Patents by Inventor Kishio Yokouchi
Kishio Yokouchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6403289Abstract: The invention relates to a developer for photosensitive polyimide resin compositions, comprising an alkaline aqueous solution containing a basic compound (A) represented by a formula (1): wherein X+ is N+ or P+, R is an alkyl group having 1 to 20 carbon atoms or an aryl group having 6 to 10 ring forming carbon atoms, Y− is a monovalent anion, m is 0 or 1, n is 3 or 4, and m+n is 4, with the proviso that when m is 0, n is 4, and R is an alkyl group, the total number of carbon atoms of 4 alkyl groups is at least 13, or when m is 1, n is 3, and R is an alkyl group, the total number of carbon atoms of 3 alkyl groups is at least 6.Type: GrantFiled: October 30, 1998Date of Patent: June 11, 2002Assignees: Nippon Zeon Co., Ltd., Fujitsu LimitedInventors: Akira Tanaka, Kei Sakamoto, Yasuhiro Yoneda, Kishio Yokouchi
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Publication number: 20020035196Abstract: A polyimide resin composition comprising a polyimide resin (A) and at least one 1H-tetrazole (B) selected from the group consisting of 1H-tetrazole, 5,5′-bis-1H-tetrazole, and derivatives thereof, and having an excellent rust preventing effect on copper and copper alloys.Type: ApplicationFiled: September 25, 2001Publication date: March 21, 2002Inventors: Akira Tanaka, Satoshi Tazaki, Yasuhiro Yoneda, Kishio Yokouchi
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Publication number: 20020032273Abstract: A polyimide resin composition comprising a polyimide resin (A) and at least one 1H-tetrazole (B) selected from the group consisting of 1H-tetrazole, 5,5′-bis-1H-tetrazole, and derivatives thereof, and having an excellent rust preventing effect on copper and copper alloys.Type: ApplicationFiled: September 25, 2001Publication date: March 14, 2002Inventors: Akira Tanaka, Satoshi Tazaki, Yasuhiro Yoneda, Kishio Yokouchi
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Patent number: 6310135Abstract: A polyimide resin composition comprising a polyimide resin (A) and at least one 1H-tetrazole (B) selected from the group consisting of 1H-tetrazole, 5,5′-bis-1H-tetrazole, and derivatives thereof, and having an excellent rust preventing effect on copper and copper alloys.Type: GrantFiled: February 20, 1998Date of Patent: October 30, 2001Assignee: Nippon Zeon Co., Ltd.Inventors: Akira Tanaka, Satoshi Tazaki, Yasuhiro Yoneda, Kishio Yokouchi
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Patent number: 6193905Abstract: A coolant for cooling a semiconductor element by direct immersion, cooling, which has an improved cooling capability, is disclosed. The coolant comprises a low boiling point fluorocarbon having a boiling point of 30° C. to 100° C. and a high boiling point fluorocarbon having a boiling point higher than that of the low boiling point fluorocarbon by at least 100° C.; an amount of the high boiling point fluorocarbon being less than 20% by volume, based on the volume of the low boiling point fluorocarbon.Type: GrantFiled: January 30, 1995Date of Patent: February 27, 2001Assignee: Fujitsu LimitedInventors: Mitsutaka Yamada, Kishio Yokouchi, Nobuo Kamehara, Koichi Niwa
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Patent number: 6160081Abstract: The invention relates to a photosensitive polyimide resin composition comprising (A) a polyamic acid having, in its main chain, repeating units formed from a polycondensation product of at least one tetracarboxylic acid or tetracarboxylic anhydride thereof with at least one diamine compound, and having actinic ray-sensitive functional groups at both terminals thereof; (B) a photosensitive auxiliary having a photopolymerizable functional group; (C) a photopolymerization initiator; and (D) a solvent, wherein 1 the polyamic acid is such that when the repeating unit represented by the formula (1) is defined as a unit molecular weight, a unit molecular weight per carboxyl group (unit molecular weight/COOH) falls within a range of from 200 to 300, and 2 the photosensitive resin composition permits the formation of a polyimide film having a residual stress of 40 MPa or lower and a coefficient of thermal expansion of 30 ppm/.degree. C.Type: GrantFiled: October 30, 1998Date of Patent: December 12, 2000Assignees: Nippon Zeon Co., Ltd., Fujitsu LimitedInventors: Akira Tanaka, Kei Sakamoto, Kenichi Ito, Yasuhiro Yoneda, Kishio Yokouchi, Yasuo Naganuma
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Patent number: 6001488Abstract: A resin composition comprising an epoxy group-containing cycloolefin resin and a crosslinking agent is provided. More specifically, a resin composition comprising an epoxy group-containing thermoplastic norbornene resin obtained by introducing epoxy groups into a thermoplastic norbornene resin, and as the crosslinking agent, a curing agent for epoxy resins or a photoreactive substance is provided. The resin composition is suitable for use as an insulating material.Type: GrantFiled: June 29, 1998Date of Patent: December 14, 1999Assignees: Nippon Zeon Co., Ltd., Fujitsu LimitedInventors: Hideaki Kataoka, Eiko Yuda, Shigemitsu Kamiya, Masahide Yamamoto, Yoshikatsu Ishizuki, Yasuhiro Yoneda, Daisuke Mizutani, Kishio Yokouchi
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Patent number: 5895800Abstract: A resin composition comprising an epoxy group-containing cycloolefin resin and a crosslinking agent is provided. More specifically, a resin composition comprising an epoxy group-containing thermoplastic norbornene resin obtained by introducing epoxy groups into a thermoplastic norbornene resin, and as the crosslinking agent, a curing agent for epoxy resins or a photoreactive substance is provided. The resin composition is suitable for use as an insulating material.Type: GrantFiled: June 29, 1998Date of Patent: April 20, 1999Assignees: Nippon Zeon Co., Ltd., Fujitsu LimitedInventors: Hideaki Kataoka, Eiko Yuda, Shigemitsu Kamiya, Masahide Yamamoto, Yoshikatsu Ishizuki, Yasuhiro Yoneda, Daisuke Mizutani, Kishio Yokouchi
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Patent number: 5886136Abstract: Disclosed herein is a pattern forming process comprising the steps of coating a substrate with a photosensitive resin composition comprising a polyamic compound having, at each terminal thereof, an actinic ray-sensitive functional group which has substituent groups each having a photopolymerizable carbon-carbon double bond, a photosensitive auxiliary having a photopolymerizable functional group, a photopolymerization initiator, and a solvent to form a film; subjecting the film to pattering exposure; and then developing the thus-exposed film with an alkaline developer or alkaline aqueous solution.Type: GrantFiled: March 17, 1997Date of Patent: March 23, 1999Assignees: Nippon Zeon Co., Ltd., Fujitsu LimitedInventors: Akira Tanaka, Masami Koshiyama, Kei Sakamoto, Yasuhiro Yoneda, Kishio Yokouchi, Daisuke Mizutani, Yoshikatsu Ishizuki
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Patent number: 5783639Abstract: A resin composition comprising an epoxy group-containing cycloolefin resin and a crosslinking agent is provided. More specifically, a resin composition comprising an epoxy group-containing thermoplastic norbornene resin obtained by introducing epoxy groups into a thermoplastic norbornene resin, and as the crosslinking agent, a curing agent for epoxy resins or a photoreactive substance is provided. The resin composition is suitable for use as an insulating material.Type: GrantFiled: January 13, 1997Date of Patent: July 21, 1998Assignees: Nipon Zeon Co., Ltd., Fujitsu LimitedInventors: Hideaki Kataoka, Eiko Yuda, Shigemitsu Kamiya, Masahide Yamamoto, Yoshikatsu Ishizuki, Yasuhiro Yoneda, Daisuke Mizutani, Kishio Yokouchi
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Patent number: 5777068Abstract: Provided are photosensitive resin compositions comprising a polyamic compound having, at each terminal thereof, a specific actinic ray-sensitive functional group which has substituent groups each having a photopolymerizable carbon-carbon double bond, a photosensitive auxiliary having a photopolymerizable functional group and a solvent. The photosensitive resin compositions of the invention are excellent in resist properties such as sensitivity and good in storage stability and can provide a film small in residual stress.Type: GrantFiled: September 12, 1995Date of Patent: July 7, 1998Assignees: Nippon Zeon Co., Ltd., Fujitsu LimitedInventors: Akira Tanaka, Satoshi Tazaki, Kei Sakamoto, Yasuhiro Yoneda, Kishio Yokouchi, Daisuke Mizutani, Yoshikatsu Ishizuki
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Patent number: 5593526Abstract: A process for producing a multi-layer wiring board having alternate layers of a glass ceramic material and conductor patterns. The glass ceramic layers are made up of a glass ceramic material including a glass matrix and ceramic particles dispersed in the matrix. The glass ceramic layers are caused to contain hollow or porous silica glass spheres dispersed in the glass ceramic material. The hollow or porous silica glass spheres are covered with a ceramic coating layer containing alumina as a constituent element. Such a structure prevents crystallization of the silica spheres and avoids the resultant rapid increase in the the thermal expansion coefficient of the glass ceramic layers. The structure provided by the process of the invention also precudes the formation of pores in the surfaces of the glass ceramic layers.Type: GrantFiled: September 30, 1994Date of Patent: January 14, 1997Assignee: Fujitsu LimitedInventors: Kishio Yokouchi, Hiroshi Kamezaki, Masato Wakamura, Nobuo Kamehara, Koichi Niwa
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Patent number: 5534331Abstract: A method in which a multi-layered ceramic circuit board made of a hybrid laminate consisting of green sheets containing hollow silica and green sheets containing no hollow silica is manufactured without failures occurring during the firing of the laminate. By incorporating quartz glass into a first ceramic material containing hollow silica to replace part of the hollow silica with quartz glass, the compositions of the first ceramic material and a second ceramic material containing no hollow silica are controlled so that the difference between the percentages of shrinkage on firing of the green sheets formed of the first and second ceramic materials is within 1%.Type: GrantFiled: March 24, 1994Date of Patent: July 9, 1996Assignee: Fujitsu LimitedInventors: Shigenori Aoki, Hiroshi Kamezaki, Masaharu Hida, Kishio Yokouchi
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Patent number: 5478972Abstract: An interlayer connection wiring penetrating each of resin films constituting a multilayer circuit board and a surface wiring connected to the interlayer connection wiring are formed in predetermined positions on surfaces of each resin film. The resin films are laminated while being positioned so that the interlayer connection wiring of one of each adjacent pair of the circuit bases is superposed on a part of the surface wiring of the other, and are thereafter treated under a high-temperature and high-pressure condition to be combined with each other. If a resin film formed of a thermoplastic resin is adopted, the laminated resin films are combined by intermixing the interfaces of each adjacent pair of resin films. As the resin films shrink when the laminated resin films is cooled to ordinary temperature, a compressive force is applied to the contact surfaces of the interlayer connection wiring and the surface wiring.Type: GrantFiled: August 25, 1994Date of Patent: December 26, 1995Assignee: Fujitsu LimitedInventors: Daisuke Mizutani, Kishio Yokouchi
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Patent number: 5458709Abstract: A process for manufacturing a multi-layer glass ceramic substrate which includes the steps of forming green sheets containing ceramic powders and glass powders as main ingredients, laminating the green sheets, and firing the laminated green sheets to form a multi-layer glass ceramic substrate, wherein at least one green sheet containing porous glass powders as a part of the glass powders, is provided to control the shrinkage of the green sheets and prevent cracks or delamination.Type: GrantFiled: April 13, 1992Date of Patent: October 17, 1995Assignee: Fujitsu LimitedInventors: Hiroshi Kamezaki, Masato Wakamura, Kishio Yokouchi, Nobuo Kamehara
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Patent number: 5349499Abstract: A coolant for cooling a semiconductor element by direct immersion, cooling, which has an improved cooling capability, is disclosed. The coolant comprises a low boiling point fluorocarbon having a boiling point of 30.degree. C. to 100.degree. C. and a high boiling point fluorocarbon having a boiling point higher than that of the low boiling point fluorocarbon by at least 100.degree. C.; an amount of the high boiling point fluorocarbon being less than 20% by volume, based on the volume of the low boiling point fluorocarbon.Type: GrantFiled: April 28, 1993Date of Patent: September 20, 1994Assignee: Fujitsu LimitedInventors: Mitsutaka Yamada, Kishio Yokouchi, Nobuo Kamehara, Koichi Niwa
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Patent number: 5324370Abstract: A method in which a multi-layered ceramic circuit board made of a hybrid laminate consisting of green sheets containing hollow silica and green sheets containing no hollow silica is manufactured without failures occurring during the firing of the laminate. By incorporating quartz glass into a first ceramic material containing hollow silica to replace part of the hollow silica with quartz glass, the compositions of the first ceramic material and a second ceramic material containing no hollow silica are controlled so that the difference between the percentages of shrinkage on firing of the green sheets formed of the first and second ceramic materials is within 1%.Type: GrantFiled: February 24, 1993Date of Patent: June 28, 1994Assignee: Fujitsu LimitedInventors: Shigenori Aoki, Hiroshi Kamezaki, Masaharu Hida, Kishio Yokouchi
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Patent number: 5275889Abstract: A laminated multi-layer wiring board comprising alternate layers of a glass ceramic material and conductor pattern. The glass ceramic layers are made of a glass ceramic comprising glass and dispersed ceramic particles. The glass ceramic layers further contain hollow or porous silica glass spheres dispersed in the glass ceramic. The hollow or porous silica glass spheres are covered with a ceramic coating layer containing aluminum as a constituent element. Such a structure prevents crystallization of the silica spheres and the resultant rapid increase in the thermal expansion coefficient of the glass ceramic layer. The structure also procludes the formation of pores in the surfaces of the spheres.Type: GrantFiled: September 20, 1991Date of Patent: January 4, 1994Assignee: Fujitsu LimitedInventors: Kishio Yokouchi, Hiroshi Kamezaki, Masato Wakamura, Nobuo Kamehara, Koichi Niwa
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Patent number: 5196384Abstract: Methods for preparing a green sheet and a glass ceramic substrate are herein disclosed.Type: GrantFiled: September 17, 1991Date of Patent: March 23, 1993Assignee: Fujitsu LimitedInventors: Hiroshi Kamezaki, Masato Wakamura, Kishio Yokouchi, Yoshihiko Imanaka, Nobuo Kamehara
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Patent number: 5038571Abstract: A coolant for use in cryogenic devices of closed cycle system which comprises a mixture of a liquid nitrogen and a fluorocarbon of the formula: C.sub.n F.sub.2n+2, wherein n is an integer of 2 to 4. The coolant, when used to cool heat generating semiconductor devices and other devices to a cryogenic temperature, exhibits an increased heat flux and thus an increased cooling capability, in addition to a simple and small structure of the cooling system, and a prevention of environmental pollution.Type: GrantFiled: November 17, 1989Date of Patent: August 13, 1991Assignee: Fujitsu LimitedInventors: Kishio Yokouchi, Mitsutaka Yamada, Nobuo Kamehara, Koichi Niwa