unit for sensing an internal temperature of the semiconductor memory device in response to first and second enable signals and for generating a temperature information code which includes the sensed temperature information; and a flag signal logic determination unit for generating a plurality of first flag signals having temperature information and determining whether the plurality of first flag signals have a predetermined logic level or a variable logic level in response to the first and second enable signals.

Abstract: An on die thermal sensor (ODTS) for use in a semiconductor device includes a temperature information output unit for measuring an internal temperature of the semiconductor device to generate a temperature information code having temperature information, and updating the temperature information code according to a refresh period.