Abstract: This invention relates to a clock with intelligent backlight device comprising a casing, a power supply, timing components, a printed circuit board, time setting buttons and so forth. The power supply is in the form of dry batteries placed inside the battery box of the casing. Inside the casing there are a backlight device and a backlight source. The backlight device is disposed at the back of the timing components, and the backlight source is disposed at the back of the backlight device. The printed circuit board is installed with integrated circuits, the first output thereof drives and controls the timing components, the input thereof connects to the time setting buttons, while the second output thereof drives and controls the backlight source through a photosensitive resistor and an electronic switch in serial connection. The present invention is powered by dry batteries and is operated by low voltage and current.

Abstract: An electronic device that facilitates improved electrical and thermal performance and/or allows fabrication of smaller electronic devices exhibiting excellent performance characteristics, especially for devices operating at microwave frequencies, includes an input/output pad, and a carbon nanotube extending from the input/output pad to provide wafer-level nano-interconnect for flip chip interconnections and die stacking on a substrate.

Abstract: A wafer level package formed on an integrated circuit chip having bondpads and a fabrication method therefor is disclosed. The wafer level package comprises at least one first, second and third separation layer having at least one first and second conductive layer formed in-between the separation layers. The at least one first conductive layer is formed on the at least one first separation layer and is coupled to the bondpads. The at least one second conductive layer is formed on the at last one second separation layer wherein the at least one second conductive layer is electrically coupled to the at least one first conductive layer. The at least one third separation layer allows solder to be attached to the at least one second conductive layer for electrically coupling the solder to the bondpads. A chip ground plane is laid in the integrated circuit chip for providing a ground to the at least one first conductive layer and the solder.

Abstract: A method and system are provided for uniquely assigning identifications for a plurality of mail pieces, before physically sorting the mail pieces that will subsequently be mailed. Each of these identifications includes a sequential part, and each of the mail pieces includes postal destination information indicative of a destination area sort level. Preferably, not only that destination area sort level is included, but also at least one wider destination area sort level. The present invention entails determining whether a current mail piece has postal destination information indicative of the same destination area as a previously processed mail piece. If the destination area is the same, then the sequential part is assigned to the current mail piece, such that the sequential part is monotonically different from the sequential part of the previous mail pieces having the same destination area.

Abstract: A method and device to elongate a solder joint are provided. The method begins by forming an elongator on a first substrate. The elongator comprises an expander and an encapsulant to encapsulate the expander. A solder joint is formed to connect the first substrate to a second substrate. Thereafter, the encapsulant is softened to release the expander from a compressed state to elongate the solder joint. The device to elongate a solder joint comprises a substrate having an elongator formed on it. The elongator includes an expander in a compressed state and an encapsulant to encapsulate the expander.

Abstract: An automatic electric charger connectable with a number of electric appliance for providing electric power to the appliances is disclosed as including an RF transceiver for receiving data representing charging and/or powering parameters of the appliances; an I/O unit electrically connected with an electric power source for receiving electric power therefrom, and electrically connectable with the appliances for transmitting electric power thereto; in which the I/O unit may vary, in accordance with the received data, the voltage of the electric power received from the electric power source for subsequent transmission to the appliances.

Abstract: A wafer level package formed on an integrated circuit chip having bondpads and a fabrication method therefor is disclosed. The wafer level package comprises at least one first, second and third separation layer having at least one first and second conductive layer formed in-between the separation layers. The at least one first conductive layer is formed on the at least one first separation layer and is coupled to the bondpads. The at least one second conductive layer is formed on the at last one second separation layer wherein the at least one second conductive layer is electrically coupled to the at least one first conductive layer. The at least one third separation layer allows solder to be attached to the at least one second conductive layer for electrically coupling the solder to the bondpads. A chip ground plane is laid in the integrated circuit chip for providing a ground to the at least one first conductive layer and the solder.

Abstract: The present invention discloses the present invention discloses a power toothbrush that includes a body portion 105. An elongated level arm 102 extends from one end of the body portion to a toothbrush head 101 disposed at a distal end of the toothbrush. The toothbrush head includes a plurality of brush bristles. The elongated lever arm 102 is mounted on a vibrating pivot 104 driven by rotational DC motor engaging and pushing a set of permanent magnets attached to a two-arm fork rotating along the lever arm 102. In a preferred embodiment, the DC motor drives a three-leg permanent magnets each disposed at a 120-degree phase from each other for driving the two-arm fork for generating a vibration that three-times the frequency of the DC motor's rotational frequency.

Abstract: A nozzle assembly includes a connector tube having a first end and a second end. An outer surface of the connector tube is threaded. A first cap having an opening therethrough is threaded onto the first end of the connector tube. A second cap having an opening therethrough is threaded onto the second end of the connector tube. Each of the first and second caps has a top surface and a threaded inner surface. The nozzle assembly further includes a nozzle having a tubular portion defining a channel. The tubular portion is disposed in the opening of the first connector cap so that a position of the nozzle can be axially and rotationally adjusted. A spin, rinse, and dry station including the adjustable nozzle assembly and a method for spin rinsing the bottom side, i.e., the backside, of a semiconductor wafer also are described.

Abstract: The present invention discloses a toothbrush head universally adaptable for operation with a single-direction rotational shaft of a fist electrical toothbrush and a bi-directional swinging shaft of a second electrical toothbrush. In a preferred embodiment, the toothbrush head includes a first half-cycle gear and a second half-cycle gear for engaging a set of gears disposed on a surface of a bristle plate.

Abstract: A pressure booster and method for amplifying a water pressure that is supplied by a water facility is provided. The pressure booster is configured to be connected between the water facility and one or more semiconductor substrate cleaning systems. The pressure booster includes a pump having a pump input that connects to the water facility and a pump output that is configured to produce a fluctuating amplified water pressure that is greater than the water pressure that is supplied by the water facility. Further included is a pressure dampener having a dampener input for accepting the fluctuating amplified water pressure from the pump output. The pressure dampener is configured to partially reduce pressure fluctuations in the fluctuating amplified water pressure. The pressure dampener also has a dampener output. A pressure regulator having a regulator input for receiving the dampener output is also included as part of the pressure booster.

Abstract: The present invention relates to reaction products formed from maleic anhydride and amino carboxylic acids. The reaction products are particularly useful for grafting polyolefins to increase their polarity and therefore enhance their physical properties.

Abstract: A pressure booster and method for amplifying a water pressure that is supplied by a water facility is provided. The pressure booster is configured to be connected between the water facility and one or more semiconductor substrate cleaning systems. The pressure booster includes a pump having a pump input that connects to the water facility and a pump output that is configured to produce a fluctuating amplified water pressure that is greater than the water pressure that is supplied by the water facility. Further included is a pressure dampener having a dampener input for accepting the fluctuating amplified water pressure from the pump output. The pressure dampener is configured to partially reduce pressure fluctuations in the fluctuating amplified water pressure. The pressure dampener also has a dampener output. A pressure regulator having a regulator input for receiving the dampener output is also included as part of the pressure booster.

Abstract: A process for the manufacture of a polyphenol compound such as bisphenol-A by introducing into a reaction zone a phenolic compound reactant, a carbonyl compound reactant, and a catalyst promoter comprising a dithioketal compound, and reacting the ingredients within the reaction zone in the presence of an acid catalyst.

Abstract: A nozzle assembly includes a connector tube having a first end and a second end. An outer surface of the connector tube is threaded. A first cap having an opening therethrough is threaded onto the first end of the connector tube. A second cap having an opening therethrough is threaded onto the second end of the connector tube. Each of the first and second caps has a top surface and a threaded inner surface. The nozzle assembly further includes a nozzle having a tubular portion defining a channel. The tubular portion is disposed in the opening of the first connector cap so that a position of the nozzle can be axially and rotationally adjusted. A spin, rinse, and dry station including the adjustable nozzle assembly and a method for spin rinsing the bottom side, i.e., the backside, of a semiconductor wafer also are described.

Abstract: A process for the manufacture of a polyphenol compound such as bisphenol-A by introducing into a reaction zone a phenolic compound reactant, a carbonyl compound reactant, and a catalyst promoter comprising a dithioketal compound, and reacting the ingredients within the reaction zone in the presence of an acid catalyst.

Abstract: A grafted polyolefin polymers having high polarity produced by grafting bi-functional N-substituted diacids to maleated or other functional group grafted polyolefin. The new polymers exhibit improved water miscibility, compatability and good adhesion to polar materials such as nylon, polyester, glass, and metal substrates.

Abstract: The present invention discloses the present invention discloses a power toothbrush that includes a body portion 105. An elongated level arm 102 extends from one end of the body portion to a toothbrush head 101 disposed at a distal end of the toothbrush. The toothbrush head includes a plurality of brush bristles. The elongated lever arm 102 is mounted on an vibrating pivot 104 driven by rotational DC motor engaging and pushing a set of permanent magnets attached to a two-arm fork rotating along the lever arm 102. In a preferred embodiment, the DC motor drives a three-leg permanent magnets each disposed at a 120-degree phase from each other for driving the two-arm fork for generating a vibration that three-times the frequency of the DC motor's rotational frequency. A power toothbrush capable of vibrating at a frequency of 30,000 to 40,000 toothbrush strokes per minute is disclosed in this invention.

Abstract: The present invention discloses the present invention discloses a toothbrush head for engaging to an automatic toothbrush base having a motor shaft for actuating a vibration. The toothbrush head includes a tubular adapter for adapting the vibrating motor shaft the tubular adapter further engaging and transferring the vibration to a swing rod. The toothbrush head further includes an off center pin engaged to the swing rod. The toothbrush head further includes a pair of parallel pins for disposing the off center pin therein and the pair of parallel pins are fixed onto a bristle plate whereby the off center pin is moved along the pair of parallel pin for generating a corresponding vibration on the bristle plate.

Abstract: A nozzle assembly includes a connector tube having a first end and a second end. An outer surface of the connector tube is threaded. A first cap having an opening therethrough is threaded onto the first end of the connector tube. A second cap having an opening therethrough is threaded onto the second end of the connector tube. Each of the first and second caps has a top surface and a threaded inner surface. The nozzle assembly further includes a nozzle having a tubular portion defining a channel. The tubular portion is disposed in the opening of the first connector cap so that a position of the nozzle can be axially and rotationally adjusted. A spin, rinse, and dry station including the adjustable nozzle assembly and a method for spin rinsing the bottom side, i.e., the backside, of a semiconductor wafer also are described.