Abstract: Peptides having four to six amino acid residues are disclosed that possess biological activity. These peptides constitute short fragments of the peptide HB-107 (MPKEKVFLKIEKMGRNIRN) (SEQ ID NO: 10), which itself is a fragment of the antimicrobial protein cecropin B, and exhibit cell stimulatory and migratory properties. The inventive peptides comprise four to six contiguous amino acid residues located between position 11 and 16 of HB107 (MPKEKVFLKIEKMGRNIRN) (SEQ ID NO: 10), namely EKMGRN (SEQ ID NO: 1). The disclosed peptides comprise a useful agent for the medical treatment of injury to the skin, such as from diabetic ulcers. The peptides also are effective in preventing and reversing skin surface damage resulting from various environmental insults. Importantly, the therapeutic effects of the peptides manifest at concentrations equal to or greater than those of peptide HB-107 (SEQ ID NO: 10), and thus represent a less expensive, more versatile means for developing effective therapies.

Abstract: A method of forming a wiring structure for an integrated circuit device includes forming a first metal line within an interlevel dielectric (ILD) layer, and forming a second metal line in the ILD layer adjacent the first metal line; masking selected regions of the first and second metal lines; selectively plating metal cap regions over exposed regions of the first and second metal lines at periodic intervals such that a spacing between adjacent metal cap regions of an individual metal line corresponds to a critical length, L, at which a back stress gradient balances an electromigration force in the individual metal line, so as to suppress mass transport of electrons; and wherein the metal cap regions of the first metal line are formed at staggered locations with respect to the metal cap regions of the second metal line, along a common longitudinal axis.

Abstract: An method including forming a back end of the line (BEOL) wiring portion directly on top of a semiconductor base portion, the BEOL wiring portion including a plurality of layers of a metallic material and a dielectric material and excluding a semiconductor material, forming a through-substrate via through the BEOL wiring portion and the semiconductor base portion, forming an electronic fuse in the BEOL wiring portion adjacent to the through-substrate via, and forming a guard ring in the BEOL wiring portion surrounding the through-substrate via and the electronic fuse in the BEOL wiring portion, the through-substrate via in the semiconductor base portion being free from the guard ring.

Abstract: A structure for TDDB measurement, a method determining TDDB at reduced spacings. The structure includes an upper dielectric layer on a top surface of a lower dielectric layer, a bottom surface of the upper dielectric layer and the top surface of the lower dielectric layer defining an interface; a first wire formed in the lower dielectric layer; a second wire formed in the upper dielectric layer; and wherein a distance between the first wire and the second wire measured in a direction parallel to the interface is below the lithographic resolution limit of the fabrication technology.

Abstract: The invention relates to small molecules having biological and therapeutic activity. Particularly, the invention relates to small molecules having lipolytic and anti-adipogenic activity. Two examples of such molecules are 4-methyl-2-(octanoylamino) pentanoic acid and N-isopentyloctanamide. The invention further relates to methods of preventing or treating skin conditions such as cellulite using small molecules having lipolytic and anti-adipogenic activity.

Abstract: Peptides having four to six amino acid residues are disclosed that possess biological activity. These peptides constitute short fragments of the peptide HB-107 (MPKEKVFLKIEKMGRNIRN) (SEQ ID NO: 10), which itself is a fragment of the antimicrobial protein cecropin B, and exhibit cell stimulatory and migratory properties. The inventive peptides comprise four to six contiguous amino acid residues located between position 11 and 16 of HB107 (MPKEKVFLKIEKMGRNIRN) (SEQ ID NO: 10), namely EKMGRN (SEQ ID NO: 1). The disclosed peptides comprise a useful agent for the medical treatment of injury to the skin, such as from diabetic ulcers. The peptides also are effective in preventing and reversing skin surface damage resulting from various environmental insults. Importantly, the therapeutic effects of the peptides manifest at concentrations equal to or greater than those of peptide HB-107 (SEQ ID NO: 10), and thus represent a less expensive, more versatile means for developing effective therapies.

Abstract: The present invention relates generally to flip chip technology and more particularly, to a method and structure for fabricating a mechanically anchored controlled collapse chip connection (C4) pad on a semiconductor structure. In an embodiment, a method is disclosed that may include forming a bonding pad having one or more anchor regions that extend into a semiconductor structure and may inhibit the bonding pad from physically separating from the TSV during temperature fluctuations.

Abstract: Short biologically active tetrapeptides are disclosed that are comprised of the sequences GxxG and PxxP where G (glycine) and P (proline) are maintained and x is a variable amino acid. The peptides can be used singly or in combination to stimulate production of extracellular matrix proteins in skin. A rapid, low-cost method of producing heterogenous formulations of tetrapeptides is disclosed.

Abstract: A method of forming a wiring structure for an integrated circuit device includes forming a first metal line within an interlevel dielectric (ILD) layer, and forming a second metal line in the ILD layer adjacent the first metal line; masking selected regions of the first and second metal lines; selectively plating metal cap regions over exposed regions of the first and second metal lines at periodic intervals such that a spacing between adjacent metal cap regions of an individual metal line corresponds to a critical length, L, at which a back stress gradient balances an electromigration force in the individual metal line, so as to suppress mass transport of electrons; and wherein the metal cap regions of the first metal line are formed at staggered locations with respect to the metal cap regions of the second metal line, along a common longitudinal axis.

Abstract: Tetrapeptides consisting of (I or V)-X1-K-X2, where X1 can be selected from E, Q or K, and X2 can be selected from M, F, I, W, or V, exhibit diverse bioactivities. They are multi-functional effector molecules to stimulate keratinocytes migration; neutralize the proinflammatory effect of bacterial cell wall components such as lipoteichoic acids of the Gram-positive S. aureus; and induce angiogenesis in cultured human umbilical vein endothelial cells. The downregulation of pro-inflammatory condition was also demonstrated using SOR-300-FT psoriasis skin model for representative peptide. The bioactivity was also supported by gene profiling study upon treatment of normal skin tissues using EPIDERM™ skin substitutes.

Abstract: The present disclosure generally provides for integrated circuit (IC) structures with through-semiconductor vias (TSV). In an embodiment, an IC structure may include a through-semiconductor via (TSV) embedded in a substrate, the TSV having a cap; a dielectric layer adjacent to the substrate; a metal layer adjacent to the dielectric layer; a plurality of vias each embedded within the dielectric layer and coupling the metal layer to the cap of the TSV at respective contact points, wherein the plurality of vias is configured to create a substantially uniform current density throughout the TSV.

Abstract: The present disclosure generally provides for an integrated circuit (IC) structure with a TSV, and methods of manufacturing the IC structure and the TSV. An IC structure according to embodiments of the present invention may include a through-semiconductor via (TSV) embedded within a substrate, the TSV having an axial end; and a metal cap contacting the axial end of the TSV, wherein the metal cap has a greater electrical resistivity than the TSV.

Abstract: An e-fuse structure including a fuse link having a first region made of a first conductor and a second region made of a second conductor. The first conductor and the second conductor are in the same wiring level. The first conductor has a higher electrical resistance than the second conductor. The first conductor has a higher resistance to electromigration than the second conductor. The first region and the second region have a common width. The length of the first region is longer than the length of the second region.

Abstract: An method including forming a back end of the line (BEOL) wiring portion directly on top of a semiconductor base portion, the BEOL wiring portion including a plurality of layers of a metallic material and a dielectric material and excluding a semiconductor material, forming a through-substrate via through the BEOL wiring portion and the semiconductor base portion, forming an electronic fuse in the BEOL wiring portion adjacent to the through-substrate via, and forming a guard ring in the BEOL wiring portion surrounding the through-substrate via and the electronic fuse in the BEOL wiring portion, the through-substrate via in the semiconductor base portion being free from the guard ring.

Abstract: Disclosed are peptides having biological and therapeutic activity. Particularly disclosed are lipidated di- or tri-peptides analogs of KPV or KdPT that exhibit antimicrobial activity. In particular, the peptides of this invention provide enhanced anti-microbial activity over the base tri-peptides, lysine-proline-valine and lysine-d-proline-tyrosine. The disclosed peptides have the general formula of C12-18 lipid-KXZ-NH2i wherein K is lysine; X is proline, d-proline, histidine or arginine; Z is optional and if present Z is valine, threonine, alanine or leucine; and the terminal COOH is NH2 amidated. The C12-18 lipid is preferably the lipid moiety of lauric acid (C12), myristic acid (C14), pentadecanoic acid (C15), palmitic acid (C16), or stearic acid (C18). The invention is further related to methods of using of these peptides to treat various insults, inflammations or bacterial infections affecting the skin and other related mucosal body surfaces such as the oral cavity.

Abstract: A structure, such as a wafer, chip, IC, design structure, etc., includes a through silicon via (TSV) and an electromigration (EM) monitor. The TSV extends completely through a semiconductor chip and the EM monitor includes a plurality of EM wires proximately arranged about the TSV perimeter. An EM testing method includes forcing electrical current through EM monitor wiring arranged in close proximity to the perimeter of the TSV, measuring an electrical resistance drop across the EM monitor wiring, determining if an electrical short exists between the EM monitor wiring and the TSV from the measured electrical resistance, and/or determining if an early electrical open or resistance increase exists within the EM monitoring wiring due to TSV induced proximity effect.

Abstract: Peptides having four to six amino acid residues are disclosed that possess biological activity. These peptides constitute short fragments of the peptide HB-107 (MPKEKVFLKIEKMGRNIRN), which itself is a fragment of the antimicrobial protein cecropin B, and exhibit cell stimulatory and migratory properties. The inventive peptides comprise four to six contiguous amino acid residues located between position 11 and 16 of HB107 (MPKEKVFLKIEKMGRNIRN), namely EKMGRN. The disclosed peptides comprise a useful agent for the medical treatment of injury to the skin, such as from diabetic ulcers. The peptides also are effective in preventing and reversing skin surface damage resulting from various environmental insults Importantly, the therapeutic effects of the peptides manifest at concentrations equal to or greater than those of peptide HB-107, and thus represent a less expensive, more versatile means for developing effective therapies. Methods for the production and use of these peptides are also disclosed.

Abstract: A method of forming a wiring structure for an integrated circuit device includes forming a first metal line within an interlevel dielectric (ILD) layer, and forming a second metal line in the ILD layer adjacent the first metal line; masking selected regions of the first and second metal lines; selectively plating metal cap regions over exposed regions of the first and second metal lines at periodic intervals such that a spacing between adjacent metal cap regions of an individual metal line corresponds to a critical length, L, at which a back stress gradient balances an electromigration force in the individual metal line, so as to suppress mass transport of electrons; and wherein the metal cap regions of the first metal line are formed at staggered locations with respect to the metal cap regions of the second metal line, along a common longitudinal axis.

Abstract: A method of forming a wiring structure for an integrated circuit device includes forming a first metal line within an interlevel dielectric (ILD) layer, and forming a second metal line in the ILD layer adjacent the first metal line; masking selected regions of the first and second metal lines; selectively plating metal cap regions over exposed regions of the first and second metal lines at periodic intervals such that a spacing between adjacent metal cap regions of an individual metal line corresponds to a critical length, L, at which a back stress gradient balances an electromigration force in the individual metal line, so as to suppress mass transport of electrons; and wherein the metal cap regions of the first metal line are formed at staggered locations with respect to the metal cap regions of the second metal line, along a common longitudinal axis.

Abstract: The present invention relates generally to flip chip technology and more particularly, to a method and structure for fabricating a mechanically anchored controlled collapse chip connection (C4) pad on a semiconductor structure. In an embodiment, a method is disclosed that may include forming a bonding pad having one or more anchor regions that extend into a semiconductor structure and may inhibit the bonding pad from physically separating from the TSV during temperature fluctuations.