Abstract: A vehicular combined control system has functions of a smart entry system and a TPMS. A smart ECU turns on the output of a voltage signal terminal intermittently or in response to a given trigger. When the output of the voltage signal terminal turns on, a RF receiver section receives information from a portable device regardless of the ON/OFF state of an ignition switch to transmit the information to the smart ECU. When the ignition switch is ON and the output of the voltage signal terminal turns off, the RF receiver section receives information from tire sensors to transmit the information to a TPMS microcomputer.

Abstract: In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated through hole, a solder layer containing tin and zinc as main components is formed on the surfaces of the land through hole by a HAL treatment. The lead terminal is inserted and mounted in the through hole. The printed wiring board is brought into contact with jet flows of a solder containing tin and zinc as the main components to thereby supply a solder to the land and through hole.

Abstract: A vehicle remote control system includes a portable device for transmitting a control request command and an in-vehicle device for executing various kinds of vehicle control in accordance with the control request command. During execution of the control by the in-vehicle device, the portable device is set to a standby state under which a UHF transmitter and a UHF receiver are put in a standby or rest state, thereby reducing power consumption. After a standby time elapses, the portable device repeats request command transmission and reply reception until a reply is received from the in-vehicle device.

Abstract: An electronic key system includes an in-vehicle unit mounted in a vehicle and a portable unit. When a user leaves the vehicle, the in-vehicle unit requests information on a relative position of the vehicle relative to a landmark object near the vehicle from a vehicle navigation device and transmits received relative position information to the portable unit. The portable unit stores the received relative position information, and notifies of the stored relative position information according to a user's operation.

Abstract: An in-vehicle device notifies a mobile device of a frequency channel which has been stored in its memory unit, and sets the notified channel to a reception channel. The mobile device transmits a reply signal through the channel notified from the in-vehicle device. When the in-vehicle device determines that a code included in the received reply signal is identical with a code specific to a vehicle, the in-vehicle device stores the channel used for receiving the reply signal in its memory unit. As a result, each communication is conducted through the same channel, which enabled the successful communication previously, thereby enhancing the certainty of communication.

Abstract: When a door locking operation is conducted in a vehicle, an in-vehicle device executes a vehicle compartment checking to check whether a mobile unit exists in the vehicle compartment. When the in-vehicle device receives a response from the mobile unit, the in-vehicle device transmits a search signal to the mobile unit, prohibits the door locking, and activates a buzzer, etc. The mobile unit can be prevented from being blocked in a vehicle compartment. When the mobile unit receives the search signal, it blows the buzzer, thereby making it possible to indicate the location of its existence.

Abstract: A mobile unit for an electronic key system includes an LF receiver unit that receives a radio signal transmitted from an in-vehicle device by an electric wave of an LF band, a UHF transmitter unit that transmits a radio signal to the in-vehicle unit by an electric wave of a UHF band. The mobile unit also includes a UHF receiver unit that receives a search signal transmitted from another mobile unit by an electric wave of the UHF band, and a buzzer that notifies outside existence thereof when the search signal is received by the UHF receiver unit. The UHF transmitter unit can transmit the search signal to the mobile unit in addition to the radio signal to the in-vehicle device.

Abstract: A probe unit comprises a substrate and a lead formed on the substrate and having a tip part projecting from an edge of the substrate and contacting to an electrode of a sample, and a thick part of which thickness is thicker than the tip part. The probe unit can make continuity with a sample firmly with a proper contact pressure while lowering electrical resistance of leads.

Abstract: A dust filter of an evaporated fuel treatment device is taught that preferably include a filtration member for filtering air introduced to an atmosphere introduction path, and a casing receiving the filtration member therein. The dust filter being disposed on the atmosphere introduction path of the evaporated fuel treatment device. The filtration member has an arcuate shape in cross section, and wherein the filtration member is arranged and structured such that air flows in a radial direction thereof, so as to be filtered.

Abstract: When a demodulated signal of a radio signal in Ch1 transmitted from a TPMS transmitter is acquired, a control IC controls the frequency of a signal inputted from a PLL circuit to a mixer into a frequency for converting a TPMS radio signal into an intermediate frequency signal of a specific frequency. When the demodulated signal of the radio signal transmitted from a portable unit through two frequency channels is acquired, the control IC determines a channel whose state of communication is favorable from between Ch2 and Ch3, and controls the signal frequency for conversion into a frequency for converting a keyless radio signal in the determined channel into an intermediate frequency signal.

Abstract: A vehicle communication system has a receiving unit on a vehicle side for inputting a demodulated analog signal to determination units based on a received radio signal from a key unit. Then, one of the two determination units outputs a high-check signal that takes a high value when the analog signal is greater than a high threshold and the other determination unit outputs a low-check signal that takes a low value when the analog signal is smaller than a low threshold. Then, a sync. signal generator successively defines a determination period based on the high and low check signals. Then, a binary level of the analog signal is determined by a level determination unit based on the check signals, along with an estimation and a correction of an indefinite signal when the signal level cannot be determined based on a coding rule and the determination by the determination units.

Abstract: A solder not containing lead (a lead-free solder) contains zinc and tin, and also contains 5 weight percent or less nickel and 0.5 weight percent or less aluminum with a liquid phase temperature of 260 degrees C. or greater. In addition, a lead-free solder has a liquid phase temperature of 260 degrees C. or greater, and contains 30 to 70 weight percent zinc, 5 weight percent or less nickel, and the remaining weight percent tin. Moreover, a joint is manufactured using these lead-free solders. As a result, a lead-free solder and a lead-free joint having excellent electrical characteristics but not including harmful substances, can be provided.

Abstract: In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated through hole, a solder layer containing tin and zinc as main components is formed on the surfaces of the land through hole by a HAL treatment. The lead terminal is inserted and mounted in the through hole. The printed wiring board is brought into contact with jet flows of a solder containing tin and zinc as the main components to thereby supply a solder to the land and through hole.

Abstract: In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated through hole, a solder layer containing tin and zinc as main components is formed on the surfaces of the land through hole by a HAL treatment. The lead terminal is inserted and mounted in the through hole. The printed wiring board is brought into contact with jet flows of a solder containing tin and zinc as the main components to thereby supply a solder to the land and through hole.

Abstract: A probe unit comprises a flexible substrate made of an inorganic substance and having an almost straight edge, an electro conductive film formed on a surface of the substrate and having a plurality of contact parts aligned on a surface of the edge and can contact with electrodes of a sample and lead parts connected to the contact parts, wherein the substrate is elastically deformed together with the contact part while the plurality of the contacts parts are supported by the edge when a force is added to press a surface of the contact part.

Abstract: A sacrificial layer is formed in a recess of a substrate, and leads extending from the substrate into an area of the sacrificial layer are formed. A cut is formed from the bottom surface of the substrate, the cut extending from the bottom surface to the area of the sacrificial layer via the substrate, then the sacrificial layer is removed. A probe unit can be obtained having the leads whose front portions extend beyond the edge of the substrate. A through conductor may be formed in a through hole formed in a substrate. Leads may be formed on a photosensitive etching glass substrate to thereafter selectively etch the chemically cutting type glass.

Abstract: A solder not containing lead (a lead-free solder) contains zinc and tin, and also contains 5 weight percent or less nickel and 0.5 weight percent or less aluminum with a liquid phase temperature of 260 degrees C. or greater. In addition, a lead-free solder has a liquid phase temperature of 260 degrees C. or greater, and contains 30 to 70 weight percent zinc, 5 weight percent or less nickel, and the remaining weight percent tin. Moreover, a joint is manufactured using these lead-free solders. As a result, a lead-free solder and a lead-free joint having excellent electrical characteristics but not including harmful substances, can be provided.

Abstract: A probe unit comprises a substrate and a lead formed on the substrate and having a tip part projecting from an edge of the substrate and contacting to an electrode of a sample, and a thick part of which thickness is thicker than the tip part. The probe unit can make continuity with a sample firmly with a proper contact pressure while lowering electrical resistance of leads.

Abstract: A sacrificial layer is formed in a recess of a substrate, and leads extending from the substrate into an area of the sacrificial layer are formed. A cut is formed from the bottom surface of the substrate, the cut extending from the bottom surface to the area of the sacrificial layer via the substrate, then the sacrificial layer is removed. A probe unit can be obtained having the leads whose front portions extend beyond the edge of the substrate. A through conductor may be formed in a through hole formed in a substrate. Leads may be formed on a photosensitive etching glass substrate to thereafter selectively etch the chemically cutting type glass.

Abstract: A sacrificial layer is formed in a recess of a substrate, and leads extending from the substrate into an area of the sacrificial layer are formed. A cut is formed from the bottom surface of the substrate, the cut extending from the bottom surface to the area of the sacrificial layer via the substrate, then the sacrificial layer is removed. A probe unit can be obtained having the leads whose front portions extend beyond the edge of the substrate. A through conductor may be formed in a through hole formed in a substrate. Leads may be formed on a photosensitive etching glass substrate to thereafter selectively etch the chemically cutting type glass.