Abstract: A semi-submersible marine structure is described. The structure includes a hull including a pontoon, a deck disposed above the pontoon, and a plurality of columns supporting the deck from the pontoon. The structure also includes a plurality of tendons supporting the hull from a seabed. The pontoon has the shape of a circular ring, and the plurality of tendons are arranged at regular intervals along an external circumferential surface of the pontoon.

Abstract: A semiconductor light emitting device includes a light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer; and an insulating layer on the light emitting structure and including first and second through-holes. The insulating layer includes a first lower insulating layer and a second lower insulating layer. The first insulating layer is disposed on the first conductivity-type semiconductor layer and is surrounded by the second lower insulating layer with the first through-hole interposed therebetween.

Abstract: A semiconductor light emitting device includes a light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer; and an insulating layer on the light emitting structure and including first and second through-holes. The insulating layer includes a first lower insulating layer and a second lower insulating layer. The first insulating layer is disposed on the first conductivity-type semiconductor layer and is surrounded by the second lower insulating layer with the first through-hole interposed therebetween.

Abstract: Provided is a printed circuit board including: a support substrate including a first area in which a light emitting device is mounted, and a second area extending from the first area; a bending part which is configured such that a part between the first area and the second area is bent; a through hole passing through the bending part; a connection wiring connected to the light emitting device and disposed on the bending part; and a wiring connected to the connection wiring.

Abstract: Provided is a lighting unit, including: a support substrate; a light guide plate for guiding light generated from a light source; and a first stopper fixed to the support substrate and configured to support the light guide plate.

Abstract: Provided is a circuit board including: a supporting substrate including a first region to which light emitting elements are mounted and a second region extending to be bent from the first region, wherein the second region comprises: a connector mounting portion to which a connector for supplying an electric current to the light emitting elements is mounted; and a non-mounting portion of a connector separated and spaced apart from the connector mounting portion, wherein the connector mounting portion is formed lower than the non-mounting portion of the connector.

Abstract: Provided are a lighting device and a flat panel display having the lighting device, the lighting device, including: a support substrate; a circuit board on the support substrate; light emitting devices mounted on the circuit board; and a light guide plate having a protruding portion protruding to a remaining region except for a region in which the light emitting devices are disposed.

Abstract: Provided is a printed circuit board, including: a support substrate including a first region in which light emitting elements are mount, a second region extending from the first region, and a bending portion between the first region and the second region, an insulating substrate on the support substrate, wiring portions on the insulating substrate, and a protective layer on the wiring portions.

Abstract: Provided is a circuit board including: a support substrate; a plurality of light emitting devices mounted on the support substrate; and a device protection portion surrounding one of the light emitting devices, or three or more surfaces of the plurality of light emitting devices.

Abstract: A light source circuit unit and a lighting device including the light source circuit unit that are configured such that a bent-type metal substrate is formed on an upper surface of the printed circuit board so that the occurrence of a defect due to circuit damage at a bent part upon bending the substrate can be prevented, and slimness and a heat-dissipation property of a device can be improved. The light source circuit board includes: a substrate having a first part with at least one opening portion, and a second part bent from the first part; a printed circuit board on one surface of the substrate; and a light source element mounted to the printed circuit board and inserted into the opening portion, the light source element emitting light to an opposing side of the substrate.

Abstract: A wasted carpet and felt scrap recycling apparatus is provided. The waste carpet and felt scrap recycling apparatus includes a feeding unit that feeds a cut scrap while forming a feeding path and a supply unit that is connected to the feeding path and supplies the scrap that passed the feeding unit along the feeding path while pressing the scrap. A separation unit is spaced apart from the supply unit, and provides a frictional force to one surface of the scrap supplied from the supply unit through rotation of the supply unit and separates the scrap into fiber and recycled material.

Abstract: A surface treatment method for a semiconductor device includes providing a substrate where a plurality of projected patterns are formed, forming a hydrophobic coating layer on a surface of each of the plurality of projected patterns, rinsing the substrate with deionized water, and drying the substrate, wherein the hydrophobic coating layer is formed using a coating agent that includes phosphate having more than one hydrocarbon group, phosphonate having more than one hydrocarbon group, or a mixture thereof.

Abstract: Provided is a circuit board including: a support substrate including a first region and a second region extending to be bent from the first region; light emitting devices mounted to the first region of the support substrate; and a bending portion bent between the first region and the second region, wherein the bending portion comprises: an interconnection line arrangement portion that crosses an interconnection line; and an interconnection line protection portion disposed on the periphery of the interconnection line, wherein the interconnection line protection portion protrudes more than the interconnection line arrangement portion.

Abstract: Provided are a heat radiation printed circuit board and a method of manufacturing the same, the heat radiation printed circuit board being produced by the method including: forming a circuit layer having an insulating layer, a circuit pattern and a solder resist on a first area of one surface of a metal substrate; and forming a bending part in a second area, in which the insulating layer is not formed, by bending the metal substrate, whereby a crack can be prevented in advance from being generated in the insulating layer, and durability and reliability of the heat radiation printed circuit board and a backlight unit applying the same can be improved.

Abstract: Provided are a circuit board for irradiating light to a light guide plate and a flat panel display having a structure for efficiently fixing the circuit board and the light guide plate, the circuit board, including: a support substrate comprising a first area and a second area, the second area being bent from the first area; a plurality of light emitting device mounting parts disposed in the first area; and a protective member connecting part of an outer side of the plurality of light emitting device mounting parts.

Abstract: Provided is a circuit board including: a supporting substrate; light emitting elements mounted to the supporting substrate; a through hole passing through the supporting substrate; and a connector inserted into the through hole and for supplying an electric current to the light emitting elements.

Abstract: Provided is a printed circuit board, comprising: a supporting substrate including a first region and a second region extending to be bent from the first region; an insulating substrate above the supporting substrate; a bending portion bent between the first region and the second region; and an adhesive layer between the supporting substrate and the insulating substrate and except for the bending portion.

Abstract: Provided is a lighting device, including: a circuit board in which light emitting elements are mounted to one surface of a supporting substrate; a substrate housing disposed to be spaced apart from another surface opposite to the one surface of the supporting substrate; and a distance regulating portion formed between the circuit board and the substrate housing to adjust a spaced distance between the circuit board and the substrate housing according to movement of the circuit board, wherein the distance regulating portion functions to fix the circuit board to the substrate housing via a fixing element formed in the circuit board and the substrate housing.

Abstract: A method for fabricating a semiconductor device, including forming gate patterns over a substrate, forming conductive layer covering top and sidewalls of each gate pattern, forming a metal layer for a silicidation process over the conductive layer, and silicifying the conductive layer and the gate patterns using the metal layer.

Abstract: A method for fabricating a semiconductor device includes supplying a first source gas including a germanium (Ge) precursor onto a semiconductor substrate for a first time period, and periodically interrupting the supplying of the first source gas for the first time period to form Ge elements on the semiconductor substrate.