Abstract: A system and method are provided. The system includes a data reader having a processor for performing a signal frequency analysis, an ultrasound transmitter for transmitting ultrasound signals, and an ultrasound receiver for receiving reflected ultrasound signals. The system further includes a movable reflector for receiving the ultrasound signals and reflecting the ultrasounds signals back to the receiver (a) as the reflected ultrasound signals without modulation when the reflector is stationary and (b) as the reflected ultrasound signals with modulation when the reflector is mobile. The system also includes a chip for storing a specification of motion states for the reflector. The processor performs the signal frequency analysis to detect a presence or an absence of modulated frequency components in a received ultrasound signal and outputs a first value or a second value respectively depending upon whether the presence or the absence of the modulated frequency components is detected.

Abstract: A wearable monitoring system includes a microelectromechanical (MEMS) microphone to receive acoustic signal data through skin of a user. An integrated circuit chip is bonded to and electrically connected to the MEMS microphone. A portable power source is connected to at least the integrated circuit chip. A flexible substrate is configured to encapsulate and affix the MEMS microphone and the integrated circuit chip to the skin of the user.

Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The release layer comprises at least one additive that adjusts a frequency of electro-magnetic radiation absorption property of the release layer. The additive comprises, for example, a 355 nm chemical absorber and/or chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The the at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.

Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The the at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.

Abstract: A method of forming an electrical device is provided that includes forming microprocessor devices on a microprocessor die; forming memory devices on an memory device die; forming component devices on a component die; and forming a plurality of packing devices on a packaging die. Transferring a plurality of each of said microprocessor devices, memory devices, component devices and packaging components to a supporting substrate, wherein the packaging components electrically interconnect the memory devices, component devices and microprocessor devices in individualized groups. Sectioning the supporting substrate to provide said individualized groups of memory devices, component devices and microprocessor devices that are interconnected by a packaging component.

Abstract: A thermal tag for activity monitoring. The thermal tag includes a base layer having a plurality of metal lines to provide a conductive path, and a pattern layer having one or more infrared emitting features positioned over portions of the conductive path, wherein at least one infrared emitting feature couples to the conductive path to emit a predetermined infrared pattern in accordance with nearby activity.

Abstract: A thermal tag includes a power source to generate current along a resistive path and a plurality of infrared-emitting features positioned along the resistive path to emit infrared light along an infrared-emitting pattern, wherein the plurality of infrared-emitting features include one or more infrared-emitting stripes on a first surface of the thermal tag defining a pattern region and a plurality of infrared-emitting dots within a portion of the pattern region to provide a thermal-diffusion resistant pattern for activity monitoring.

Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The release layer comprises at least one additive that adjusts a frequency of electro-magnetic radiation absorption property of the release layer. The additive comprises, for example, a 355 nm chemical absorber and/or chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.

Abstract: Embodiments include systems, methods, and computer program products for tracking and sensing medical assets. Systems include a plurality of long range transmitters. Systems also include a medical asset box including a medical asset, a radio frequency ID microchip in proximity to the medical asset, and an extended antenna that is capable of receiving a signal from the radio frequency ID microchip and transmitting the signal to an external device.

Abstract: A multi-layer wafer and method of manufacturing such wafer are provided. The method comprises creating under bump metallization (UMB) pads on each of the two heterogeneous wafers; applying a conductive means above the UMB pads on at least one of the two heterogeneous wafers; and low temperature bonding the two heterogeneous wafers to adhere the UMB pads together via the conductive means. At least one stress compensating polymer layer may be applied to at least one of two heterogeneous wafers. The multi-layer wafer comprises two heterogeneous wafers, each of the heterogeneous wafer having UMB pads and at least one of the heterogeneous wafers having a stress compensating polymer layer and a conductive means applied above the UMB pads on at least one of the two heterogeneous wafers. The two heterogeneous wafers low temperature bonded together to adhere the UMB pads together via the conductive means.

Abstract: A multi-layer wafer and method of manufacturing such wafer are provided. The method comprises applying a stress compensating oxide layer to each of two heterogeneous wafers, applying at least one bonding oxide layer to at least one of the two heterogeneous wafers, chemical-mechanical polishing the at least one bonding oxide layer, and low temperature bonding the two heterogeneous wafers to form a multi-layer wafer pair. The multi-layer wafer comprises two heterogeneous wafers, each of the heterogeneous wafers having a stress compensating oxide layer and at least one bonding oxide layer applied to at least one of the two heterogeneous wafers. The two heterogeneous wafers are low temperature bonded together to form the multi-layer wafer.

Abstract: A multi-layer wafer and method of manufacturing such wafer are provided. The method comprises applying at least one stress compensating polymer layer to at least one of two heterogeneous wafers and low temperature bonding the two heterogeneous wafers to bond the stress compensating polymer layer to the other of the two heterogeneous wafers to form a multi-layer wafer pair. The multi-layer wafer comprises two heterogeneous wafers, at least one of the heterogeneous wafers having a stress compensating polymer layer. The two heterogeneous wafers are low temperature bonded together to bond the stress compensating polymer layer to the other of the two heterogeneous wafers.

Abstract: An adhesive bonding method that includes bonding a handling wafer to a front side surface of a device wafer with an adhesive comprising N-substituted maleimide copolymers. The device wafer may then be thinned from the backside surface of the device wafer while the device wafer is adhesively engaged to the handling wafer. The adhesive can then be removed by laser debonding, wherein the device wafer is separated from the handling wafer.

Abstract: Wireless communication is established between electronic devices by an initiating device transmitting a wireless communication request to a peripheral device; the initiating device detecting a visible electromagnetic pattern displayed on the peripheral device in response to the wireless communication request; the initiating device decoding the visible electromagnetic pattern to generate a passcode; and the initiating device echoing the passcode to the peripheral device to authenticate the wireless communication request without user intervention.

Abstract: A wearable monitoring system includes a microelectromechanical (MEMS) microphone to receive acoustic signal data through skin of a user. An integrated circuit chip is bonded to and electrically connected to the MEMS microphone. A portable power source is connected to at least the integrated circuit chip. A flexible substrate is configured to encapsulate and affix the MEMS microphone and the integrated circuit chip to the skin of the user.

Abstract: A random number signal generator used for performing dropout or weight initialization for a node in a neural network. The random number signal generator includes a transistor which generates a random noise signal. The transistor includes a substrate, source and drain regions formed in the substrate, a first insulating layer formed over a channel of the transistor, a first trapping layer formed over the first insulating layer, a second insulating layer formed over the first trapping layer, and a second trapping layer formed over the second insulating layer. One or more traps in the first and second trapping layers are configured to capture or release one or more carriers flowing through the channel region. The random noise signal is generated as a function of one or more carrier being captured or released by the one or more traps.

Abstract: A method, system and computer program product are disclosed that comprise capturing first image data of a person's face using at least one sensor responsive in a band of infrared wavelengths and capturing second image data of the person's face using the at least one sensor responsive in a band of visible wavelengths; extracting image features in the image data and detecting face regions; applying a similarity analysis to image feature edge maps extracted from the first and the second image data; and recognizing a presence of a live face image after regions found in the first image data pass a facial features classifier. Upon recognizing the presence of the live face image, additional operations can include verifying the identity of the person as an authorized person and granting the person access to a resource.

Abstract: A method, system and computer program product are disclosed that comprise capturing first image data of a person's face using at least one sensor responsive in a band of infrared wavelengths and capturing second image data of the person's face using the at least one sensor responsive in a band of visible wavelengths; extracting image features in the image data and detecting face regions; applying a similarity analysis to image feature edge maps extracted from the first and the second image data; and recognizing a presence of a live face image after regions found in the first image data pass a facial features classifier. Upon recognizing the presence of the live face image, additional operations can include verifying the identity of the person as an authorized person and granting the person access to a resource.

Abstract: Methods and systems for activity monitoring include capturing an infrared image of an environment that comprises at least one patient being monitored and at least one infrared-emitting tag. A relationship between the patient being monitored and the at least one infrared-emitting tag is determined. An activity conducted by the patient being monitored is determined based on the relationship between the patient being monitored and the at least one infrared-emitting tag. A course of treatment for the patient being monitored is adjusted based on the determined activity.

Abstract: An adhesive bonding method that includes bonding a handling wafer to a front side surface of a device wafer with an adhesive comprising N-substituted maleimide copolymers. The device wafer may then be thinned from the backside surface of the device wafer while the device wafer is adhesively engaged to the handling wafer. The adhesive can then be removed by laser debonding, wherein the device wafer is separated from the handling wafer.