Abstract: An apparatus for attenuating a light signal is disclosed. The apparatus causes optical attenuation in a waveguide, where the waveguide has an input port for receiving a light signal and an output port for output of an attenuated light signal. First, an electric field is generated in at least a portion of the waveguide, such that a first refractive index in that portion of the waveguide is changed to a second refractive index. Next, the light signal in the waveguide is directed from the input port to the output port through the electric field. And lastly, the light signal is attenuated as a function of the electric field. The light signal may be attenuated, for example, by changing the deflection angle, changing the beam collimation width or from emitting part of the light signal from the waveguide before the light signal reaches the output port.

Abstract: Optical apparatuses providing optical interconnections among a plurality N of electronic components. One exemplary apparatus comprises a slab waveguide having a core layer that enables light beams to propagate in a plurality of directions, a plurality of N reception ports, and a plurality of N transmission ports, each reception port and each transmission port serving a respective electronic component, and each being optically coupled to the core layer of the slab waveguide. Each transmission port is configured to receive a plurality of light beams from its assigned electronic component and to transmit each received light beam onto the slab waveguide in a direction toward a reception port. Each reception port is configured to receive from the slab waveguide a plurality of light beams transmitted to it from at least two different transmission ports. Light beams within the slab waveguide are permitted to cross paths. Other exemplary embodiments are disclosed.

Abstract: Optical backplanes providing integrated optical couplers to external optical fibers are disclosed, along with methods for making the same. An exemplary optical backplane has a first cladding layer disposed over the top surface of a substrate, and at least a first core body disposed over the first cladding layer, with the first core body having a first end and a second end. A material layer is disposed above the first cladding layer and the first end of the first core body, with the material layer having a top surface and a bottom surface. A focusing element is formed at the top surface of the material layer, with the focusing element being located above the first end of the first core body.

Abstract: An all-optical one-by-N optical switch is provided that has fewer components, is easier to control and has fewer optical losses that prior art one-by-N optical switches. An optical switch of the present invention includes an active deflection element formed from an electro-optical material to deflect an optical input from a single input to a selected one of N outputs. In one embodiment of the present invention, a single active deflection element at the input deflects an optical signal across a waveguide that commonly connects the N outputs. The N optical outputs include passive optical elements that are aligned with the deflected optical signal to accept a signal and provide it to a selected optical output. The optical switch can either be monolithic, where the optical material are all electro-optical materials, or can be hybrid, having separately formed components, such as the common waveguide, adhered to the substrate on which the optical switch is formed.

Abstract: Compact optical devices and methods of constructing the same are disclosed. The optical devices are formed with perpendicular orientations to the surface of a supporting layer (e.g., substrate), and have three-dimensional structures rather than planar structures. The optical devices can be formed with high density on supporting layers without the need for several built-up layers. Maintaining the processing temperatures within the cure profiles of polymer optical layers is readily achieved.

Abstract: The present invention is directed to an apparatus and related methods related to an optical bump for optically coupling devices. An exemplary apparatus includes a first device, a second device, and at least one optical bump. The first device has a first surface including at least one first optically active area. The second device has a second surface including at least one second optically active area positioned in an opposed and spaced-apart relationship with respect to the at least one first optically active area. The first surface is separated from the second surface by a distance. The at least one optical bump is coupled to the first surface between the at least one first optically active area and the at least one second optically active area. The at least one optical bump has a height that is less than the distance between the first surface and the second surface.

Abstract: A board level optical system for high speed device interconnection is disclosed. A constant intensity laser is mounted on a board substrate, and the laser light is divided into a plurality of optical channels using a waveguide splitter that is integrated into the substrate. An array of high speed optical modulators electrically driven by an IC device mounted on the substrate creates a corresponding plurality of optical signals. A connector is used to transfer the optical signals to one or more other devices, either on or off of the substrate. The optical modulators are preferably Mach Zehnder modulators comprising polymeric electro-optical material. The modulator array may be integrated into the substrate. IC device may also have integrated photodetectors for receiving optical signals routed via the substrate. In addition to optical wiring layers, the substrate may have one or more electrical wiring layers.

Abstract: The present invention generally relates to circuits on the nanotechnology scale. Specifically, it is directed to methods of fabricating carbon nanotube-based (i.e., CNT-based) circuits. The method involves providing a mixture of carbon nanotubes that is substantially disaggregated and patterning carbon nanotubes through the use of electrostatic forces. Carbon nanotubes in the mixture are typically disaggregated through the introduction of positive charge on the individual nanotubes. The patterning of the carbon nanotubes is typically accomplished using electrostatic attraction between pre-formed metal lines and the charged carbon nanotubes.

Abstract: Optical backplanes providing integrated optical couplers to external optical fibers are disclosed, along with methods for making the same. An exemplary optical backplane has a first cladding layer disposed over the top surface of a substrate, and at least a first core body disposed over the first cladding layer, with the first core body having a first end and a second end. A material layer is disposed above the first cladding layer and the first end of the first core body, with the material layer having a top surface and a bottom surface. A focusing element is formed at the top surface of the material layer, with the focusing element being located above the first end of the first core body.

Abstract: Compact optical devices and methods of constructing the same are disclosed. The optical devices are formed with perpendicular orientations to the surface of a supporting layer (e.g., substrate), and have three-dimensional structures rather than planar structures. The optical devices can be formed with high density on supporting layers without the need for several built-up layers. Maintaining the processing temperatures within the cure profiles of polymer optical layers is readily achieved.

Abstract: The present invention provides an optical bridge for interconnecting optical networking components and methods of making optical bridges that include a waveguide that are compatible with semiconductor processing steps. The optical bridge of the present invention has less optical losses and is less affected by misalignment that prior art interconnections. The waveguide is formed of a curable optical material that spans optically active areas of two components. In one embodiment of the present invention, one optical component is an optical circuit board and the connected optical component is an electro-optical integrated circuit package containing light emitting or light receiving elements. The method provides a curable optical liquid to the components, bringing the components together to form a continuous optical liquid between the components, and curing the optical liquid.

Abstract: Methods of forming lanthanum nickel oxide (LaNiO3) layers with precursor formation solutions are disclosed, along with devices made from such solutions. Also disclosed are methods for making the formation solutions using lanthanum, nickel, and a diol. The present invention enables the manufacture of LaNiO3 layers at low cost, with good resistivity properties, and a surface morphology suitable for interfacing to a ferro-electric material.

Abstract: A tunable micro-lens and micro-lens array for use in optical communications are disclosed. The micro-lens uses thermo optical material and a temperature controller to adjust the temperature and, hence, the index of refraction of the thermo optical material. In one embodiment, a single temperature controller is used to maintain an array of micro-lenses at a desired temperature. In an alternate embodiment, the individual lenses in an array are separately tunable. The invention may be used with either 2D or 3D lenses, and is well suited for use with existing planar lightwave circuit (PLC) technology.

Abstract: A flexible optical connector suitable for use in an optical backplane for interconnecting optical circuit boards, and methods of making the optical connector, are disclosed. The flexible optical connector comprises a plurality of waveguides on two or more levels providing a plurality of light paths that allow light communication between optical circuit boards. The optical connector can be manufactured separately from the backplane and thereafter mounted on the backplane. The backplane of the present invention may also have a mounting structure for removably retaining and positioning optical circuit board and may, optionally, include electrical traces for providing electrical interconnections between the circuit boards.

Abstract: The intensity of signals in optical networks can be controlled using a variable optical attenuator (VOA). The present invention is a VOA that is particularly well suited for optical networks, for example to provide channel-by-channel normalization of gain control of wavelength division multiplexed signals. The inventive VOA includes a waveguide having a cladding that includes an electro-optical material and electrodes that produce an electric field within the electro-optical material when a voltage difference is applied to the electrodes. The VOA also includes a layer that is parallel to the core of the waveguide and that optically couples to the core to receive light from the attenuated signal. A power meter receives light from the layer as an indication of the amount of light attenuated from the signal and for controlling the voltage to the electrodes.

Abstract: A system and method is provided for attenuating a light signal. One embodiment includes a method for causing optical attenuation in a waveguide, where the waveguide has an input port for receiving a light signal and an output port for output of an attenuated light signal. First, an electric field is generated in at least a portion of the waveguide, such that a first refractive index in that portion of the waveguide is changed to a second refractive index. Next, the light signal in the waveguide is directed from the input port to the output port through the electric field. And lastly, the light signal is attenuated as a function of the electric field. The light signal may be attenuated, for example, by changing the deflection angle, changing the beam collimation width or from emitting part of the light signal from the waveguide before the light signal reaches the output port.

Abstract: A tunable micro-lens and micro-lens array for use in optical communications are disclosed. The micro-lens uses thermo optical material and a temperature controller to adjust the temperature and, hence, the index of refraction of the thermo optical material. In one embodiment, a single temperature controller is used to maintain an array of micro-lenses at a desired temperature. In an alternate embodiment, the individual lenses in an array are separately tunable. The invention may be used with either 2D or 3D lenses, and is well suited for use with existing planar lightwave circuit (PLC) technology.

Abstract: Optical couplers having attachment features are disclosed. A typical coupler according to the present invention couples an optical signal from an optical fiber to a channel waveguide by overlapping the cores of the optical fiber and channel waveguide along a portion of their waveguide lengths, with a spacing distance between the cores of not more than 20 microns for single-mode light coupling, and not more than 100 microns for multi-mode light coupling. This is in contrast to a prior art coupler, which seeks to position the ends of the two cores in a facing relationship. In embodiments according to the present invention, attachment films may be disposed in the overlapping regions to provide advantageous coupling arrangements and new types of opto-electric devices.

Abstract: Disclosed are apparatuses and methods for fast and reliable integration of opto-electric components onto optical routing substrates. Accurate alignment of optical signals to and from the opto-electric components, and short electrical interconnect paths to the components to reduce signal delays to the devices on the components are enabled. In an exemplary embodiment, an attachment area is set out on the optical routing substrate to receive each component. One or more optical waveguides for coupling optical signals with the component are located adjacent to the attachment area. A plurality of conductive pads are located within the attachment area, and are for interconnecting to the component by way of bodies of solder, conductive adhesive, or the like. Interspersed between the conductive pads are a plurality of spacers that set a spacing distance between the attachment area and the opposing surface of the component, resulting in accurate alignment of optical signals.

Abstract: Disclosed are reconfigurable optical interconnections for opto-electronic processors in general, and for scalable computer architectures and scalable network servers in particular. The optical-signal interconnects are adaptable, or reconfigurable, during the normal operation of the processor. A large number of optical-signal interconnects may be provided among the components of the processor while using a small number of light transmitters and/or light receivers.