Abstract: A method of manufacturing a liquid discharge head substrate is provided. The method includes forming a first substrate that includes a semiconductor element and a first wiring structure; forming a second substrate that includes a liquid discharge element and a second wiring structure; and bonding the first wiring structure and the second wiring structure such that the semiconductor element and the liquid discharge element are electrically connected to each other after the forming the first substrate and the second substrate.

Abstract: A measuring apparatus includes a base portion attachable to an attachment target object and a cover portion configured to be detachably S attached to the base portion to accommodate a rod-shaped replaceable object inside the cover portion, and the cover portion includes a holding portion configured to hold the replaceable object with the cover portion attached to the base portion.

Abstract: Radio equipment includes a substrate on which a first antenna for near field communication is provided, a base portion on which the substrate is erected, and a cover portion configured to be attached to the base portion so as to cover the substrate. The cover portion includes an opposing portion configured to oppose the first antenna and a non-opposing portion disposed closer to the base portion than the opposing portion in a direction in which the substrate is erected. A distance from an outer surface of the cover portion to the substrate at the opposing portion is shorter than a distance from the outer surface of the cover portion to the substrate at the non-opposing portion.

Abstract: An imaging apparatus includes a substrate including a photoelectric conversion portion; and a silicon nitride layer arranged to cover at least a portion of the photoelectric conversion portion. The silicon nitride layer contains chlorine. An N/Si composition ratio in the silicon nitride layer is not less than 1.00 and is less than 1.33.

Abstract: The present invention provides a polyethylene-based resin composition for a foamable laminate which contains a polyethylene-based resin (A) satisfying the following properties (a-1) to (a-3): (a-1) MFR is 6 g/10 minutes or more and less than 20 g/10 minutes; (a-2) the density is from 0.920 to 0.930 g/cm3; and (a-3) the ratio of eluates at an elution temperature of 70° C. or higher is from 47 to 83% by weight in the elution curve obtained by a temperature rising elution fractionation (TREF) with o-dichlorobenzene.

Abstract: A method for producing a bone regeneration material containing an octacalcium phosphate-gelatin complex, the method including: co-precipitating octacalcium phosphate with gelatin to produce an octacalcium phosphate-gelatin co-precipitate; washing the co-precipitate with a washing liquid to remove gelatin from the co-precipitate, thereby obtaining an octacalcium phosphate slurry; dispersing the octacalcium phosphate slurry or dry granules formed using the slurry in an aqueous gelatin solution; and drying the dispersion of octacalcium phosphate dispersed in the aqueous gelatin solution to produce an octacalcium phosphate-gelatin complex.

Abstract: A method of manufacturing a liquid discharge head substrate is provided. The method includes forming a liquid discharge element and a protective film that covers the liquid discharge element; and forming a wiring structure that includes a conductive member. Annealing is performed on one of the liquid discharge element and the protective film such that a highest temperature in a thermal history received by one of the liquid discharge element and the protective film during manufacture of the liquid discharge head substrate becomes higher than a highest temperature in a thermal history received by the conductive member during the manufacture of the liquid discharge head substrate.

Abstract: The present invention provides a polyethylene resin composition for a foamable laminate which gives foamed cells having sufficient height and good appearance (foamed layer), even in the case of machining under high speed conditions at the time of extrusion lamination, a foamable laminate, a method for producing the same, a foamed converted paper, and a heat insulating container. The invention relates to a polyethylene resin composition for a foamable laminate, which is used for forming a polyethylene-based resin layer (I) for foaming on at least one side of a substrate mainly composed of paper, wherein the resin composition comprises a polyethylene-based resin (A) and satisfies the following properties (a-1) to (a-4): (a-1) the melt flow rate (MFR) of the polyethylene-based resin (A) as measured in accordance with JIS K7210 (190° C., a load of 21.

Abstract: A method for producing a bone regeneration material containing an octacalcium phosphate-gelatin complex, the method including: co-precipitating octacalcium phosphate with gelatin to produce an octacalcium phosphate-gelatin co-precipitate; washing the co-precipitate with a washing liquid to remove gelatin from the co-precipitate, thereby obtaining an octacalcium phosphate slurry; dispersing the octacalcium phosphate slurry or dry granules formed using the slurry in an aqueous gelatin solution; and drying the dispersion of octacalcium phosphate dispersed in the aqueous gelatin solution to produce an octacalcium phosphate-gelatin complex.

Abstract: A method of manufacturing a print element substrate, comprising preparing a substrate, including a first region and a second region, in which a printing portion is formed on the first region, and a wiring pattern connected to the printing portion is formed on the first region and the second region, forming an insulating film covering the printing portion and the wiring pattern, and forming a conductive cavitation-resistant film on the insulating film, wherein in the forming the insulating film, the insulating film is formed such that a side surface of a portion of the insulating film, which is formed on the second region, includes an inclined face.

Abstract: In one embodiment, a pipe inspecting apparatus includes a selection module configured to select first and second ultrasonic optical probes from a plurality of ultrasonic optical probes attached to a pipe. The apparatus further includes a power supplying module configured to supply power to an ultrasonic transducer of the first ultrasonic optical probe to input an ultrasonic wave from the ultrasonic transducer to the pipe and to supply the ultrasonic wave via the pipe to an optical fiber sensor of the second ultrasonic optical probe. The apparatus further includes a light detection module configured to detect laser light transmitted through the optical fiber sensor of the second ultrasonic optical probe.

Abstract: A method of manufacturing a semiconductor device having a twin well structure is provided. The method includes ion-implanting of a first conductivity type impurity in a first region and a second region of a semiconductor substrate, the first and second regions being located adjacent to each other; forming a first resist pattern to cover the first region of the semiconductor substrate and to expose the second region of the semiconductor substrate; ion-implanting of a second conductivity type impurity at a higher concentration compared to the first conductivity type impurity in the second region of the semiconductor substrate, with the first resist pattern being used as a mask; and thermal-diffusing the first conductivity type of impurity and the second conductivity type of impurity.

Abstract: A method of manufacturing a liquid discharge head is provided. The method includes forming a heating element on a substrate in which a semiconductor element is arranged. The method further includes forming a protection layer to contact an upper surface of the heating element. Annealing is performed in a hydrogen-containing atmosphere before the step of forming the protection layer.

Abstract: A method of manufacturing a print element substrate, comprising preparing a substrate, including a first region and a second region, in which a printing portion is formed on the first region, and a wiring pattern connected to the printing portion is formed on the first region and the second region, forming an insulating film covering the printing portion and the wiring pattern, and forming a conductive cavitation-resistant film on the insulating film, wherein in the forming the insulating film, the insulating film is formed such that a side surface of a portion of the insulating film, which is formed on the second region, includes an inclined face.

Abstract: The photo module is provided with an incident light fiber guiding light, a gradient index lens having an optical axis different from the incident light fiber, having a period length larger than a ¼ period length and smaller than a ½ period length with respect to the wavelength of the incident light, joined to the incident light fiber on a surface forming a finite angle with a surface vertical to the optical axis, and having, as a light exit surface of emitting light, a surface substantially vertical to the optical axis, and a light receiving element disposed at a position where the emitting light is collected and measuring the strength of the emitting light.

Abstract: A method of manufacturing a liquid discharge head is provided. The method includes forming a heating element on a substrate in which a semiconductor element is arranged. The method further includes forming a protection layer to contact an upper surface of the heating element. Annealing is performed in a hydrogen-containing atmosphere before the step of forming the protection layer.

Abstract: A through-hole forming method includes steps of forming a first impurity region (102a) around a region where a through-hole is to be formed in the first surface of a silicon substrate (101), the first impurity region (102) being higher in impurity concentration than the silicon substrate (101), forming a second impurity region (102b) at a position adjacent to the first impurity region (102a) in the depth direction of the silicon substrate (101), the second impurity region (102b) being higher in impurity concentration than the first impurity region (102a), forming an etch stop layer (103) on the first surface, forming an etch mask layer (104) having an opening on the second surface of the silicon substrate (101) opposite to the first surface, and etching the silicon substrate (101) until at least the etch stop layer (103) is exposed via the opening.

Abstract: The present invention provides an array-type photo module including a filter, which, in each channel, transmits therethrough a portion of emitted light from an incident optical fiber on the opposite side of a gradient-index lens array and reflects another portion of the emitted light from the incident optical fiber toward the gradient-index lens array, and a light-shielding member which is arranged on the opposite side of the filter from the gradient-index lens array, so as to be spaced from the filter and, in each channel, has an opening passing therethrough transmitted light from the filter on the opposite side of the filter. The array-type photo module is easily and inexpensively manufactured, and may be used in a high-density array, with low crosstalk.

Abstract: A photo module which measures a signal strength in a transmission path, and this technique collects a signal light, guided to a photo module, on a light receiving element without increasing the number of manufacturing processes and the cost and, at the same time, prevents reflected light returned from the photo module from entering inside the transmission path again.